Halogen-free rosin-free cleaning-free solvent type soldering flux

Abstract

The invention discloses a halogen-free rosin-free cleaning-free solvent type soldering flux. The halogen-free rosin-free cleaning-free solvent type soldering flux comprises the following components inpercentages by mass: 1.3%-6% of an active agent, 0.05%-0.17% of a surfactant, 0.05%-1.5% of an antioxidant, 0.05%-0.5% of a corrosion inhibitor, 0.1%-1% of a brightener, 0%-1.5% of a foaming agent and the balance of a solvent, and the total mass of all the components is 100%. The soldering flux disclosed by the invention has no halide, no toxicity and no pungent smell, and does not harm human bodies and the natural environment, and corrosion to a circuit board is greatly reduced; the activity is high, a soldering assisting effect of the soldering flux is obvious, the wettability is good, welding spots are full and free of retraction and tin explosion, the soldering flux is suitable for being packaged at high level of integration, and other auxiliary equipment is not required; the surfaceof the circuit board has seldom residue, the welding spots are attractive and bright, and a cleaning process does not need to be introduced; and the soldering flux is good in universality and is usedfor Sn-Ag, Sn-Cu series or low-silver lead-free solder alloys.

Description

technical field [0001] The invention relates to the field of chemical substances used in the technical field of electronic packaging, in particular to a halogen-free, rosin-free, no-clean solvent-type flux. Background technique [0002] With the miniaturization, high density and multi-dimensional development of electronic products, the packaging requirements of products are becoming higher and higher. In the field of electronic packaging, due to the differences in the performance of fluxes, the selection of fluxes will also determine the entire product. lifespan. Traditional rosin-based fluxes are about to be withdrawn from the market. On the one hand, the residues of traditional fluxes adhere to the surface of solder joints after soldering, which makes the surface of solder joints dull. It also causes problems such as the decline in electrical insulation performance and short circuits of electronic products, resulting in the failure of some functions of the products. Even ...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the deficiencies of the above-mentioned technologies, the present invention invents a high-efficiency no-cleaning solvent-based flux, which has an obvious fluxing effect, does not contain halogens, does not contain rosin, has a wide range of applications, good compatibility, and has perfect solder joints without shrinkage. There is no need to introduce a cleaning process afterwards, which solves the shortcomings of existing fluxes such as poor wettability, more post-soldering residues, severe solder joint corrosion, and high cost.