Nano niobium aluminum yttrium nitride/amorphous silicon nitride dual-phase ultra-hard coating and a deposition method thereof
A technology of niobium aluminum yttrium nitride and crystalline silicon nitride, which is applied in coating, metal material coating process, ion implantation plating, etc., can solve the problem of weakening of dual-phase interface, low stability of Nb-Si-N solid solution, Weaken problems such as valence bond strength to achieve good heat resistance
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Embodiment 1
[0021] Carbide PCB micro-drill, with a shank diameter of 3.175mm and a blade diameter of 0.2mm, is loaded into the coating furnace after degreasing, organic solvent cleaning, deionized water rinsing, and drying. Vacuum to 1.0×10 -3 Below Pa, the temperature is kept at 200±5℃. The first step is to perform gas plasma cleaning on the workpiece substrate: Ar and H are introduced into the gas ion source 2 , the partial pressure is 0.2Pa and 0.1Pa respectively, the ion source current is 5A, the workpiece is applied with pulse negative bias voltage, the frequency is 80KHz, the peak value is 100V, the duty cycle is 90%, and the workpiece is plasma cleaned for 30min. The second step is to perform arc plasma cleaning on the workpiece: turn off the gas ion source, adjust the pulse negative bias to a frequency of 80KHz, a peak value of 700V, a duty cycle of 30%, Ar and H 2 The partial pressure was adjusted to 0.1Pa and 0.05Pa, the arc ion plating Nb target was turned on, the arc source ...
Embodiment 2
[0023] Carbide PCB micro-drill, with a shank diameter of 3.175mm and a blade diameter of 0.35mm, is loaded into the coating furnace after degreasing, organic solvent cleaning, deionized water rinsing, and drying. Vacuum to 1.0×10 -3 Below Pa, the temperature is kept at 200±5℃. The first step is to perform gas plasma cleaning on the workpiece substrate: Ar and H are introduced into the gas ion source 2 , the partial pressure is 0.2Pa and 0.1Pa respectively, the ion source current is 5A, the workpiece is applied with pulse negative bias voltage, the frequency is 80KHz, the peak value is 150V, the duty cycle is 90%, and the workpiece is plasma cleaned for 30min. The second step is to perform arc plasma cleaning on the workpiece: turn off the gas ion source, adjust the pulse negative bias to a frequency of 80KHz, a peak value of 800V, a duty cycle of 30%, Ar and H 2 The partial pressure was adjusted to 0.1Pa and 0.05Pa, the arc ion plating Nb target was turned on, the arc source...
Embodiment 3
[0025] Carbide PCB milling cutter, with a shank diameter of 3.175mm and a blade diameter of 1.2mm, is loaded into the coating furnace after degreasing, organic solvent cleaning, deionized water rinsing, and drying. Vacuum to 1.5×10 -3 Below Pa, the temperature is kept at 250±5℃. The first step is to perform gas plasma cleaning on the workpiece substrate: Ar and H are introduced into the gas ion source 2 , the partial pressures are 0.2Pa and 0.1Pa respectively, the ion source current is 8A, the workpiece is applied with pulse negative bias, the frequency is 80KHz, the peak value is 200V, and the duty cycle is 90%, and the workpiece is plasma cleaned for 30min. The second step is to perform arc plasma cleaning on the workpiece: turn off the gas ion source, adjust the pulse negative bias to a frequency of 80KHz, a peak value of 1000V, a duty cycle of 30%, Ar and H 2 The partial pressure was adjusted to 0.1Pa and 0.05Pa, the arc ion plating Nb target was turned on, the arc sourc...
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