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Preparation method of copper-silver micro-nano composite layer material

A micro-nano, composite layer technology, applied in the field of electrochemistry, can solve problems such as product shape and area limitation, and achieve the effects of low manufacturing cost, large surface area, and simple process

Inactive Publication Date: 2019-10-08
广东工业大学华立学院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The structure / size of the template method is limited by the template, and the shape and area of ​​the product are limited

Method used

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  • Preparation method of copper-silver micro-nano composite layer material
  • Preparation method of copper-silver micro-nano composite layer material
  • Preparation method of copper-silver micro-nano composite layer material

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Embodiment 1

[0029] As a method for preparing a copper-silver micro-nano composite layer material according to an embodiment of the present invention, the method comprises the following steps:

[0030] (1) Provide C194 copper alloy as the substrate with a thickness of 0.25mm and a size of 50mm×70mm, and the current density of the substrate is 5A / dm 2 Electrodegreasing for 60s, then pickling in 10% sulfuric acid for 30s, and then in 0.2g / L PdCl 2 Activation in solution for 60s;

[0031] (2) Submerge the base material treated in step (1) in the copper needle layer plating solution at 65° C. to electroless deposit the copper needle layer, wherein the copper needle layer plating solution consists of 0.06mol / L copper sulfate, 0.013mol / L nickel sulfate, 0.48mol / L boric acid, 0.28mol / L sodium hypophosphite, 0.09mol / L trisodium citrate, 1g / L polyethylene glycol and sodium hydroxide, hydrogen Sodium oxide is used to adjust the pH of the copper needle layer plating solution to be 9.0-9.5;

[0032...

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Abstract

The invention provides a preparation method of a copper-silver micro-nano composite layer material. The method comprises the following steps that (1) a substrate is provided, and electrolytic degreasing, acid pickling and PdCl2 solution activation are performed on the substrate in sequence; (2) the substrate treated in the step (1) is plated with a copper needle layer in a copper needle layer plating solution of 60-70 DEG C in a chemical deposition mode; (3) after being cleaned with deionized water, the substrate plated with the copper needle layer in the step (2) is plated with a silver layerin a silver layer plating solution under the room temperature in a chemical deposition mode; and (4) the substrate plated with the silver layer in the step (3) is cleaned with deionized water and then dried. According to the method provided by the invention, by improving the formulas of the copper needle plating solution and the silver layer plating solution used for preparing the chemical copper-silver plated micro-nano layer material, the copper-silver micro-nano microscopic crystal unit growth form and size can be controlled without needing special templates. The method provided by the invention can be implemented on various types of substrates and is not limited by the sizes and shapes of the substrates, the process is simple, investment is small, and the manufacturing cost is low.

Description

technical field [0001] The invention belongs to the field of electrochemistry, and in particular relates to a method for preparing a copper-silver micro-nano composite layer material. Background technique [0002] Copper and copper alloys are widely used in semiconductor interconnection materials because of their good electromigration resistance, high electrical conductivity and thermal conductivity. However, copper has good oxophilicity and is easily oxidized, which affects the reliability of device performance. Studies have shown that copper with a highly hydrophobic surface has greatly reduced corrosion resistance due to its special microstructure. Therefore, the oxidation and corrosion resistance of copper is a big challenge. As a basic engineering material, silver has excellent oxidation resistance. Compared with copper, electrodeposited copper (silver) film will be used as an alternative material for interconnection materials in electronic components in the future. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40C23C18/44C23C18/18B82Y40/00
CPCB82Y40/00C23C18/1844C23C18/40C23C18/44
Inventor 肖金翟倩屈福康田小玲
Owner 广东工业大学华立学院
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