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Low-dielectric and low-dielectric-loss halogen-free resin composition, prepreg and laminated board

A resin composition and resin composition technology are applied in chemical instruments and methods, electronic equipment, layered products, etc., which can solve problems such as the decline of dielectric properties, and achieve low dielectric loss, reduced dielectric constant, and high vitrification. Effect of transition temperature

Inactive Publication Date: 2019-07-30
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the rigid structure of POSS itself and the asymmetry of monofunctional modification, the dielectric properties of the entire system have declined.

Method used

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  • Low-dielectric and low-dielectric-loss halogen-free resin composition, prepreg and laminated board
  • Low-dielectric and low-dielectric-loss halogen-free resin composition, prepreg and laminated board
  • Low-dielectric and low-dielectric-loss halogen-free resin composition, prepreg and laminated board

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042]Take epoxy resin 1: 30 parts by weight, epoxy resin 2: 30 parts by weight, epoxy resin 3: 20 parts by weight, epoxy resin 4: 20 parts by weight, double deck POSS: 40 parts by weight, benzoxazine resin (BZ): 20 parts by weight, polyphenylene oxide (PPO): 30 parts by weight, dimethylaminopyridine (DMAP): 0.15 parts by weight, phosphorus-containing flame retardant: 15 parts by weight, cobalt acetylacetonate: 0.04 parts by weight, used The organic solvent is dissolved, the solid content of the resin composition is adjusted to 65 wt%, and the prepreg is prepared in a container equipped with a stirrer and a condenser at room temperature.

[0043] The halogen-free resin composition is impregnated and coated on E-type glass cloth (2116, unit weight 105 ± 3g / m 2 ) and baked in an oven at 170°C to obtain a prepreg with a resin content of 50%.

[0044] The prepared prepreg with a resin content of 50% is placed with a piece of copper foil on the upper and lower sides, and placed in...

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PUM

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Abstract

The invention discloses a low-dielectric and low-dielectric-loss halogen-free resin composition, a prepreg and a laminated board. The halogen-free resin composition is made from, by weight, 100 partsof epoxy resin, 2-45 parts of a double-deck silsesquioxane curing agent, 10-50 parts of cyanate modified polyphenyl ether resin, 10-25 parts of benzoxazine resin, and 0.001-5 parts of an accelerator.A high-Tg resin material excellent in dielectric property is obtained through graft copolymerization of the silsesquioxane curing agent with a special structure, after curing, the resin material has higher molecular stability and lower chain-segment motion ability, and thus the metal clad laminated board prepared from the resin is more excellent in dielectric property, heat resistance, mechanicalproperty and moisture absorption resistance and the like.

Description

technical field [0001] The invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom, and belongs to the field of basic manufacturing of printed circuit boards. Background technique [0002] With the rapid development of science and technology and the continuous deepening of people's awareness of environmental protection and concepts, halogen-free products have become one of the urgent needs of various industries in the world, especially the electronic product industry. Countries around the world and related industry alliances have also successively introduced corresponding policies and regulations, making precise restrictions on the content of halogens in products, especially chlorine and bromine, and restricting products containing elements harmful to life such as lead, mercury, and cadmium. In this situation, the development of new high-performance, environmentally friendly materials has become one of the most critical directions i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/04C08L83/08C08L83/07C08L61/34C08L71/12C08K13/06C08K9/06C08K3/36C08K7/14C08J5/24C08G59/62C08G59/50C08G59/40B32B15/14B32B17/02
CPCB32B15/14B32B2260/021B32B2262/101B32B2307/306B32B2307/3065B32B2307/552B32B2457/08C08G59/4085C08G59/50C08G59/62C08J5/24C08J2363/00C08J2461/34C08J2463/00C08J2471/12C08J2483/04C08J2483/07C08J2483/08C08K3/36C08K7/14C08K9/06C08K13/06
Inventor 田堃盛佳炯彭康沈宗华
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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