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A kind of uv curing thermal viscous adhesive and its preparation method and application

A technology of curing heat and glue, applied in the direction of adhesives, adhesive types, ester copolymer adhesives, etc., can solve the problems of unfavorable processing technology, unfavorable operation, low efficiency, etc., and achieve a large adjustable range of glue thickness, The effect of fast viscosity reduction and high production speed

Active Publication Date: 2021-07-09
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional glass edge sweeping process: the high-viscosity silicone protective film is attached to the glass edge, and the tear film needs to be peeled off manually, and the efficiency is low; while the solvent-based thermal adhesive tape, the temperature of the adhesive is too high (generally 80-100°C ), there are certain risks and hidden dangers to the on-site operation, which is not conducive to operation; at the same time, the heat-adhesive adhesive tape in the prior art still has a certain residual glue phenomenon during the peeling process, which is not conducive to the subsequent processing technology.

Method used

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  • A kind of uv curing thermal viscous adhesive and its preparation method and application
  • A kind of uv curing thermal viscous adhesive and its preparation method and application
  • A kind of uv curing thermal viscous adhesive and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] This embodiment provides a UV-curable heat-relieving adhesive and a UV-curable heat-reducing adhesive tape prepared therefrom. The preparation method specifically includes the following steps:

[0034] S1: Preparation of prepolymer resin:

[0035] Add successively the compound shown in the isooctyl acrylate of 90g, the methacrylate of 10g, and the formula (I) of 0.05g to be placed in the compounding barrel, and polymerize while stirring under the protection of nitrogen to prepare the prepolymer. The viscosity is about 1950cps±50cps;

[0036] S2: Preparation of UV-cured heat-viscosity-reducing adhesive:

[0037] Add 80g of prepolymerized resin prepared in step (S1), 15g of Sanki Chemical Industry 6501, 0.1g of 1,6-hexanediol diacrylate, and 0.05g of 2,2 dimethoxy 2-phenylacetophenone 1. 3g of heat-expandable microspheres are placed in a glue mixing bucket, stirred and dispersed to obtain a UV-curable heat-viscosity-reducing adhesive.

[0038] S3: Preparation of UV-cur...

Embodiment 2

[0041] This embodiment provides a UV-curable heat-relieving adhesive and a UV-curable heat-reducing adhesive tape prepared therefrom. The preparation method specifically includes the following steps:

[0042] S1: Preparation of prepolymer resin:

[0043] Add successively the compound shown in the isooctyl acrylate of 90g, the methacrylate of 10g, and the formula (I) of 0.05g to be placed in the compounding barrel, and polymerize while stirring under the protection of nitrogen to prepare the prepolymer. The viscosity is about 2000cps±50cps;

[0044] S2: Preparation of UV-cured heat-viscosity-reducing adhesive:

[0045] Add 80g of prepolymerized resin prepared in step (S1), 15g of Sanki Chemical Industry 6501, 0.1g of 1,6-hexanediol diacrylate, and 0.05g of 2,2 dimethoxy 2-phenylacetophenone 1. 8g of heat-expandable microspheres were placed in a glue mixing bucket, stirred and dispersed to obtain a UV-curable heat-viscosity-reducing adhesive.

[0046] S3: Preparation of UV-cu...

Embodiment 3

[0049] This embodiment provides a UV-curable heat-relieving adhesive and a UV-curable heat-reducing adhesive tape prepared therefrom. The preparation method specifically includes the following steps:

[0050] S1: Preparation of prepolymer resin:

[0051] Add successively the compound shown in the isooctyl acrylate of 90g, the methacrylate of 10g, and the formula (I) of 0.05g to be placed in the compounding barrel, and polymerize while stirring under the protection of nitrogen to prepare the prepolymer. The viscosity is about 2100cps±30cps;

[0052] S2: Preparation of UV-cured heat-viscosity-reducing adhesive:

[0053] Add 80g of prepolymerized resin prepared in step (S1), 15g of Sartomer CN704, 0.1g of 1,6-hexanediol diacrylate, 0.05g of 2,2 dimethoxy 2-phenyl styrene The ketone and 12g of heat-expandable microspheres were placed in the glue mixing bucket, stirred and dispersed to obtain a UV-curable heat-viscosity-reducing adhesive.

[0054] S3: Preparation of UV-cured hea...

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Abstract

The invention discloses a UV curing thermal viscose-reducing adhesive and its preparation method and application. The adhesive raw material includes pre-polymerized resin, polyurethane acrylate, reactive diluent, photoinitiator, and thermal expansion microspheres; in terms of mass percentage, The raw material of pre-polymerized resin comprises 60-94.5% isooctyl acrylate, 5-39.5% (meth)acrylic acid ester and 0.01-1% compound shown in formula (I), and is made by the reaction of the three; Preparation: firstly prepare the pre-polymerized resin, and then mix it with the remaining raw materials of the glue; and the UV-cured heat-adhesive adhesive tape made of the above-mentioned glue and the application of the above-mentioned tape in the 2.5D and 3D glass edge-sweeping process; the present invention It has excellent initial adhesion, low thermal viscosity-breaking initial temperature, and fast viscosity-breaking speed. The thermal-bonding adhesive tape made of it will not appear powder dust or residual glue during use, and has low VOC , Coating production speed and other advantages.

Description

technical field [0001] The invention belongs to the technical field of glass edge sweeping, and in particular relates to a UV-cured heat-viscosity-reducing adhesive and a preparation method and application thereof. Background technique [0002] Traditional glass edge sweeping process: the high-viscosity silicone protective film is attached to the glass edge, and the tear film needs to be peeled off manually, and the efficiency is low; while the solvent-based thermal adhesive tape, the temperature of the adhesive is too high (generally 80-100°C ), there are certain hidden dangers to on-site operations, which is unfavorable for operation; at the same time, the heat-adhesive adhesive tape in the prior art also has a certain residual glue phenomenon during the peeling process, which is unfavorable for the subsequent processing. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art, and pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/08C09J175/14C09J11/00C09J7/25
Inventor 李阜阳周琪权杨溢芋野昌三陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC
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