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One-component silicone conductive adhesive, and preparation method and application thereof

A technology of silicone and conductive adhesive, applied in the field of conductive adhesive, can solve problems such as inapplicability and failure, and achieve low interface resistance, low cost, and good toughness

Active Publication Date: 2019-05-03
镇江博慎新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the basic polymer of the conductive adhesive is an adhesive, an appropriate curing temperature can be selected for curing and bonding. At the same time, with the development of high-density and flexible electronic packaging, the requirements for connecting materials are getting higher and higher. During the process, electronic components and printed circuit boards will directly generate stress due to the mismatch of thermal expansion coefficients. The traditional tin / lead alloy solder joints are unbearable and cause failure, and cannot be applied to applications that require light, thin, short, and low power consumption.

Method used

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  • One-component silicone conductive adhesive, and preparation method and application thereof
  • One-component silicone conductive adhesive, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Add 100 parts of vinyl-terminated silicone oil with a vinyl content of 0.46% and a viscosity of 500mpa.s, and 10 parts of single-walled carbon nanotubes with a solid content of 10% in a planetary dispersion mixer, and disperse and stir at a high speed at a stirring speed of 1000rpm. After stirring for 0.5h Grind 6 times with a three-roll mill. After grinding, add 5 parts of hydrogen-containing silicone oil with a silicon hydrogen content of 1.6% and 40 parts of flake silver powder with an average particle size of 10 μm in the mixer, stir evenly and heat up to 100°C, keep in a vacuum state (<-0.08Mpa), and stir After cooling for 1 h, the stirring speed was 1000 rpm to obtain the base material. In the base material cooled to room temperature, 1 part of coupling agent V05, 0.5 part of 1-alkynyl cyclohexanol, 0.5 part of 1-alkynyl cyclohexanol, 0.2 parts of chloroplatinic acid catalyst with a content of 5000ppm was introduced into dehydrated compressed air, stirred and mix...

Embodiment 2

[0023] Add 60 parts of vinyl-terminated silicone oil with a vinyl content of 1.5% and a viscosity of 50mpa.s and 5 parts of single-walled carbon nanotubes with a solid content of 10% in a planetary dispersion mixer, and disperse and stir at a high speed at a stirring speed of 100rpm. After stirring for 1 hour, use Three-roll mill grinding 4 times. After grinding, add 1 part of hydrogen-containing silicone oil with a silicon hydrogen content of 1.6% and 20 parts of flaky silver powder with an average particle size of 10 μm in the mixer. Stir evenly and heat up to 120 ° C. Keep in a vacuum state (<-0.08Mpa), stir After cooling for 1 h, the stirring speed was 100 rpm to obtain the base material. In the base material cooled to room temperature, 0.2 parts of coupling agent V05, 1.5 parts of 1-alkynyl cyclohexanol, 1.5 parts of 1-alkynyl cyclohexanol, 0.5 parts of chloroplatinic acid catalyst with a content of 3000ppm was introduced into dehydrated compressed air, stirred and mixed...

Embodiment 3

[0025] Add 80 parts of vinyl-terminated silicone oil with a vinyl content of 1% and a viscosity of 500mpa.s and 8 parts of single-walled carbon nanotubes with a solid content of 10% in a planetary dispersing mixer, disperse and stir at a high speed at a stirring speed of 500rpm, and stir for 0.5h Grind 8 times with a three-roll mill. After grinding, add 3 parts of hydrogen-containing silicone oil with a silicon hydrogen content of 1.6% and 30 parts of flaky silver powder with an average particle size of 10 μm in the mixer, stir evenly and heat up to 110°C, keep in a vacuum state (<-0.08Mpa), and stir After cooling for 1 h, the stirring speed was 500 rpm to obtain the base material. In the base material cooled to room temperature, 2.5 parts of coupling agent V05, 3 parts of 1-alkynyl cyclohexanol, 3 parts of 1-alkynyl cyclohexanol, 1 part of chloroplatinic acid catalyst with a content of 4000ppm is introduced into the dehydrated compressed air, stirred and mixed, and after the...

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Abstract

The invention discloses a one-component silicone conductive adhesive. The one-component silicone conductive adhesive comprises, by weight, 60-100 parts of vinyl-terminated silicone oil, 1-5 parts of hydrogen-containing silicone oil, 20-40 parts of silver powder, 5-10 parts of single-walled carbon nanotubes, 0.2-5 parts of a coupling agent, 0.2-1 part of a catalyst and 0.5-3 parts of an inhibitor.The invention also discloses a preparation method and an application of the one-component silicone conductive paste. The one-component addition type silicone conductive adhesive prepared in the invention has the advantages of good electrical conductivity, low interface resistance and good toughness, and can be widely applied to conductive bonding of photovoltaic stacked assembly cell pieces, electronic components and electric conduction of printed circuit boards.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesives, and in particular relates to a single-component organic silicon conductive adhesive and its preparation method and application. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing. It usually uses polymer resin and conductive filler as the main components. Through the bonding effect of polymer resin, conductive particles are combined to form a conductive path to achieve adhesion. Conductive connection of materials. Since the basic polymer of the conductive adhesive is an adhesive, an appropriate curing temperature can be selected for curing and bonding. At the same time, with the development of high-density and flexible electronic packaging, the requirements for connecting materials are getting higher and higher. During the process, electronic components and printed circuit boards will directly generate stress due to the mismatch o...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J9/02C09J11/04C09J11/06
Inventor 蔡琴李军明
Owner 镇江博慎新材料有限公司
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