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Diamond sheet grinding wheel

A diamond and flake technology, applied in the formulation and preparation of diamond flake grinding wheel materials, can solve the problems of short service life and low cutting efficiency, and achieve the effects of long service life, weak grinding effect and good grinding effect

Pending Publication Date: 2019-04-26
ZHONGYUAN ENGINEERING COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a formula and preparation method of diamond flake grinding wheel material for the problem of low cutting efficiency and short life of resin bonded diamond flake grinding wheel

Method used

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preparation example Construction

[0015] The preparation method of diamond sheet grinding wheel of the present invention, step is as follows:

[0016] (1) Weighing: Use FA / JA series electronic balance to weigh the resin-bonded diamond flakes one by one, turn on the power to preheat for 30 minutes; then place a clean and dry small beaker on the balance, Press the tare button after the balance display is stable, wait for the balance display to be zero or close to zero, then put the ingredients to be weighed into the beaker and weigh them one by one;

[0017] (2) Mixing: mixing is the process of fully mixing and uniforming resin bond, diamond abrasive, filler and external ingredients. Spread the material; the specific method is as follows: a. Add the wetting agent cresol to the diamond abrasive and mix evenly; b. Mix the filler materials copper powder, zinc oxide, chromium oxide, SiC micropowder, and ferric oxide evenly and carry out Sieve operation; c. Mix the resin binder phenolic resin and the mixed filler ev...

Embodiment 1

[0027] The diamond flake grinding wheel of the present embodiment, the volume ratio is composed as follows: 25% of diamond abrasives, 45% of resin bond, 10% of copper powder, 4% of zinc oxide, 6% of chromium oxide, 10% of SiC micropowder and cresol; The diamond abrasive is compounded by 120 / 140 and W10 in a mass ratio of 4:1.

Embodiment 2-5

[0029] The diamond abrasive in this embodiment is compounded by 120 / 140 and W10 in mass ratios of 5:1, 2:1, 3:1, and 1:1, and the rest of the formulations are the same as in Example 1.

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Abstract

The invention provides a diamond sheet grinding wheel. The diamond sheet grinding wheel comprises, by size ratio, 25% of diamond abrasive material, 45% of resin binder, 10% of copper powder, 4% of zinc oxide, 6% of chromium oxide, 10% of SiC micro powder and cresol. The diamond abrasive material is prepared by compounding any one of an abrasive material with the particle size being 107-139 micrometers and an abrasive material with the particle size being 5-10 micrometers, 35-45 micrometers or 65-85 micrometers. On the basis of the same formula, by adjusting different diamond particle size ratios, the optimal particle size parameter suitable for the formula is determined. Under the circumstance that the size ratio of the resin binder diamond grinding wheel formula is determined, the abrasive material with the fine particle size is mixed into the diamond abrasive material with the rough particle size to manufacture the diamond sheet grinding wheel, although the grinding effect of diamondwith the fine particle size is weak, the transition and replacement function is achieved after mixing with the diamond with the rough particle size, the distance among particles is increased, abrasive to a metal sintered body due to abrasive dust is reduced, and the grinding effect is better than that of an abrasive material with the single rough particle size.

Description

technical field [0001] The invention relates to the field of thin-slice grinding wheels, and more specifically relates to a formula and a preparation method of a diamond thin-slice grinding wheel material. Background technique [0002] Resin bonded diamond flake grinding wheel uses resin powder as a bonding agent to bond diamond abrasives together, add a certain amount of filler material, and go through hot pressing molding, curing, etc. a tool. The thickness is usually between 1~5mm or even thinner. Thin slice grinding wheels are mainly used for precision grooving or cutting of metal and non-metal materials in metallurgical industry, building materials industry, machinery industry, automobile industry, aerospace industry, shipbuilding industry, and silicon, germanium, sapphire, graphite, ceramics, etc. in the semiconductor industry. processing. With the rapid development of semiconductor information technology and photovoltaic technology, the cutting requirements for pre...

Claims

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Application Information

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IPC IPC(8): B24D3/28B24D18/00
CPCB24D3/28B24D18/0009
Inventor 方莉俐程丙良胡宴伟
Owner ZHONGYUAN ENGINEERING COLLEGE
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