Polymer matrix composite, and prepreg and printed circuit board using the same

Abstract

The present invention provides a polymer matrix composite, and a prepreg and a printed circuit board using the same. The polymer matrix composite includes a polymeric resin and a non-woven reinforcingmaterial having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003. The printed circuit board uses the laminate including the polymer matrix compositeas a core layer which is sandwiched between at least two outer layers. The disclosed polymer matrix composite, the laminate including the polymer matrix composite, the prepreg using the polymer matrix composite and the printed circuit board using the polymer matrix composite can effectively reduce transmission delay and weaving effects through adopting the specific non-woven reinforcing material.

Description

technical field [0001] The invention relates to a polymer matrix composite, a prepreg and a printed circuit board using the same, in particular to a polymer matrix composite for eliminating transmission delay and weaving effect. Background technique [0002] Printed circuit boards (PCBs) are typically manufactured from dielectric materials such as woven glass impregnated in a polymer matrix. A composite formed of woven glass material impregnated in a polymer matrix is ​​clad with copper on one or both sides to form a laminate for use in PCB applications. [0003] In most applications, the polymer matrix is ​​epoxy resin or modified epoxy resin, and polymers of polyimide, bismaleimide triazine, cyanate ester and polyphenylene ether are also can be used. In some radio frequency (RF, radiofrequency) applications, polybutadiene, polyisoprene, and their derivatives are used together with hardeners, accelerators, and additives such as fillers and flame retardants. Since most of...

AI Technical Summary

Problems solved by technology

This works, but results in an inefficient use of space on the board, again resulting in wasted area and increased scrap, while still causing significant propagation delays

Using multi-layer prepreg to measure the difference in average dielectric constant is also not very effective, because this approach increases the thickness of the board and still cannot completely solve the problem

[0008] Using flat glass, spread glass, or glass with a Dk of >6.0 compared to E-glass, such as glass with a Dk of about 4.8 also does not completely solve the problem of transmission delay

The effect of using unreinforced thermoplastic sheets is also limited because these circuit boards often require high temperature processing beyond the tolerance of these materials, resulting in the deterioration of the mechanical and thermal characteristics of these materials and making the products unsuitable for the manufacture of large most circuit boards

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