NiCuZn ferrite magnetic sheet for NFC and wireless charging
A ferrite magnetic and wireless charging technology, applied in the field of NiCuZn ferrite magnetic sheet preparation, can solve the problems of small coil mutual inductance, low conversion efficiency, poor electromagnetic radiation, etc., and achieve high cut-off frequency and high magnetic permeability rate, the effect of high saturation magnetic induction
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Embodiment 1
[0031] 1) 48mol% Fe 2 o 3 , 12mol% CuO, 15mol% NiO, 24mol% ZnO mixed, with steel balls as the medium, ball milled for 1 hour to obtain a ball mill;
[0032] 2) drying the primary ball mill, and then pre-calcining at 900°C for 2 hours to obtain pre-fired material;
[0033] 3) adding the dopant to the calcined material, using zirconium balls as the medium, and ball milling until the particle size reaches 1.2 μm to obtain the dopant; ensure that the dopant contains 0.1wt% Bi 2 o 3 , 0.1wt%Co 2 o 3 , 0.05wt% SnO 2 ;
[0034] 4) Dry and pulverize the dopant, and then add polyvinyl butyral, toluene, absolute ethanol, polyethylene glycol, Citric acid and ethylene glycol were ball milled with zirconium balls for 8 hours to obtain three ball milled slurries;
[0035] 5) The three-time ball-milled slurry is prepared into a membrane with a thickness of 30 μm by casting process, and then dried at 70° C.;
[0036] 6) Laminate 4 layers of the dried membrane, and then use isostatic ...
Embodiment 2
[0040] Each step is with embodiment 1, wherein:
[0041] In step 1), 49mol% Fe 2 o 3 , 8mol% CuO, 18mol% NiO, 26mol% ZnO mixed, ball milled for 4 hours;
[0042] The pre-burning temperature in step 2) is 850° C., and the pre-burning time is 3 hours;
[0043] The particle size in step 3) is 0.8 μm, containing 1wt% Bi in the doping material 2 o 3 , 0.01wt% Co 2 o 3 , 0.3wt% SnO 2 ;
[0044] The ball milling time in step 4) is 4 hours;
[0045] The membrane thickness in step 5) is 60 μm, and the drying temperature is 50° C.;
[0046] The number of laminated layers in step 6) is 6 layers, the thickness of the film blank is 100 μm, the pressure is 80 MPa, the temperature is 50 ° C, and the time is 30 minutes;
[0047] In step 8), the sintering temperature is 900° C., and the holding time is 5 hours.
Embodiment 3
[0049] Each step is with embodiment 1, wherein:
[0050] A ball milling time in step 1) is 2.5 hours;
[0051] The pre-burning temperature in step 2) is 880°C, and the pre-burning time is 2.5 hours;
[0052] The particle size in step 3) is 1 μm, containing 0.35wt% Bi in the dopant 2 o 3 , 0.08wt% Co 2 o 3 , 0.12wt% SnO 2 ;
[0053] The ball milling time in step 4) was 6 hours;
[0054] The membrane thickness in step 5) is 45 μm;
[0055] The lamination in step 6) is 5 layers, the thickness of the film blank is 200 μm, the molding pressure is 65Mpa, the temperature is 60°C, and the time is 22 minutes;
[0056] The sintering temperature in step 8) is 950° C., and the holding time is 3.5 hours.
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