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A kind of fine polishing liquid and preparation method thereof

A fine polishing and nano technology, applied in the field of polishing liquid, can solve the problems of improving polishing effect, unfavorable environmental protection, inapplicability, etc., and achieve the effect of high flatness, short production cycle and long shelf life

Active Publication Date: 2021-03-12
广州亦盛环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The polishing solution prepared by the invention has better polishing effect and higher polishing efficiency, but is not conducive to environmental protection
[0005] CN108060421A discloses a metal material polishing solution, which is made of the following components: 13-18 parts of citric acid, 8-11 parts of sodium dodecylbenzenesulfonate, 11-13 parts of stearamide, 5 parts of sodium oxalate -7 parts, 7-9 parts of fatty alcohol polyoxyethylene ether sodium sulfate, 4-6 parts of propylene glycol, 5-7 parts of colloidal silicon dioxide, 12-15 parts of sodium tetraborate, 3-7 parts of sorbitol, ethylene glycol 3-5 parts of alcohol; the metal material polishing liquid prepared by the invention has good gloss enhancement and is harmless to the environment, but its polishing effect needs to be improved
[0006] CN102953063A discloses a metal polishing liquid, which is composed of the following components by weight percentage: 15-20% of sodium oleate, 2-5% of citric acid, 5-7% of sodium tripolyphosphate, dodecylbenzene 3-4% of sodium sulfonate, 1-2% of oleyl hydroxyethyl imidazoline, 8-10% of quartz sand, and the balance is water; the polishing liquid prepared by this invention can effectively eliminate oil stains and rust spots, but it is not suitable for chemical mechanical polishing

Method used

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  • A kind of fine polishing liquid and preparation method thereof
  • A kind of fine polishing liquid and preparation method thereof
  • A kind of fine polishing liquid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The present embodiment provides a kind of fine polishing liquid, comprises the component of following percentage by weight:

[0047]

[0048] Wherein the particle size of the nano-spherical aluminum oxide micropowder is 100nm, the dispersant is a naphthalene sulfonate polymer, the molecular weight of the naphthalene sulfonate polymer is 4000, and the chelating agent is hydroxyethylethylenediamine and dihydroxyglutaric acid The combination, the mass ratio of hydroxyethylethylenediamine and dihydroxyglutarate is 0.8:1, the oxidizing agent is sodium thiosulfate, and the antibacterial agent is methylisothiazolone.

[0049] The preparation method of described polishing liquid is:

[0050] (1) Mix the nano-alumina micropowder, the dispersant and water, stir and dissolve to obtain the first mixture;

[0051] (2) Add a chelating agent, an oxidizing agent and other auxiliary agents to the first mixture prepared in step (1), stir and dissolve to obtain the fine polishing liquid...

Embodiment 2

[0053] The present embodiment provides a kind of fine polishing liquid, comprises the component of following percentage by weight:

[0054]

[0055] Wherein the particle size of the nano-spherical alumina micropowder is 80nm, the dispersant is a naphthalenesulfonate polymer, the molecular weight of the naphthalenesulfonate polymer is 3000, and the chelating agent is hydroxyethylethylenediamine and dihydroxyglutarate The combination, the mass ratio of hydroxyethylethylenediamine and dihydroxyglutarate is 1:1, the oxidizing agent is sodium thiosulfate, and the antibacterial agent is methylisothiazolone.

[0056] The preparation method of described polishing liquid is:

[0057] (1) Mix the nano-alumina micropowder, the dispersant and water, stir and dissolve to obtain the first mixture;

[0058] (2) Add a chelating agent, an oxidizing agent and other auxiliary agents to the first mixture prepared in step (1), stir and dissolve to obtain the fine polishing liquid.

Embodiment 3

[0060] The present embodiment provides a kind of fine polishing liquid, comprises the component of following percentage by weight:

[0061]

[0062] Wherein the particle size of the nano-spherical aluminum oxide micropowder is 100nm, the dispersant is a naphthalene sulfonate polymer, the molecular weight of the naphthalene sulfonate polymer is 4800, and the chelating agent is hydroxyethylethylenediamine and dihydroxyglutaric acid The combination, the mass ratio of hydroxyethylethylenediamine and dihydroxyglutarate is 0.5:1, the oxidizing agent is sodium thiosulfate, and the antibacterial agent is methylisothiazolone.

[0063] The preparation method of described polishing liquid is:

[0064] (1) Mix the nano-alumina micropowder, the dispersant and water, stir and dissolve to obtain the first mixture;

[0065] (2) Add a chelating agent, an oxidizing agent and other auxiliary agents to the first mixture prepared in step (1), stir and dissolve to obtain the fine polishing liqu...

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Abstract

The invention discloses a fine polishing liquid and a preparation method thereof. The fine polishing liquid comprises the following components in weight percent: 10-30% of nano-alumina micropowder, 5-10% of dispersant, 1-5% of chelating agent, Oxidizing agent 0.5-5%, antibacterial agent 0.01-0.5%, water balance. The fine polishing liquid prepared by the invention has good polishing effect, high polishing efficiency, low volatility, harmless to the environment, and high flatness of the workpiece after polishing, and is used for chemical mechanical polishing of semiconductors, especially chemical mechanical polishing in integrated circuits Applications.

Description

technical field [0001] The invention belongs to the technical field of polishing liquid, and relates to a fine polishing liquid and a preparation method thereof. Background technique [0002] With the rapid development of semiconductor manufacturing technology, integrated circuit manufacturing technology has stepped into the size level of 0.1μm or even smaller, and the processing technology is shifting towards higher current density, higher clock frequency and more interconnection layers. Chemical mechanical polishing is called CMP for short. Its working principle is that the workpiece is subjected to external pressure and the polishing slurry rotates on the polishing pad. With the help of the mechanical grinding of the abrasive in the CMP processing fluid and the chemical corrosion of the oxidant, the surface of the workpiece can be flattened. , CMP technology is developed from practice, and it does not have complete theoretical information. [0003] Currently, CMP is the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 包亚群
Owner 广州亦盛环保科技有限公司
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