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Photosensitive resin composition, yellow light paste and preparation method thereof

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of inability to form conductive network, coarsening of lines, insufficient adhesion, etc., so as to achieve not easy delamination and precipitation, increase crosslinking density, The effect of high polar affinity

Active Publication Date: 2022-03-15
乾宇微纳技术(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] To improve the performance of the yellow light paste, the key point is to improve the performance of the photosensitive resin composition. The photosensitive resin composition currently on the market often uses an all-organic system, which has poor adaptability to inorganic metal powder. In the case of powder-to-filler ratio, homogeneous materials cannot be formed after mixing with each other, resulting in adverse phenomena such as stratification and precipitation, and finer nano-scale metal powders even agglomerate due to inability to disperse well
Part of the photosensitive resin has too strong coating on the metal powder, which leads to the inability of close contact between the metal powder after curing, and the inability to form a conductive network and conduct electricity.
A small number of photosensitive resin compositions that can be matched also cannot reflect the high-resolution characteristics of yellow light materials due to their low proportion. In case of a wide range of short circuits etc.
And due to the influence of the material and surface energy of the circuit board, after the photosensitive resin composition is cured, the predetermined bonding strength cannot be achieved, and a large area falls off after development, or the adhesion is insufficient, and the product durability test cannot be passed.

Method used

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  • Photosensitive resin composition, yellow light paste and preparation method thereof
  • Photosensitive resin composition, yellow light paste and preparation method thereof
  • Photosensitive resin composition, yellow light paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] Embodiment 1 (preparation of photosensitive resin composition)

[0078] [1-Hydroxy-2-(2-allyl-1-yl)cyclohexyl](phenyl)methanone (2.5g), polyethylene glycol methacrylic acid (2.5g), hydroxyethyl methacrylate (7.5g), ethyl methacrylate (7.5g), styrene (2g), azobisisobutyronitrile (0.8g) were ultrasonically dissolved and mixed. Add propylene glycol methyl ether (70g) into a glass reactor with a reflux condenser, and stir under argon protection at 85°C. The aforementioned mixture is gradually added dropwise to the glass reactor through a dropping funnel, kept at 85°C, and stirred for 4h to react, see figure 1 , to obtain a self-initiated self-crosslinking photosensitive resin composition. The prepared photosensitive resin composition has a molecular weight of 18000-20000 and a glass transition temperature Tg=150-180°C.

[0079] figure 1 This is the general reaction formula for the formation of high molecular polymers in the preparation of the photosensitive resin composi...

Embodiment 2

[0093] 1) Organic carrier preparation

[0094] Get the photosensitive resin composition (60g) that embodiment 1 prepares, diethylene glycol monoethyl ether acetate (slurry solvent, 25g), hexanediol diacrylate (slurry solvent, 10.5g), gas phase SiO2 (thixotropic agent, 1g), modified polyether (leveling agent, 0.5g), trimethylsiloxane (defoamer, 1g), methyl phthalate (plasticizer, 1.5g), Acetic acid-[2-[2-[4-(2-chloroethyl)methylamino]phenyl]vinyl]-1,3,3-trimethyl-3H-indolium salt (0.5g) mixed, Stir until all the materials dissolve into a uniform liquid to obtain an organic vehicle.

[0095] 2) Preparation of yellow light silver paste

[0096] Weigh 65g of silver powder and 35g of the organic vehicle prepared in Example 2 and mix them. After fully stirring, grind and roll through a three-roll machine, and grind 8 times at a roll distance of 5-20um to obtain a uniformly dispersed yellowish silver paste.

[0097] According to the preparation method of the yellowish silver paste...

Embodiment 3

[0105] Embodiment 3 (substrate circuit preparation)

[0106] Such as image 3 In the substrate circuit preparation method shown, the yellow light silver paste prepared in Example 3 is coated on a polyethylene terephthalate (PET) substrate by 360-mesh stainless steel screen printing, and carried out at 90°C for 20 minutes Drying treatment, covering the film mask used for testing on the dried silver paste layer, and using 200mj energy and 365nm wavelength ultraviolet light for exposure treatment, so that the photosensitive resin composition in the yellow light silver paste undergoes photoinduced exchange Combined curing reaction, such as figure 2 As shown, remove the film mask, develop under 0.5% NaHCO3 aqueous solution and 0.2kg pressure, remove the exposed part in the silver paste layer, and obtain the circuit pattern of the substrate, including the test line and the test area of ​​the grid method. Put the circuit pattern of the substrate into an oven and heat it at 130° C....

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Abstract

The present invention provides a photosensitive resin composition, which includes a high molecular polymer composed of various monomer units, wherein the monomers forming the monomer units in the high molecular polymer include: a photopolymerization initiator, a hydrophilic monomers and hydrophobic monomers, the monomers are compounds containing olefinic double bonds; the yellow light paste prepared by using the photosensitive resin composition provided by the invention can be well matched with precious metal powder, and is not easy to delaminate and Precipitation, self-initiation and self-crosslinking curing, can be used to prepare substrate circuits with excellent conductivity, high resolution, good adhesion; in addition, the present invention also provides a preparation method for a photosensitive resin composition, a yellow light paste and its preparation method.

Description

technical field [0001] The invention relates to a photosensitive resin composition and belongs to the field of electronic materials. Background technique [0002] With the innovation of technology, the functions of electronic products are becoming more and more perfect, and "light", "thin" and "small" have become the development trend of electronic products. [0003] Hardware miniaturization, light weight, and integration are a system engineering, and the three parts of the circuit chip, passive components, and circuit substrate must be reduced at the same time. Among them, the chip technology relies on the yellow light process and follows Moore's law, from 90nm in 2003 to below 14nm today. This year, first-tier manufacturers, such as IBM, have begun to tackle key problems in the 5nm process. However, the performance improvement and size reduction of the chip alone cannot complete the "light", "thin" and "small" system engineering, because passive components (resistors, cap...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/004
CPCG03F7/004G03F7/027
Inventor 余勇其他发明人请求不公开姓名
Owner 乾宇微纳技术(深圳)有限公司
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