A dual-initiation curing system for improving printing layer texture and its preparation method

A printing layer and system technology, applied in the field of 3D printing, can solve problems such as uneven exposure within the layer, and achieve the effect of solving uneven curing

Active Publication Date: 2020-11-06
BMF NANO MATERIAL TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a method for improving the defects of printed samples caused by pixel gaps, Z-direction layer lines and uneven exposure within layers by introducing a dual-cure system into 3D printing photosensitive resin materials

Method used

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  • A dual-initiation curing system for improving printing layer texture and its preparation method
  • A dual-initiation curing system for improving printing layer texture and its preparation method
  • A dual-initiation curing system for improving printing layer texture and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] By weight percentage, active oligomer urethane acrylate 25%, polyester acrylate 20%, polyethylene glycol diacrylate 20%, reactive diluent acryloyl morpholine 15%, acrylate isopropyl ester 10%, light Initiator phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide 3%, leveling agent acrylate compound 2%, defoamer polyethylene glycol 400 2%, light absorber 2,4 - Mix 1% dihydroxybenzophenone and 2% thermal initiator dibenzoyl peroxide, stir at a medium speed of 500 rpm for 5 hours, and then stir at a high speed of 1200 rpm for 0.5 hour to obtain a uniform photocuring system.

[0033] Design a three-dimensional solid model through modeling software, use the slicing software to slice the model according to the designed curing layer thickness, import the sliced ​​files into the control software of the light-curing rapid prototyping machine, and place the light-curing system in the SLA light Under the curing rapid prototyping machine, the wavelength is 355nm for point-by-point expos...

Embodiment 2

[0035]Percentage by weight, reactive oligomer urethane acrylate 20%, polyester acrylate 25%, polyethylene glycol diacrylate 20%, reactive diluent acryloyl morpholine 10%, isopropyl acrylate 15%, photoinitiated Agent 2,4,6-trimethylbenzoyl ethyl phosphonate 3%, leveling agent polyether modified dimethyl siloxane solution 2%, defoamer modified polydimethyl siloxane 2 %, light absorber 2-hydroxy-4-n-octyloxybenzophenone 1%, thermal initiator azobisisobutyronitrile 2%, mix at medium speed 800 rpm for 15 hours, then high speed 1200 rpm Stir for 1 h to obtain a uniform photocuring system.

[0036] Design a three-dimensional solid model through modeling software, use slicing software to slice the model according to the designed curing layer thickness, import the sliced ​​files into the control software of the light-curing rapid prototyping machine, and place the light-curing system in the DLP light Under the curing rapid prototyping machine, the wavelength is 365nm for point-by-poin...

Embodiment 3

[0038] Percentage by weight, reactive oligomer urethane acrylate 20%, polyester acrylate 20%, polyethylene glycol diacrylate 25%, reactive diluent acryloyl morpholine 12%, isopropyl acrylate 13%, photoinitiated Agent diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide 3%, leveling agent polyester modified dimethyl siloxane solution 2%, defoamer aliphatic amide 2%, light Absorbent 2-(2ˊ-hydroxy-5ˊ-methylphenyl)benzotriazole 1%, thermal initiator azobisisoheptanonitrile 2%, mixed at medium speed 1000 rpm / min for 10h, then high speed 1500 rpm / min and stirred for 0.7h to obtain a uniform photocuring system.

[0039] Design a three-dimensional solid model through modeling software, use the slicing software to slice the model according to the designed curing layer thickness, import the sliced ​​files into the control software of the light-curing rapid prototyping machine, and place the light-curing system in the SLA light Under the curing rapid prototyping machine, the wavelength is...

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PUM

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Abstract

The invention provides a dual initiation curing system for improving printing layer veins and a preparation method thereof. The system comprises the following ingredients in percentage by weight: 10 to 90 weight percent of active oligomers, 20 to 50 weight percent of active diluents, 0.2 to 6 weight percent of photoinitiators, 0.2 to 3 weight percent of thermal initiators, 0.1 to 5 weight percentof light absorbers and 1.5 to 5 percent of other auxiliary agents. Through the addition of the thermal initiators into a photosensitive resin system, the heat release of free radical polymerization isused for further initiating the thermal initiators; the continuous reaction and curing of insufficiently cured active oligomers and active diluents are promoted, so that the problem of sample performance defect due to curing nonuniformity is solved.

Description

technical field [0001] The invention belongs to the field of 3D printing, and in particular relates to a dual-initiation system for improving printing layer patterns and a preparation method thereof. Background technique [0002] The basic principle of 3D printing can be summarized as stacked manufacturing, which can be divided into the following types: stereolithography (SLA), digital light processing (DLP), selective laser sintering (SLS), fused deposition / fused filament deposition (FDM) ), layered solid manufacturing (LOM), electron beam fuse deposition (EBFF) and other forming processes. Based on various constraints, different technologies have their own advantages and disadvantages. [0003] The printing process is generally as follows: design a three-dimensional solid model through modeling software, use slicing software to slice the model according to the designed solidified layer thickness, and import the sliced ​​file into the control software; / Exposure and curin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F291/12C08F291/06C08F220/06C08F2/48C08F4/34C08F4/04B33Y70/10
CPCB33Y70/00C08F2/48C08F4/04C08F4/34C08F283/008C08F283/01C08F283/065
Inventor 赵卓冯玉林黄立张志飞贺晓宁方绚莱
Owner BMF NANO MATERIAL TECHNOLOGY CO LTD
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