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Polyether polymer composition

A polymer and composition technology, applied in polyether coatings, conductive coatings, coatings, etc., can solve the problems of insufficient electrical conductivity, thermal conductivity, conductive paste, etc., and achieve excellent long-term stability.

Active Publication Date: 2021-05-14
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a method of improving the heat dissipation performance of thermally conductive sheets and thermally conductive greases, the usual method is to increase the thermal conductivity of these, but there is the following problem: when a large amount of thermally conductive filler is filled in the polymer to improve thermal conductivity, The dispersibility of the thermally conductive filler in the thermally conductive sheet or thermally conductive grease will deteriorate; Condensation, it will become unable to exert sufficient thermal conductivity
In this regard, there is a problem that when a large amount of conductive filler is filled in the polymer in order to improve the conductivity, the dispersibility of the conductive filler in the conductive paste or conductive ink will deteriorate; or, even in The dispersibility of the conductive filler is good at the beginning of use, but when used for a long time, the conductive fillers will coagulate with each other, and it will not be able to exhibit sufficient conductive performance

Method used

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  • Polyether polymer composition
  • Polyether polymer composition
  • Polyether polymer composition

Examples

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Embodiment

[0084] Hereinafter, the present invention will be further described based on detailed examples, but the present invention is not limited to these examples. In addition, in the following, "parts" are based on weight unless otherwise specified. In addition, tests and evaluations are as follows.

[0085] (1) Number of repeating units, number-average molecular weight (Mn), and molecular weight distribution (Mw / Mn) of polyether-based polymers

[0086] The number-average molecular weight (Mn) and molecular weight distribution (Mw / Mn) of a polyether-based polymer not containing a cationic group can be obtained as poly The number-average molecular weight (Mn) and molecular weight distribution (Mw / Mn) of the polyether-based polymer were measured using styrene conversion values. In addition, HLC-8320 (manufactured by Tosoh Corporation) was used as a measuring device, a column in which two TSKgelα-M (manufactured by Tosoh Corporation) were connected in series was used as a column, and ...

manufacture example 1

[0104] (Synthesis of polyether polymer A)

[0105] Into a glass reactor with a stirrer replaced with argon, 3.22 g of tetra-n-butylammonium bromide and 100 ml of toluene were added, and the mixture was cooled to 0°C. Next, what dissolved 1.370 g of triethylaluminum (1.2 equivalents with respect to tetra-n-butylammonium bromide) in 10 ml of n-hexane was added, and it was made to react for 15 minutes, and the catalyst composition was obtained. 35.0 g of epichlorohydrin was added to the obtained catalyst composition, and the polymerization reaction was performed at 0 degreeC. After the polymerization reaction is initiated, the viscosity of the solution increases slowly. After reacting for 12 hours, a small amount of water was injected into the polymerization reaction solution to terminate the reaction. The obtained polymerization reaction solution was washed with 0.1N hydrochloric acid aqueous solution to deash the catalyst residue, and after washing with ion-exchanged water, t...

manufacture example 2

[0107] (Synthesis of polyether-based polymer B containing imidazolium structure)

[0108] 5.0 g of the polyether-based polymer A obtained in Production Example 1, 6.1 g of 1-methylimidazole, and 10.0 g of acetonitrile were added to a glass reactor with a stirrer replaced with argon, and heated to 80°C. After reacting at 80° C. for 48 hours, it was cooled to room temperature to terminate the reaction. After washing the obtained reactant with an equal weight mixed solution of toluene / methanol / water, the organic phase containing 1-methylimidazole and toluene was removed, and the aqueous phase was dried under reduced pressure at 50° C. for 12 hours to obtain 6.35 g of light red solid. to the solid 1 H-NMR measurement and elemental analysis, the results identified as: polyether polymer A (polyepichlorohydrin) of the starting material, part of the chlorine group in the repeating unit was 1- with chloride ion as a counter anion A methylimidazolium-containing polymer having a halid...

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Abstract

The present invention provides a polyether-based polymer composition, which contains 50 parts by weight or more of a filler relative to 100 parts by weight of a polyether-based polymer, and the polyether-based polymer contains 10 to 200 epoxy monomers unit. According to the present invention, it is possible to provide a polyether-based polymer composition capable of appropriately exhibiting various properties of fillers such as high thermal conductivity and high electrical conductivity, and having excellent long-term stability.

Description

technical field [0001] The present invention relates to a polyether-based polymer composition capable of appropriately exhibiting various properties of fillers such as high thermal conductivity and high electrical conductivity, and having excellent long-term stability. Background technique [0002] Along with miniaturization and higher output of heat-generating electronic components such as semiconductor elements, the amount of heat per unit area generated by electronic components has become extremely large. On the other hand, an increase in temperature of heat-generating electronic components such as semiconductor elements leads to a decrease in performance, so cooling is required. Cooling of a heat-generating electronic component can be performed, for example, by providing a cooling member such as a metal heat sink next to such a heat-generating electronic component. However, there is a problem that, if the contact between such a heat-generating electronic component and a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/02C08K3/08C08K3/22C08K3/28H01B1/22
CPCC08K3/08C08K3/22C08K3/28C08L71/02H01B1/22C08K3/013C08K3/38C08K2003/0806C08K2003/085C08K2003/2296C08K2003/385C08K2201/001C08K2201/006C08K2201/005C09D7/69C09D7/61C09D7/68C08G65/24C08G65/33317C09D5/24C09D171/03C09K5/14
Inventor T·B·霍昂早野重孝太田圭祐
Owner ZEON CORP
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