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Preparation method of dry-method microwave composite medium board

A composite medium, dry mixing technology, applied in chemical instruments and methods, lamination devices, lamination and other directions, can solve the problems of complex collection and treatment, high manufacturing cost, large amount of waste water, etc., to save the preparation cycle, Stable product quality and small footprint

Active Publication Date: 2018-11-02
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can be continuously produced in large quantities, but the pretreatment of raw materials, the mixing and configuration of glue, the discharge of waste glue and other processes all generate a large amount of wastewater, which can only be discharged normally after secondary treatment, and the drying process of the dipping machine is also difficult. A large amount of waste gas will be generated, and the collection and treatment of repeatedly dried waste gas requires complex treatment devices
With the improvement of the degree of environmental protection, this kind of process must set up a complicated process to meet the requirements of urban environmental protection, and the manufacturing cost is high.

Method used

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  • Preparation method of dry-method microwave composite medium board
  • Preparation method of dry-method microwave composite medium board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The materials used in this example are described as follows:

[0042] 0.01Kg coupling agent F8261, 0.008Kg hydrolysis solvent xylene, 10Kg PTFE micropowder, 1Kg polyperfluoroethylene propylene (fluororesin modifier), 1Kg fused silica (micron ceramic powder). D50 of PTFE micropowder = 5 μm; D50 of micron ceramic powder = 0.1 μm; D50 refers to the corresponding particle size when the cumulative particle size distribution percentage of the sample reaches 50%.

[0043] The specific preparation steps of the dry microwave composite dielectric board are as follows:

[0044] (1) Raw material pretreatment

[0045] Add 0.008Kg of hydrolysis solvent xylene to 0.01Kg of coupling agent F8261 to hydrolyze to obtain a modified coupling agent; add the modified coupling agent and 1Kg of fused silica into a ball mill, and ball mill at 60°C for 2 hours, Obtain modified ceramic powder.

[0046] (2) dry mixing

[0047] Mix the modified ceramic powder prepared in step (1), 1Kg PTFE micro...

Embodiment 2

[0060] The materials used in this example are described as follows:

[0061] 0.1Kg coupling agent F8261, 0.1Kg coupling agent AN, 0.08Kg hydrolysis solvent dichloromethane, 50Kg PTFE micropowder, 5Kg perfluoroalkoxy resin (fluororesin modifier), 40Kg fused silica (micron ceramic powder ), 60Kg alumina (micron ceramic powder).

[0062] D50 of PTFE micropowder = 5 μm; D50 of micron ceramic powder = 0.1 μm; D50 refers to the corresponding particle size when the cumulative particle size distribution percentage of the sample reaches 50%.

[0063] The specific preparation steps of the dry microwave composite dielectric board are as follows:

[0064] (1) Raw material pretreatment

[0065] Mix 0.1Kg coupling agent F8261 and 0.1Kg coupling agent AN evenly to obtain a mixed coupling agent; add 0.08Kg hydrolysis solvent methylene chloride to the mixed coupling agent, and hydrolyze to obtain a modified coupling agent; The coupling agent, 40Kg of fused silica and 60Kg of alumina were ad...

Embodiment 3

[0080] The materials used in this example are described as follows:

[0081] 0.08Kg coupling agent AN, 0.05Kg hydrolysis solvent ethanol, 10Kg PTFE micropowder, 1Kg ethylene-tetrafluoroethylene copolymer (fluororesin modifier), 30Kg rutile silica (micron ceramic powder).

[0082] D50 of PTFE micropowder = 5 μm; D50 of micron ceramic powder = 0.1 μm; D50 refers to the corresponding particle size when the cumulative particle size distribution percentage of the sample reaches 50%.

[0083] The specific preparation steps of the dry microwave composite dielectric board are as follows:

[0084] (1) Raw material pretreatment

[0085] Add 0.05Kg of hydrolysis solvent ethanol to 0.08Kg of coupling agent AN, and hydrolyze to obtain a modified coupling agent; add the modified coupling agent and 30Kg of rutile silica into a ball mill, and ball mill for 2 hours at 80°C to obtain Modified ceramic powder.

[0086] (2) dry mixing

[0087] Mix the modified ceramic powder prepared in step (...

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Abstract

The invention relates to a preparation method of a dry-method microwave composite medium board. The method comprises the following operation steps that 1, a coupling agent, hydrolysis solvent and micron ceramic powder are mixed for ball-milling; 2, modified ceramic powder, teflon micropowder and a fluororesin modifying agent are evenly mixed, and drying and ball-milling are conducted; 3, a dry-method mixture is subjected to mould pressing through a mould to obtain a primary blank; 4, sintering is conducted to obtain a clavillose blank; 5, the clavillose blank is made into smooth even rectangular sheets with the thickness smaller than 0.1 mm through mechanical processing; 6, the front and back surfaces of the rectangular sheets are subjected to plasma activation treatment; 7, each activatedsheet and pure PTFE thin film are overlapped, matched and regarded as a layer of basic unit material, the multiple layers of basic unit materials are overlapped in sequence until the thickness required by the design is reached, then a composite basic board is obtained, metal foil is added to the two side surfaces respectively, and through high-temperature vacuum lamination, the PTFE-based microwave composite medium board is prepared. According to the method, in the preparation process, waste gas collection and treatment are not needed basically, so that the method is green and energy-saving,and the environment-friendly requirements are met.

Description

technical field [0001] The invention belongs to the technical field of dielectric plates for microwave electronics, and in particular relates to a preparation method of a PTFE-based microwave composite dielectric plate. Background technique [0002] Polytetrafluoroethylene (PTFE)-based microwave composite dielectric board is the organic dielectric board material system with the lowest dielectric constant and the smallest dielectric loss. With the development trend of high frequency, high speed, miniaturization, integration and light weight , PTFE-based microwave composite dielectric boards are increasingly used in electronic equipment. And thanks to PTFE's excellent electrical performance stability, weather resistance, temperature resistance, and radiation resistance, PTFE-based microwave composite dielectric boards can be exposed to any climatic conditions for ten years without changing the original excellent performance, which makes it It is suitable for the harsh install...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10C04B26/08
CPCB32B37/10C04B26/08C04B2201/32C04B18/023
Inventor 邹嘉佳刘建军李苗邱颖霞赵丹
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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