Resin grinding disc

A grinding disc and resin technology, applied in the field of grinding and polishing, can solve the problems of wafer scratches, poor heat resistance, and immaturity, and achieve the effects of preventing separation, small size, and reducing the amount of decomposition.

Inactive Publication Date: 2018-10-19
安徽全兆光学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the process of grinding sapphire wafers with consolidated diamond abrasive tools is not mature enough. The main reason is that the heat resistance of consolidated abrasive tools is poor during grinding, and the fallen diamond abrasive grains are easy to cause wafer scratches. Therefore, how to improve the performance of consolidated diamond abrasive tools Heat resistance and reducing the probability of abrasive particle shedding are important research directions

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A resin grinding disc includes a base layer and an abrasive layer, the base layer and the abrasive layer are bonded by a binder, and the abrasive layer raw materials include 25 parts by weight of diamond, 15 parts of CBN, and 15 parts of alumina hollow balls. , 28 parts of modified phenolic resin, 5 parts of graphite, 4 parts of polytetrafluoroethylene powder, 0.5 parts of walnut shell powder, 3 parts of stearic acid, 0.5 parts of dibutyl phthalate;

[0021] Preparation of modified phenolic resin:

[0022] S1. Mix phenolic resin, p-toluenesulfonic acid and phosphoric acid, stir for 40 minutes, heat up to 105°C, heat preservation reaction for 2.5h; then heat up to 195°C, heat preservation reaction for 2h, to obtain cured product a; the phenol resin, p-toluenesulfonic acid The mass ratio of acid and phosphoric acid is 70:2:4;

[0023] S2, the nano SiO 2 Disperse in anhydrous ethanol, add silane coupling agent KH550, ultrasonically shake for 70 minutes, then add cured product a ...

Embodiment 2

[0025] A resin grinding disc, comprising a base layer and an abrasive layer, the base layer and the abrasive layer are bonded by a binder, and the abrasive layer raw materials include 35 parts by weight of diamond, 10 parts of CBN, and 35 parts of alumina hollow balls , 9 parts of modified phenolic resin, 7 parts of graphite, 2 parts of polytetrafluoroethylene powder, 3 parts of walnut shell powder, 1 part of stearic acid, 1.5 parts of dibutyl phthalate;

[0026] Preparation of modified phenolic resin:

[0027] S1. Mix the phenolic resin, p-toluenesulfonic acid and phosphoric acid, stir for 60 minutes, heat up to 98°C, heat preservation reaction for 3.5h; then heat up to 185°C, heat preservation reaction for 4h, to obtain cured product a; the phenol resin, p-toluenesulfonic acid The mass ratio of acid and phosphoric acid is 50:4:3;

[0028] S2, the nano SiO 2 Disperse in anhydrous ethanol, add silane coupling agent KH550, ultrasonically shake for 90 minutes, then add cured product a...

Embodiment 3

[0030] A resin grinding disc comprises a base layer and an abrasive layer, the base layer and the abrasive layer are bonded by a binder, and the abrasive layer raw materials include 28 parts by weight of diamond, 13 parts of CBN, and 17 parts of alumina hollow balls , 25 parts of modified phenolic resin, 5 parts of graphite, 4 parts of polytetrafluoroethylene powder, 1 part of walnut shell powder, 1.2 parts of stearic acid, 0.7 parts of dibutyl phthalate;

[0031] Preparation of modified phenolic resin:

[0032] S1. Mix phenolic resin, p-toluenesulfonic acid and phosphoric acid, stir for 45 minutes, heat up to 100°C, heat preservation reaction for 2.7h; then heat up to 187°C, heat preservation reaction for 2.3h to obtain cured product a; the phenol resin, p-toluene The mass ratio of sulfonic acid and phosphoric acid is 55:2:3;

[0033] S2, the nano SiO 2 Disperse in absolute ethanol, add silane coupling agent KH550, ultrasonically shake for 75min, then add cured product a and NaOH, ...

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Abstract

The invention discloses a resin grinding disc which comprises a base body layer and an abrasive material layer. The base body layer and the abrasive material layer are bonded through a binder. Raw materials of the abrasive material layer comprise, by weight part, 25-35 parts of diamond, 10-15 parts of CBN, 15-35 parts of aluminum oxide hollow ball, 9-28 parts of modified phenolic resin, 5-7 partsof graphite, 2-4 parts of polytetrafluoroethylene powder, 0.5-3 parts of walnut shell flour, 1-3 parts of stearic acid and 0.5-1.5 parts of dibutyl phthalate. The resin grinding disc is good in self-sharpening performance and heat resisting property, the grinding efficiency is high, the falling probability of abrasive particles can be reduced, and the abrasive material can obtain good surface quality.

Description

Technical field [0001] The invention relates to the technical field of grinding and polishing, in particular to a resin grinding disc. Background technique [0002] Sapphire is widely used in the fields of semiconductor lighting, smart wearable device windows and precision instrument components for its advantages of high hardness, good light transmission and chemical stability. At the same time, its surface processing technology requirements are getting higher and higher. On the one hand, sapphire applications require good surface quality and precision; on the other hand, sapphire has high hardness, brittleness and chemical stability, and is a difficult-to-process material. [0003] At present, the main difficulty in processing single crystal sapphire wafers lies in the two processes of grinding and polishing. Among them, the grinding process is not only the key to improving accuracy, but also an important factor in obtaining good overall flatness and wafer surface quality, and r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/28
CPCB24D3/285
Inventor 朱同武朱立芳
Owner 安徽全兆光学科技有限公司
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