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Aluminium-based copper foil clad laminated board and producing technology

An aluminum-based copper cladding and manufacturing process technology, applied in the field of copper clad laminates, can solve the problems of poor heat dissipation performance, easy to fall off, poor adhesion of aluminum plates, etc., to achieve not easy to fall off, good adhesion, and improved thermal conductivity Effect

Inactive Publication Date: 2007-11-07
杭州裕兴层压板材有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The object of the present invention is to provide an aluminum-based copper-clad laminate and its manufacturing process, which mainly solves the problems of poor thermal conductivity and heat dissipation performance of the aluminum-based copper-clad laminate in the prior art; Material and copper foil are only laminated and then pressed, and the organic insulating material has poor bonding force to the aluminum plate and is easy to fall off, etc. Technical problems

Method used

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  • Aluminium-based copper foil clad laminated board and producing technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: The aluminum-based copper-clad laminate of this example, as shown in Figure 1, includes an aluminum plate 1, the surface of which is coated with a modified epoxy resin insulating layer 2, and the other side of the modified epoxy resin insulating layer is provided with a copper foil 3, The composition and mass percentage of the modified epoxy resin insulating layer are: 20% of o-methyl novolac epoxy resin, 5% of aluminum nitride, 6% of aluminum oxide, and the rest is flame-retardant epoxy resin. The thickness of the modified epoxy resin insulation layer is 0.075mm.

[0022] The manufacturing process of aluminum-based copper clad laminates, the steps are:

[0023] a. Clean, passivate and dry the aluminum plate;

[0024] b. Apply the modified epoxy resin insulating glue directly to the surface of the cleaned and dried aluminum plate by screen printing, roll coating, and spraying, and perform pre-drying, that is, send the aluminum plate into an oven to dry un...

Embodiment 2

[0026] Embodiment 2: The aluminum-based copper-clad laminate of this example, as shown in Figure 1, includes an aluminum plate 1, the surface of which is coated with a modified epoxy resin insulating layer 2, and the other side of the modified epoxy resin insulating layer is provided with a copper foil 3, The composition and mass percentage of the modified epoxy resin insulation layer are: 5% o-methyl novolac epoxy resin, 5% aluminum nitride, and the rest is flame-retardant epoxy resin. The thickness of the modified epoxy resin insulation layer is 0.075mm.

[0027] The manufacturing process of aluminum-based copper clad laminates, the steps are:

[0028] a. Clean, passivate and dry the aluminum plate;

[0029] b. Apply the modified epoxy resin insulating glue directly to the surface of the cleaned and dried aluminum plate by screen printing, roll coating, and spraying, and perform pre-drying, that is, send the aluminum plate into an oven to dry until the modified epoxy resin ...

Embodiment 3

[0031] Embodiment 3: The aluminum-based copper-clad laminate of this example, as shown in Figure 1, includes an aluminum plate 1, the surface of which is coated with a modified epoxy resin insulating layer 2, and the other side of the modified epoxy resin insulating layer is provided with a copper foil 3, The composition and mass percentage of the modified epoxy resin insulating layer are: o-methyl novolac epoxy resin 6%, and the rest is flame retardant epoxy resin. The thickness of the modified epoxy resin insulation layer is 0.075mm.

[0032] The manufacturing process of aluminum-based copper clad laminates, the steps are:

[0033] a. Clean, passivate and dry the aluminum plate;

[0034] b. Apply the modified epoxy resin insulating glue directly to the surface of the cleaned and dried aluminum plate by screen printing, roll coating, and spraying, and perform pre-drying, that is, send the aluminum plate into an oven to dry until the modified epoxy resin The insulating glue ...

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Abstract

A laminated board covered with copper foil consists of aluminium board, copper foil and modified epoxy insulation layer set between said aluminium board and said copper foil. It is featured as forming said modified epoxy insulation layer by one or more than one of vitrification point resin and aluminium nitride as well as aluminium oxide, and the rest of flame-proof epoxy resin. The preparing process of said laminated board is also disclosed.

Description

technical field [0001] The invention relates to a copper-clad laminate, in particular to an aluminum-based copper-clad laminate and the improvement of its manufacturing process. Background technique [0002] Since the existing copper-clad laminates cannot meet the needs of high heat dissipation and high temperature resistance in the design of electronic products, and the development trend of various electronic products has been towards high power and miniaturization, and LEDs are widely used in the lighting market, aluminum Copper-clad laminates can meet the above requirements of printed circuit boards and other electronic and electrical products due to their excellent heat dissipation, dimensional stability, electromagnetic shielding properties, good plasticity, and certain mechanical strength. The traditional aluminum-based copper-clad laminate is made of copper foil, prepreg impregnated with epoxy resin glass cloth, and aluminum plate and then hot-pressed. Because of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03B32B37/12
Inventor 谭炳权吴纪华
Owner 杭州裕兴层压板材有限公司
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