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Polysiloxane-allyl compound modified polyphenylene ether resin composition, and prepreg, laminated board and printed circuit board thereof

An allyl compound, polyphenylene ether resin technology, applied in synthetic resin layered products, printed circuits, printed circuits, etc., can solve the problem of poor adhesion between the composition and metal foil, low dielectric constant, low dielectric Loss factor etc.

Active Publication Date: 2018-07-06
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] For the deficiencies in the prior art, the object of the present invention is to provide a polyphenylene ether resin composition modified by a polysiloxane-allyl compound and its prepreg, laminate and printed circuit board, the composition It has a low dielectric constant and a low dielectric loss factor, excellent heat resistance and moisture absorption performance, and at the same time solves the application weakness of poor adhesion between the composition and the metal foil, without adding additional flame retardants , can reach the combustion level of UL94V-0 under the condition of halogen-free and phosphorus-free, and truly achieve the effect of halogen-free and phosphorus-free flame retardant

Method used

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  • Polysiloxane-allyl compound modified polyphenylene ether resin composition, and prepreg, laminated board and printed circuit board thereof
  • Polysiloxane-allyl compound modified polyphenylene ether resin composition, and prepreg, laminated board and printed circuit board thereof
  • Polysiloxane-allyl compound modified polyphenylene ether resin composition, and prepreg, laminated board and printed circuit board thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] In this example, the polysiloxane-allyl compound shown in formula I was prepared from 2,2'-diallyl bisphenol A and hydrogen-containing polysiloxane HWG17606 through hydrosilylation, and the preparation method was as follows :

[0076] Dissolve diallyl bisphenol A and catalyst chloroplatinic acid completely with an appropriate amount of toluene, mix them, preheat to 60°C, add metered amount of hydrogen-containing polysiloxane drop by drop under constant stirring in a nitrogen atmosphere, and continue React until the signal peak (near 2145cm-1) of the Si-H bond in the infrared spectrum of the reaction mixture solution disappears or is very weak, while the allyl group signal peak (near 1635cm-1) remains strong, stop heating, and depressurize The solvent is removed to obtain a polysiloxane-allyl compound, the structure of which is shown in formula d.

[0077] The infrared spectrum characterization results of the prepared polysiloxane-allyl compound are as follows: figure ...

Embodiment 2

[0081] In this example, the polysiloxane shown in formula I was prepared from 3,3'-diallyl-4,4'diphenol ether diglycidyl ether and hydrogen-containing polysiloxane HWG17606 by hydrosilylation - allyl compound, the preparation method is as follows:

[0082] Completely dissolve 3,3'-diallyl-4,4'diphenol ether diglycidyl ether and 10ppm Karstd catalyst with an appropriate amount of toluene, mix, preheat to 70°C, and keep stirring in a nitrogen atmosphere Add the metered amount of hydrogen-containing polysiloxane dropwise, and continue the reaction until the signal peak (2145cm) of the Si-H bond in the infrared spectrum of the reaction mixture solution -1 near) disappeared or very weak, while the allyl group signal peak (1635cm -1 Nearby) still remain strong, stop heating, remove solvent under reduced pressure, obtain polysiloxane-allyl compound, its structure is shown in formula a.

[0083] Dissolve MX9000 and the compound of formula a prepared above with an appropriate amount ...

Embodiment 3

[0086] In this example, the polymer shown in Formula I was prepared from 1,1-bis(3,3'-diallyl-4,4'xylene)methane and hydrogen-containing polysiloxane HWG17606 through hydrosilylation. Siloxane-allyl compound, the preparation method is as follows:

[0087] Completely dissolve 1,1-bis(3,3'-diallyl-4,4'xylene)methane and 10ppm of Karstd catalyst with an appropriate amount of toluene, mix, preheat to 85°C, and place in a nitrogen atmosphere without Stop stirring and add metered amount of hydrogen-containing polysiloxane dropwise, and continue the reaction until the signal peak (near 2145cm-1) of the Si-H bond in the infrared spectrum of the reaction mixture solution disappears or is very weak, while the allyl group signal The peak (near 1635cm-1) still remained strong, the heating was stopped, and the solvent was removed under reduced pressure to obtain a polysiloxane-allyl compound, the structure of which was shown in formula b.

[0088] Dissolve MX9000 and the compound of formu...

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Abstract

The invention provides a polysiloxane-allyl compound modified polyphenylene ether resin composition, and a prepreg, a laminated board and a printed circuit board thereof. The polysiloxane-allyl compound modified polyphenylene ether resin composition comprises polyphenylene ether resin and a polysiloxane-allyl compound having a structure represented by formula I, and the composition concretely comprises 100 parts by weight of the polyphenylene ether resin and 15-80 parts by weight of the polysiloxane-allyl compound. After the polysiloxane-allyl compound is added to the polyphenylene ether resincomposition, the obtained composition has a low dielectric constant, a low dielectric loss factor, excellent heat resistance and excellent moisture absorption performance, overcomes the application disadvantage of poor adhesion between the composition and metal foil, improves the interlayer adhesion of a copper-clad plate, can achieve the UL94V-0 combustion grade without an additional flame retardant, and truly achieves halogen-free, phosphorus-free and flame-retardant effects.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminate materials, and relates to a polysiloxane-allyl compound modified polyphenylene ether resin composition, a prepreg, a laminate and a printed circuit board. Background technique [0002] Due to the large number of benzene ring structures and weak polar groups in the molecular structure, polyphenylene ether resin has excellent properties, such as high glass transition temperature, good dimensional stability, low water absorption, Small linear expansion coefficient, especially with very good low dielectric constant and low dielectric loss. However, this type of resin is a thermoplastic resin, which has the disadvantages of high melting point, difficult processing, and poor solvent resistance. Even so, the excellent chemical properties, physical properties, and electrical properties of polyphenylene ether still attract great attention and modification. For example, reactive groups are in...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L83/04C08K7/14C08G77/38C08G77/12C08J5/24B32B17/04B32B27/04B32B27/14B32B17/06B32B15/04B32B33/00H05K1/03
CPCB32B5/02B32B5/26B32B17/061B32B33/00B32B2260/021B32B2260/023B32B2260/046B32B2262/101B32B2307/306B32B2307/726C08G77/12C08G77/38C08J5/24C08J2371/12C08J2483/04C08L71/126C08L2201/02C08L2201/22H05K1/0353H05K2201/0162C08L83/04C08K7/14
Inventor 黄增彪成浩冠丘威平魏婷
Owner GUANGDONG SHENGYI SCI TECH
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