Cooling coating for power device and preparation method thereof
A technology for heat dissipation coatings and power devices, applied in chemical instruments and methods, anti-corrosion coatings, heat exchange materials, etc., can solve the problems of air-cooled heat dissipation mode unable to meet heat dissipation requirements, inability to heat dissipation requirements of high-power devices, and small air specific heat capacity. , to achieve the effect of good weather resistance and mechanical properties, excellent mechanical properties and strong adhesion
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Embodiment 1
[0028] A heat dissipation coating for power devices, the coating is composed of the following raw materials in parts by weight: 44 parts of epoxy resin, 14 parts of conductive metal powder, 11 parts of carbon nanotubes, 4 parts of fumed silica, and 6 parts of polyacrylamide , 3 parts of sodium dodecylbenzene sulfonate, 2.5 parts of dioctyl phthalate, 5 parts of silicon nitride, 3.5 parts of nano titanium dioxide, 6 parts of polyvinyl butyral, 2 parts of coupling agent, dispersion 1.3 parts of agent, 1.1 parts of defoamer, 28 parts of solvent.
[0029] Wherein, the epoxy resin is selected from one or a mixture of epoxy E-41, epoxy E-44, and epoxy E-51.
[0030] Wherein, the conductive metal powder is a mixture of silver powder and aluminum powder with a mass ratio of 5:2.
[0031] Wherein, the coupling agent is bis(dioctyloxypyrophosphate)ethylene titanate, methyl-tris(methylacetamido)silane, 3-aminopropyltetraethoxysilane, One or a mixture of 3-(2,3-glycidoxy)propyltrimethox...
Embodiment 2
[0042] A heat dissipation coating for power devices, the coating is composed of the following raw materials in parts by weight: 40 parts of epoxy resin, 12 parts of conductive metal powder, 9 parts of carbon nanotubes, 3 parts of fumed silica, and 4 parts of polyacrylamide , 2 parts of sodium dodecylbenzene sulfonate, 1 part of dioctyl phthalate, 4 parts of silicon nitride, 2 parts of nano titanium dioxide, 4 parts of polyvinyl butyral, 1 part of coupling agent, dispersing 0.5 parts of agent, 0.3 parts of defoamer, 22 parts of solvent.
[0043] Wherein, the epoxy resin is selected from one or a mixture of epoxy E-41, epoxy E-44, and epoxy E-51.
[0044] Wherein, the conductive metal powder is a mixture of silver powder and aluminum powder with a mass ratio of 5:1.
[0045] Wherein, the coupling agent is bis(dioctyloxypyrophosphate)ethylene titanate, methyl-tris(methylacetamido)silane, 3-aminopropyltetraethoxysilane, One or a mixture of 3-(2,3-glycidoxy)propyltrimethoxysilane...
Embodiment 3
[0056] A heat dissipation coating for power devices, the coating is composed of the following raw materials in parts by weight: 48 parts of epoxy resin, 16 parts of conductive metal powder, 13 parts of carbon nanotubes, 5 parts of fumed silica, and 8 parts of polyacrylamide , 4 parts of sodium dodecylbenzene sulfonate, 4 parts of dioctyl phthalate, 6 parts of silicon nitride, 5 parts of nano titanium dioxide, 8 parts of polyvinyl butyral, 3 parts of coupling agent, dispersion 2.8 parts of agent, 2.2 parts of defoamer, 34 parts of solvent.
[0057] Wherein, the epoxy resin is selected from one or a mixture of epoxy E-41, epoxy E-44, and epoxy E-51.
[0058] Wherein, the conductive metal powder is a mixture of silver powder and aluminum powder with a mass ratio of 5:3.
[0059] Wherein, the coupling agent is bis(dioctyloxypyrophosphate)ethylene titanate, methyl-tris(methylacetamido)silane, 3-aminopropyltetraethoxysilane, One or a mixture of 3-(2,3-glycidoxy)propyltrimethoxysil...
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