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Light-emitting diode (LED) packaging silica gel and preparation method thereof

A technology of LED encapsulation and silica gel, which is applied in adhesives, electrical components, circuits, etc., can solve the problems of encapsulation failure, poor aging resistance, and poor high and low temperature resistance, and achieves simple and easy preparation process, good storage stability, Excellent adhesion effect

Inactive Publication Date: 2012-09-19
YANTAI DEBANG ADVANCED SILICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] LED light sources have long service life, high luminous efficiency, no radiation and low power consumption. They are widely used in various display screens, car lights, backlights and lighting of various electronic products. The choice of packaging materials has an impact on the performance of LEDs. It is very important. At present, the packaging materials used include epoxy resin, polymethyl methacrylate, glass, silicone and other highly transparent materials. Epoxy resin and silicone materials are the main packaging materials. The internal stress of epoxy resin is too large. Yellowing, poor high and low temperature resistance, and poor aging resistance, while the current silicone material has small internal stress, good high and low temperature resistance, no yellowing, and higher light transmittance than epoxy resin, but it is different from the substrate Poor adhesion, resulting in package failure, or degradation of aging resistance

Method used

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  • Light-emitting diode (LED) packaging silica gel and preparation method thereof
  • Light-emitting diode (LED) packaging silica gel and preparation method thereof
  • Light-emitting diode (LED) packaging silica gel and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Preparation of component A: Weigh 95g of vinyl polydisiloxane, 5g of adhesive (structural formula 1), 0.1g of catalyst platinum-vinylsiloxane complex with a content of 7000ppm, add them to the mixer in turn, and fill Nitrogen with a concentration of 99.9%, mixed and stirred evenly to obtain the A component;

[0035] Preparation of component B: Weigh 85g of vinyl polydisiloxane, 15g of crosslinking agent polymethylhydrogensiloxane, and 0.2g of inhibitor ethynyl cyclohexanol, add them to the mixer in sequence, and fill them with a concentration of 99.9 % nitrogen, mixed and stirred evenly to obtain the B component;

[0036] When in use, mix the components A and B evenly in a weight ratio of 1:1, vacuum defoam for 20 minutes, dispense or pour glue on the parts to be packaged, and heat at 90°C for 1.5 hours , and then heated at 100°C for 2.5 hours.

Embodiment 2

[0038] Preparation of component A: Weigh 96g of vinyl polydisiloxane, 3g of adhesive (structural formula 2), 0.3g of catalyst platinum-vinylsiloxane complex with a content of 3000ppm, add them to the mixer in turn, and fill Nitrogen with a concentration of 99.9%, mixed and stirred evenly to obtain the A component;

[0039] Preparation of component B: Weigh 95g of vinyl polydisiloxane, 5g of crosslinking agent polymethylhydrogensiloxane, and 0.3g of inhibitor ethynyl cyclohexanol, add them to the mixer in sequence, and fill them with a concentration of 99.9 % nitrogen, mixed and stirred evenly to obtain the B component;

[0040] When in use, mix the components A and B evenly in a weight ratio of 1:1, vacuum defoam for 40 minutes, dispense or pour glue on the parts to be packaged, and heat at 70°C for 0.5 hours , and then heated at 200°C for 1.5 hours.

Embodiment 3

[0042] Preparation of component A: Weigh 95.8g of vinyl polydisiloxane, 4g of adhesive (structural formula 1), 0.2g of catalyst platinum-vinylsiloxane complex with a content of 6000ppm, add them to the mixer in turn, and fill Inject nitrogen with a concentration of 99.9%, mix and stir evenly to obtain the A component;

[0043] Preparation of component B: Weigh 89.8g of vinyl polydisiloxane, 10g of crosslinking agent polymethylhydrogensiloxane, and 0.1g of inhibitor ethynyl cyclohexanol, add them to the mixer in sequence, and fill them with a concentration of 99.9% nitrogen, mixed and stirred evenly to obtain the B component;

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Abstract

The invention relates to light-emitting diode (LED) packaging silica gel and a preparation method thereof. The LED packaging silica gel comprises a component A and a component B according to weight proportion as 1:1. The component A is composed of the following raw materials, by weight, 95-96 parts of vinyl resin, 0.1-0.3 part of catalyst and 3-5 parts of adhesive. The component B is composed of the following raw materials, by weight, 85-95 parts of vinyl resin, 5-15 parts of cross-linking agent, and 0.1-0.3 part of inhibitor. The LED packaging silica gel is good in adhesive performance on various LED base materials, exceeds 98% in transmissivity, and is convenient and easy to operate and good in storage stability.

Description

technical field [0001] The invention relates to LED packaging silica gel and a preparation method thereof, belonging to the technical field of adhesives. Background technique [0002] LED light sources have long service life, high luminous efficiency, no radiation and low power consumption. They are widely used in various display screens, car lights, backlights and lighting of various electronic products. The choice of packaging materials has an impact on the performance of LEDs. It is very important. At present, the packaging materials used include epoxy resin, polymethyl methacrylate, glass, silicone and other highly transparent materials. Epoxy resin and silicone materials are the main packaging materials. The internal stress of epoxy resin is too large. Yellowing, poor high and low temperature resistance, and poor aging resistance, while the current silicone material has small internal stress, good high and low temperature resistance, no yellowing, and higher light trans...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05H01L23/29H01L33/56
Inventor 陈维庄恒冬王建斌陈田安
Owner YANTAI DEBANG ADVANCED SILICON MATERIALS
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