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Copper alloy wire for ball bonding

A technology of copper alloy wire and ball welding, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem of inhomogeneity of the interface state between the aluminum pad and the crimped ball, and achieve the effect of a stable and uniform welding area

Inactive Publication Date: 2018-04-24
TANAKA DENSHI KOGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the reason for this is uncertain, it is related to the degree of inhomogeneity of the solidification structure, and as a result, the interface state between the aluminum pad and the crimped ball becomes inhomogeneous

Method used

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  • Copper alloy wire for ball bonding
  • Copper alloy wire for ball bonding
  • Copper alloy wire for ball bonding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Commercially available electrolytic copper materials with a purity of 99.9999% by mass or more are blended with nickel (Ni) with a purity of 99.999% by mass or higher, 0.25% by mass, platinum (Pt) with a purity of 99.999% by mass or higher, 0.5% by mass, and sulfur (S)10. Mass ppm and phosphorus (P) 15 mass ppm, and a predetermined copper alloy wire was obtained. After the alloy was continuously cast, a diamond wire drawing mold was used for continuous wire drawing processing to obtain a wire with a diameter of 18 μm. After that, the final continuous annealing was performed at 500°C so that the elongation at normal temperature was 10%. After the wire was left in the atmosphere at room temperature for 3 days, the oxygen concentration of the alloy wire was measured, and it was 25 mass ppm. This bonding wire was used as Example 1.

[0053] Bonding test of the first bonding

[0054] Using a bonding device (device name: Iconn type manufactured by Kulicke & Soffa), 100 of the b...

Embodiment 2

[0057] In commercially available oxygen-free copper materials with a purity of 99.99% by mass or more, 0.5% by mass of nickel (Ni) with a purity of 99.99% by mass or more, palladium (Pd) with a purity of 99.99% by mass or more, 0.25% by mass, and sulfur (S) are blended. 15 mass ppm and 80 mass ppm of phosphorus (P) were obtained to obtain a predetermined copper alloy wire. After the alloy is continuously cast, a diamond wire drawing die is used for continuous wire drawing processing. The diameter of 60 μm during the continuous drawing process was heat-treated at 500° C. The elongation at room temperature was measured based on the diameter of the wire, and the result was 15%. After that, the continuous wire drawing process was performed again to process a wire rod with a final wire diameter of 18 μm, and the final continuous annealing was performed at about 550° C. so that the elongation rate at room temperature was 12%. After the wire was left in the atmosphere at room tempera...

Embodiment 3

[0061] In the commercially available phosphorus deoxidized copper material with a purity of 99.99% by mass or more, 1.0% by mass of nickel (Ni) with a purity of 99.99% by mass or more, 0.1% by mass of platinum (Pt) with a purity of 99.999% by mass or more, and 99.99% by mass are blended. The above palladium (Pd) 0.05 mass% and sulfur (S) 1 mass ppm were used to obtain a predetermined copper alloy wire. After continuous casting of the alloy, a diamond wire drawing die was used for continuous wire drawing processing to obtain a wire rod with a diameter of 18 μm. After that, the final continuous annealing was performed at about 550°C so that the elongation at room temperature was 12%. After the wire was left in the atmosphere at room temperature for 3 days, the oxygen concentration of the alloy wire was measured and the result was 36 mass ppm. This bonding wire was used as Example 3.

[0062] Bonding test of the first bonding

[0063] In the same manner as in Example 1, 100 bonding...

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Abstract

The invention provides a copper alloy wire for ball bonding. The copper alloy wire for ball bonding consists of 0.1-1.5% by weight of nickel, 0.01-1.5% by weight of platinum or palladium, 0.1-20 ppm by weight of sulphur, 10-80 ppm by weight of oxygen, and the balance being copper; and specially consists of 0.1-1.5% by weight of nickel, 0.01-1.5% by weight of platinum or palladium, 0.1-20 ppm by weight of sulphur, 10-100 ppm by weight of phosphorus, 10-80 ppm by weight of oxygen, and the balance being copper (Cu). By employing the copper alloy wire for ball bonding, even if a bonding wire is thinned and a molten ball is contracted, the welding face for crimping the ball does not spread to form a petaline shape, and a stable and uniform crimping shape can be ensured.

Description

Technical field [0001] The present invention relates to a copper alloy wire for ball bonding, and particularly to an improvement of the first bonding of the copper alloy wire for ball bonding. After the first bonding is performed on the pad electrode on the semiconductor component through FAB (free air ball) bonding , And then through stitch bonding, a second bonding is performed on the external electrodes on the lead frame. Background technique [0002] So far, alloys such as copper-nickel have hardly been considered as bonding wires. If nickel (Ni), platinum (Pt), or palladium (Pd) is added, the resistance of copper (Cu) increases. Therefore, if an alloy such as copper-nickel is used as the bonding wire, it has the disadvantage of losing the superiority of "a copper bonding wire characterized by low resistance instead of gold bonding wire". The following examples are related to copper-nickel alloy bonding wires. [0003] Japanese Patent Application Laid-Open No. 01-291435 (Pat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49
CPCH01L24/45H01L2224/45147H01L2224/45565H01L2924/01016H01L2924/01015H01L2924/01028H01L2924/01046H01L2924/01029H01L2924/01078H01L24/43H01L2224/43848H01L2224/05624H01L23/53233H01L21/244H01L23/49816H01L24/12H01L24/44H01L2021/60007
Inventor 高田满生天野裕之前田菜那子永江祐佳滨本拓也
Owner TANAKA DENSHI KOGYO KK
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