Method for preparing diamond/copper composite material by combining injection molding technology

A composite material, injection molding technology, applied in metal processing equipment, coating, transportation and packaging, etc., can solve the problems of diamond/Cu composite material machining difficulties, to overcome machining difficulties, simple production equipment, reduce production cost effect

Active Publication Date: 2018-03-30
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the machining of Diamond / Cu composites with a high volume fraction in the matrix is ​​extremely difficult, which has become a bottleneck for the practical application of this material

Method used

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  • Method for preparing diamond/copper composite material by combining injection molding technology

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1: the Diamond / Cu composite material part that preparation diamond volume fraction is 70%

[0015] Step 1: Weigh 10g of diamond powder, MoO 3 Powder 12g, mixed salt NaCl-KCl (molar ratio NaCl:KCl=1:1) 30g, use a powder mixer to mix evenly. The mixed powders were heated to 1000 °C for 3 h in a rapid heating tube electric furnace, during which an Ar atmosphere was introduced for protection. The reaction product is cleaned, dried, and sieved to obtain the surface-coated Mo 2 C layer of diamond powder.

[0016] Step 2: Weigh the coated Mo 2 C layer of diamond powder 8g placed in 0.4L of SnCl 2 (30g / L) deionized aqueous solution for surface sensitization, and then placed in 0.4L of PdCl 2 (0.25g / L) deionized aqueous solution for surface activation. Finally, the treated diamond powder is subjected to electroless copper plating, and 0.056L of copper sulfate plating solution is prepared, wherein the formula of copper sulfate plating solution is: CuSO 4 ·5H 2 ...

Embodiment 2

[0019] Embodiment 2: the Diamond / Cu composite material part that preparation diamond volume fraction is 60%

[0020] Step 1: Weigh 10g of diamond powder, MoO 3 Powder 24g, mixed salt NaCl-KCl (molar ratio NaCl:KCl=1:1) 40g, use a powder mixer to mix evenly. The mixed powder was heated to 1050 °C for 2 h in a rapid heating tube electric furnace, during which an Ar atmosphere was introduced for protection. The reaction product is cleaned, dried, and sieved to obtain the surface-coated Mo 2 C layer of diamond powder.

[0021] Step 2: Weigh the coated Mo 2 C layer of diamond powder 8g placed in 0.4L of SnCl 2 (30g / L) deionized aqueous solution for surface sensitization, and then placed in 0.4L of PdCl 2 (0.25g / L) deionized aqueous solution for surface activation. Finally, the treated diamond powder is subjected to electroless copper plating, and 0.280 L of copper sulfate plating solution is prepared, wherein the formula of copper sulfate plating solution is: CuSO 4 ·5H 2 O...

Embodiment 3

[0024] Embodiment 3: the Diamond / Cu composite material part that preparation diamond volume fraction is 50%

[0025] Step 1: Weigh 10g of diamond powder, MoO 3 Powder 36g, mixed salt NaCl-KCl (molar ratio NaCl:KCl=1:1) 50g, use a powder mixer to mix evenly. The mixed powder was heated to 1100 °C for 1 h in a rapid heating tube electric furnace, and an Ar atmosphere was introduced for protection during this period. The reaction product is cleaned, dried, and sieved to obtain the surface-coated Mo 2 C layer of diamond powder.

[0026] Step 2: Weigh the coated Mo 2 C layer of diamond powder 8g placed in 0.4L of SnCl 2 (30g / L) deionized aqueous solution for surface sensitization, and then placed in 0.4L of PdCl 2 (0.25g / L) deionized aqueous solution for surface activation. Finally, the treated diamond powder is subjected to electroless copper plating, and 0.592L of copper sulfate plating solution is prepared, wherein the formula of copper sulfate plating solution is: CuSO 4...

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Abstract

The invention relates to a method for preparing a diamond / copper composite material by combining an injection molding technology. The method comprises the steps of adopting a salt-bath plating technology for plating a layer of uniform Mo2C on a diamond surface so as to improve the wettability of diamond and copper, then adopting a chemical plating method for continuously plating the copper on a surface of the Mo2C layer, and controlling the thickness of a copper plating layer by controlling the Cu2+ content in a plating solution, so that double-plating Cu-Mo2C-Diamond powder with the copper-bearing volume fraction being 1 percent to 10 percents is prepared; then mixing the quantitative Cu-Mo2C-Diamond powder and a multi-polymer component paraffin base binder to form uniform feeding; afterpelletizing, achieving injection molding on an injection molding machine; and after enabling a preformed blank to pass through a solvent and to be subjected to thermal degreasing, pre-sintering at high temperature, carrying out a vacuum pressureless infiltration technology on the obtained blank, and permeating a copper liquid into a diamond framework through a capillary action of pores, so that adiamond / copper composite material part with high volume fraction is obtained. The method provided by the invention can be used for directly preparing the Diamond / Cu composite material part in a complicated shape, the diamond is high in volume fraction and uniform and compact in texture, and the diamond / copper composite material can be produced in batch and can be low in production cost.

Description

technical field [0001] The invention belongs to the forming technology of metal-matrix composite material components, and in particular provides a method for preparing Diamond / Cu (diamond / copper) composite materials combined with injection molding technology. The preparation of low-cost, high-performance metal matrix composite parts is realized. Background technique [0002] Due to its high thermal conductivity, thermal management materials can quickly transfer heat from high-temperature areas to low-temperature areas, achieving the purpose of coordinating the temperature difference between high-power devices and the system environment. At the same time, the thermal expansion coefficient mismatch between the thermal management material and the chip material can be improved through the efficient heat conduction of the thermal management material. Among them, particle-reinforced copper-based composites are the most studied and widely used composite materials in the field of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/22B22F1/02B22F3/10C22C9/00C22C26/00C22C32/00
CPCC22C9/00C22C26/00B22F3/1035B22F3/225C22C2026/006B22F2998/10B22F1/103B22F1/17B22F1/10
Inventor 何新波潘彦鹏任淑彬吴茂曲选辉
Owner UNIV OF SCI & TECH BEIJING
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