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UV photocuring glue applicable to electronic chip encapsulation

A light-curing adhesive and electronic chip technology, applied in adhesives, epoxy resin adhesives, non-polymer adhesive additives, etc., can solve the problems of poor aging resistance and poor degradation resistance, and achieve good physical protection, Strong aging resistance and good bonding performance

Inactive Publication Date: 2018-01-12
CHINA NAT ELECTRIC APP RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For example, ZL201310208218.1 discloses a UV light-curable adhesive, but this patent uses polyester polyol as a toughening agent. Polyester polyol is easy to absorb water and has poor degradation resistance. The cured product is not strong in aging resistance.

Method used

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  • UV photocuring glue applicable to electronic chip encapsulation
  • UV photocuring glue applicable to electronic chip encapsulation
  • UV photocuring glue applicable to electronic chip encapsulation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1 After irradiating for 40 seconds, it changed from a liquid state to a solid state. The hardness of the cured product was measured to be 72D, the tensile strength was 28MPa, and the glass transition temperature was 55°C;

Embodiment 2

[0031] Example 2 After irradiating for 60s, it changed from a liquid state to a solid state, and the hardness of the cured product was determined to be 85D, the tensile strength was 32MPa, and the glass transition temperature was 68°C;

Embodiment 3

[0032] Example 3 After irradiating for 60s, it changed from a liquid state to a solid state. The hardness of the cured product was determined to be 82D, the tensile strength was 30MPa, and the glass transition temperature was 66°C;

[0033] Example 4 After irradiating for 45 seconds, it changed from a liquid state to a solid state. The hardness of the cured product was measured to be 76D, the tensile strength was 29MPa, and the glass transition temperature was 63°C.

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Abstract

The invention discloses UV photocuring glue applicable to electronic chip encapsulation. The UV photocuring glue is prepared from the following components: epoxy resin, flexibilizer, inorganic fillerand a photoinitiator. According to the UV photocuring glue provided by the invention, polyurethane modified epoxy resin can be used as the flexibilizer, so that the UV photocuring glue has the advantages that a cured product is relatively high in aging resistance and high in adhesiveness. The UV photocuring glue can be used for encapsulation of semiconductor integrated circuit devices; during use,the UV photocuring glue can perform good physical protection.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to a UV photocurable adhesive suitable for electronic chip packaging. Background technique [0002] At present, microelectronic chip-level packaging mainly includes wire bonding (Wire Bonding), flip chip (Flipchip), through-silicon via (TSV, Through-Silicon-Via) and other processes, of which Wire Bonding still occupies a relatively large proportion. After packaging using the Wire Bonding process, it is generally necessary to provide additional plastic protection for the chip and gold wire / copper wire / aluminum wire. Mainstream materials used for overmolding include thermoplastics and liquid glues. Among them, the most widely used material is still black epoxy glue, which is encapsulated by dispensing and heat-cured. However, for mass continuous production, the use of epoxy vinyl has the disadvantages of long curing time, low efficiency, high energy consumption, and tak...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04
Inventor 杜彬胡嘉琦邓梅玲韩文生王玲
Owner CHINA NAT ELECTRIC APP RES INST
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