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Photosensitive resin composition, cover film and circuit board

A technology of photosensitive resin and composition, applied in the directions of printed circuit, printed circuit manufacturing, multilayer circuit manufacturing, etc., can solve the problems of increasing storage cost and deterioration risk, etc.

Active Publication Date: 2020-07-14
ZHEN DING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But, because the composition of this solder resist green paint ink contains epoxy resin, and epoxy resin easily reacts with the carboxylic acid group of main resin in the main agent at normal temperature, therefore, described solder resist green paint ink must be preserved in low temperature (temperature lower than 5°C), which increases the storage cost and the risk of deterioration to a certain extent

Method used

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  • Photosensitive resin composition, cover film and circuit board
  • Photosensitive resin composition, cover film and circuit board
  • Photosensitive resin composition, cover film and circuit board

Examples

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preparation example Construction

[0034] The preparation method of the photosensitive resin composition can be: the carboxylic acid modified bisphenol type epoxy (meth)acrylate, photosensitive monomer, photosensitive prepolymer, colorant solvent and photoinitiator etc. The ratio is added to the reaction bottle, mixed and stirred, and the carboxylic acid modified bisphenol epoxy (meth)acrylate, photosensitive monomer, photosensitive prepolymer, colorant and photoinitiator are mixed evenly, and the photosensitive resin is obtained. combination. The amount of addition of the solvent can be changed as required, as long as the carboxylic acid modified bisphenol type epoxy (meth)acrylate, photosensitive monomer, photosensitive prepolymer, colorant solvent and photoinitiator can Dissolve completely.

[0035] see figure 1 , a cover film 100 comprising a resin layer 20 and a release film 10 bonded to at least one surface of the resin layer 20 . The resin layer 20 is formed by coating the above-mentioned photosensiti...

Embodiment 1

[0039] Add 100g carboxylic acid modified bisphenol type epoxy (meth)acrylate, 30g propoxylated trimethylolpropane triacrylate, 10g dipentaerythritol hexaacrylate, 20g acrylate aminomethyl in the reaction bottle of 500ml in volume Ester, 7g 2-methyl-1-(4-methylthiophenyl)-2-morpholinyl-1-propanone, 3g isopropyl thioxanthone, 2g colorant, 40g methyl ethyl ketone, stir to dissolve , that is, a photosensitive resin composition is obtained.

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Abstract

A kind of photosensitive resin composition, it comprises carboxylic acid modified bisphenol type epoxy (meth) acrylate, photosensitive monomer, photosensitive prepolymer, photoinitiator and colorant, in this photosensitive resin composition Carboxylic acid-modified bisphenol-type epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer will undergo cross-linking reaction under the irradiation of ultraviolet light and solidify to form a dense network structure. The photosensitive resin composition has better storage properties, can be stored at room temperature for a long time, and can reduce the storage cost of the photosensitive resin composition. In addition, the present invention also provides a cover film made of the photosensitive resin composition, and a circuit board made of the cover film.

Description

technical field [0001] The invention relates to a photosensitive resin composition, a cover film made from the photosensitive resin composition, and a circuit board made from the cover film. Background technique [0002] In recent years, printed circuit boards have been widely used in various electronic products. At present, the photosensitive materials used in printed circuit boards are mainly solder resist green paint inks, which can provide a heat-resistant, moisture-resistant, and chemical-resistant outer protective layer for exposed conductive lines to prevent soldering. Lead or solder can cause short circuit of the circuit, and at the same time, it can protect the metal conductive circuit from the corrosion of corrosive solutions such as acid and alkali. [0003] At present, the solder resist green paint inks on the market generally include a main agent and a hardener. Wherein, the main agent is mainly composed of photosensitive curable epoxy acrylic resin, and the h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F283/10C08F222/16C08F220/34H05K3/28C09D4/02C09D4/06C09D7/40
CPCC08F283/105C09D4/06H05K3/287C08F220/32C08F222/103C08F222/106C08F220/34H05K3/064H05K2203/056C08F2/48G03F7/027G03F7/031G03F7/029G03F7/11H05K1/0373H05K3/46H05K2201/0104
Inventor 徐茂峰颜振锋向首睿萧嬿芹
Owner ZHEN DING TECH CO LTD
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