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A kind of nickel-gold method for improving missing plating

A technology of immersion nickel gold and immersion nickel, which is applied in the reinforcement of conductive patterns, cleaning/polishing of conductive patterns, printed circuits, etc., can solve the problems of missing plating of immersion gold boards and immersion nickel gold boards, and improve the potential difference , Reduce production costs, reduce the effect of production scrap

Active Publication Date: 2019-08-16
SHENZHEN SUNTAK MULTILAYER PCB
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the problem of missing plating on immersion gold plates with a thickness-to-diameter ratio greater than 8:1, and provides a method to solve the problem of missing plating on immersion gold plates with large aspect ratio and solder-resisting plug holes by adding stripping treatment after the pre-treatment of immersion gold. Plated immersion nickel gold method

Method used

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Embodiment

[0019] The invention provides a nickel-gold method for improving missing plating, using the method to coat a solderable coating on the bare copper surface of a multilayer board, and the multilayer board is provided with at least one bare layer for nickel-gold The copper surface and at least one plug hole filled with solder resist ink, the specific processing steps for coating the solderability coating are as follows:

[0020] S1, Immersion nickel gold pretreatment

[0021] The pretreatment of immersion nickel gold is carried out in this way: into the board (multi-layer board) → micro-etching (using NaS 2 o 8 and H 2 SO 4 solution for micro-etching) → overflow water washing twice → grinding plate (using 1000 mesh soft brush for grinding plate treatment) → sandblasting (using 280-320 mesh emery for sandblasting treatment) → flushing sewage → overflow water washing → ultrasonic immersion Washing→Water column flushing→Swing high pressure washing→DI washing→Drying→Cooling→Out o...

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PUM

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Abstract

The invention relates to the field of nickel-gold immersion of a printed circuit board, in particular to a nickel-gold immersion method capable of improving plating leakage. A plug hole generally adopts a solder resist ink plug hole, and thus, according to the method, by carrying out stripping processing on a multi-layer plate after nickel-gold immersion pretreatment, a chemical reaction of NaOH solution and in-hole residual microetchant in the plug hole is carried out, and by matching of a spraying mode, the NaOH solution can successfully enter the plug hole of which a thickness-to-diameter ratio is greater than 8:1, so that the in-hole residual microetchant in the plug hole is eliminated, the problem of an in-hole potential difference of the plug hole is greatly improved, preparation is made for subsequent nickel immersion processing, a plating leakage defect rate of a nickel-gold plate of the solder resist ink plug hole is reduced to 2% from previous 95%, production scraps are greatly reduced, and production cost is reduced.

Description

technical field [0001] The invention relates to the field of nickel-gold deposition on printed circuit boards, in particular to a nickel-gold deposition method for improving missing plating. Background technique [0002] Immersion nickel gold is a process of coating solderable coating on the bare copper surface of PCB. The principle is to perform electroless nickel plating on the bare copper surface, and then perform chemical immersion gold. The immersion nickel gold process can not only meet the increasingly complex PCB assembly and soldering requirements, but also has a lower cost than electroplating nickel gold. At the same time, it can also effectively protect the sides of the wires and prevent adverse phenomena during use. It is widely used in the production and manufacture of PCB. [0003] However, in the actual production process, there are often cases of missing plating on the nickel-coated gold plate. The reason for the missed plating is that the activity of the ni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/24H05K3/26
CPCH05K3/0088H05K3/0094H05K3/24H05K3/26H05K2203/0285H05K2203/0776
Inventor 徐正韩焱林田小刚李凯鸿
Owner SHENZHEN SUNTAK MULTILAYER PCB
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