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Chemical passivation processing method for surface of copper foil

A surface chemical and passivation treatment technology, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of high demand for electroplating process and poor economy, so as to improve anti-oxidation ability and prolong Oxidation time, efficiency improvement effect

Inactive Publication Date: 2017-09-15
江西铜博科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the electroplating process has a large demand for energy, and there is still a problem of poor economy.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Example 1. A copper foil surface chemical passivation treatment method, the copper foil is sent to a passivation tank containing a zinc-cobalt electroless plating solution with deionized water as a basic solvent for surface chemical replacement treatment, and the copper foil is made by oxidation-reduction reaction Metal deposition occurs on the surface; the zinc-cobalt-containing electroless plating solution contains sodium phosphate 8-20g / L, glucose 2-10g / L, zinc oxide 2-12g / L and cobalt sulfate heptahydrate 2-8g / L; The temperature of the electroless plating solution containing zinc and cobalt in the passivation tank is 20-50° C., and the pH value is 6-9. The passivation time is 5-8 seconds.

Embodiment 2

[0013] Example 2. In a copper foil surface chemical passivation treatment method, the copper foil is sent into a passivation tank containing a zinc-cobalt electroless plating solution with deionized water as a basic solvent for surface chemical replacement treatment, and the oxidation-reduction reaction is used to make the copper Metal deposition occurs on the foil surface; the zinc-cobalt-containing electroless plating solution contains sodium phosphate 10-16g / L, glucose 2-7g / L, zinc oxide 3-6g / L and cobalt sulfate heptahydrate 3-7g / L; the temperature of the zinc-cobalt-containing electroless plating solution in the passivation tank is 30-40° C., and the pH value is 7-8.

Embodiment 3

[0014] Example 3. A copper foil surface chemical passivation treatment method, by sending the copper foil into a passivation tank containing a zinc-cobalt electroless plating solution with deionized water as a basic solvent for surface chemical replacement treatment, using oxidation-reduction reactions to make copper Metal deposition occurs on the surface of the foil; the zinc-cobalt-containing electroless plating solution contains 10 g / L of sodium phosphate, 2 g / L of glucose, 3 g / L of zinc oxide, and 3 g / L of cobalt sulfate heptahydrate; The temperature of the zinc-cobalt-containing electroless plating solution in the chemical bath is 35° C. and the pH value is 7. The passivation time is 6 seconds.

[0015] Test the passivated copper foil: the passivated copper foil is placed in the experimental environment with a temperature of 140°C for 30 minutes, the copper foil will not change color, and no oxidation reaction will occur; the passivated copper foil will not change color ...

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PUM

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Abstract

The invention discloses a chemical passivation processing method for the surface of a copper foil. A copper foil is fed in a passivation tank where a zinc and cobalt-containing chemical plating solution taking deionized water as a basic solvent is stored for surface chemical replacement processing, and metal deposition is generated on the surface of the copper foil by using redox reaction. The zinc and cobalt-containing chemical plating solution contains 8-20g / L of sodium phosphate, 2-10g / L of glucose, 2-12g / L of zinc oxide and 2-8g / l of cobaltous sulfate heptahydrate. The chemical passivation processing method has the characteristics of capabilities of reducing energy consumption and reducing pollutant emission and better passivation effect.

Description

technical field [0001] The invention relates to a copper foil treatment method, in particular to a copper foil surface chemical passivation treatment method. Background technique [0002] During the transportation, storage and production of copper clad laminates, copper foil often encounters water vapor, dust, oxidation, and even fingerprint pollution from the external environment, causing discoloration spots on the copper foil surface; After high temperature pressing and PCB processing, local discoloration and copper oxide spots will appear on the copper foil surface, and these changes on the copper foil surface will affect the solderability of the copper surface, affinity with ink, and adhesion. Sex, and will increase the line resistance, need to passivate the surface of copper foil. The current passivation treatment generally uses chromic acid to treat the surface of copper foil to form a chromium oxide protective layer. The chromium oxide protective layer has many gaps,...

Claims

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Application Information

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IPC IPC(8): C23C18/48
CPCC23C18/48
Inventor 林腾光左亚平陈培钿张立钿
Owner 江西铜博科技股份有限公司
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