Variable volume condenser for capillary pumped loop

Abstract

The invention relates to a variable volume condenser for a capillary pumped loop, and particularly relates to a capillary pumped loop for cooling an electronic chip. The capillary pumped loop is provided with a condenser, a cylinder, a liquid storage chamber, a water pump, an electromagnetic valve, a linear motor, a pressure sensor, a single chip microcomputer and a plurality of copper pipes, wherein the cylinder is in sealing connection with the top of the condenser through the copper pipes; the linear motor is connected with a piston of the cylinder; both ends of the water pump are respectively connected with the cylinder and the liquid storage chamber through the copper pipes; the electromagnetic valve is installed at an inlet of the water pump; the pressure sensor is installed at an inlet of the condenser; and the single chip microcomputer is used for collecting pressure signals of the pressure sensor and controlling the electromagnetic valve, the water pump and the linear motor to operate according to established procedures.

Description

technical field [0001] The invention relates to a capillary pump ring for heat dissipation of an electronic chip, in particular to a variable volume condenser for the capillary pump ring. Background technique [0002] With the rapid development of microelectronics technology, the main frequency and integration of processors are getting higher and higher, and the power consumption of chips per unit volume has increased sharply, resulting in an increase in heat flux. For example, the heat flux density of a 1W LED lamp bead has reached 100W / cm 2 ; Another example, the heat flux of the computer CPU is generally 60 ~ 100W / cm 2 , some even as high as 200W / cm 2 . When the heat flux of the electronic chip exceeds 0.08W / cm 2 When the heat dissipation method is no longer sufficient for natural heat dissipation; when the heat flux density exceeds 0.3W / cm 2 , the forced convection cooling has reached its limit. The thermal control of high heat flux chips has become a bottleneck re...

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Problems solved by technology

[0004] However, the current capillary pump rings are all fixed volume, that is, after the design, processing and installation are completed, the internal volume cannot be adjusted, which will bring challenges to the scope of use of the capillary pump ring.

If the internal volume is designed too high, the capillary pump ring cannot start smoothly under low heat load, and the sensitivity is not high; if the internal volume is designed too low, the internal pressure will be too high under high heat load, the boiling point of the liquid will rise, and the heat transfer efficiency will be affected

For example, when the heat load is 200W, the internal pressure of the capillary pump ring has exceeded 6 standard atmospheric pressure, which not only reduces the heat transfer efficiency, but also increases the safety hazards of use.

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