Ionic type memristor having quantum conductance effect
An ion-type, memristor technology, applied in semiconductor devices, circuits, electrical components, etc., can solve problems such as unfavorable applications of strong artificial intelligence devices
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Embodiment 1
[0042] In this embodiment, it is based on the structure of "top electrode / tunneling layer / oxide layer / ion-doped layer / bottom electrode". As shown in FIG. 2( a ), the structure consists of five layers from bottom to top: bottom electrode 104 , ion-doped layer 103 , oxide layer 102 , tunneling layer 101 and top electrode 100 . The bottom electrode 104 is made of platinum with a thickness of 100 nanometers; the ion-doped layer 103 is made of lithium-ion-doped hafnium dioxide with a thickness of 30 nanometers; the oxide layer 102 is made of 30 nanometers of hafnium dioxide; the thickness of the tunneling layer 101 is selected to be 0.34 nanometer single-layer graphene; the top electrode 100 selects 100 nanometer titanium nitride.
[0043] The structure is prepared layer by layer on the substrate from bottom to top by using methods such as pulsed laser deposition, atomic layer deposition, magnetron sputtering, electron beam evaporation, etch transfer. First, a layer of metal plati...
Embodiment 2
[0046] In this embodiment, it is based on the structure of "top electrode / ion-doped layer / oxide layer / tunneling layer / bottom electrode". As shown in FIG. 2( b ), the structure consists of five layers from bottom to top: bottom electrode 104 , tunneling layer 101 , oxide layer 102 , ion-doped layer 103 and top electrode 100 . The bottom electrode 104 is copper with a thickness of 100 nanometers; the tunneling layer 101 is a single-layer graphene with a thickness of 0.34 nanometers; the oxide layer 102 is tantalum pentoxide with a thickness of 30 nanometers; the ion-doped layer 103 is doped with Na ions Tantalum pentoxide with a thickness of 30 nanometers; the top electrode 100 is tantalum nitride with a thickness of 100 nanometers.
[0047] The structure is prepared layer by layer on the substrate from bottom to top by laser pulse deposition, atomic layer deposition, magnetron sputtering, chemical vapor deposition, electron beam evaporation and other methods. First, a layer of...
Embodiment 3
[0050] In this embodiment, it is based on the structure of "top electrode / oxide layer / tunneling layer / ion-doped layer / bottom electrode". As shown in FIG. 2( c ), the structure consists of five layers from bottom to top: bottom electrode 104 , ion-doped layer 103 , tunneling layer 101 , oxide layer 102 and top electrode 100 . The bottom electrode 104 is gold with a thickness of 100 nanometers; the ion-doped layer 103 is lithium cobalt oxide with a thickness of 30 nanometers; the tunneling layer 101 is a single-layer molybdenum disulfide with a thickness of 0.4 nanometers; silicon dioxide; the top electrode 100 selects 100 nanometers of platinum.
[0051] The structure is prepared layer by layer on the substrate from bottom to top by using methods such as pulsed laser deposition, atomic layer deposition, magnetron sputtering, transfer technology, and electron beam evaporation. First, a layer of metal gold is prepared on a flat and clean substrate by electron beam evaporation as...
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