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Measuring device for interface bonding strength of superfine abrasive and base material

A technology of interface bonding strength and matrix material, which is applied in the directions of measuring devices, analyzing materials, using mechanical devices, etc., to achieve the effects of simple measurement conditions, low use cost, and easy operation.

Inactive Publication Date: 2017-07-21
HUAQIAO UNIVERSITY
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  • Abstract
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  • Claims
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Problems solved by technology

At present, the detection of the interface bonding strength between abrasives and substrates is mostly focused on the interface between large-grain single crystal diamond and different matrices, and there is a serious lack of measuring devices for the interface bonding strength between ultrafine abrasives and polymer material substrates

Method used

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  • Measuring device for interface bonding strength of superfine abrasive and base material

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Embodiment Construction

[0019] The present invention will be further described below through specific embodiments.

[0020] refer to figure 1 , a device for measuring the interfacial bonding strength of ultrafine abrasives and base materials, comprising: an optical flat plate 1, a sample stage 7, a probe 5, a first sliding stage 8, a second sliding stage 2, a microscopic amplification system and a force measuring device Wait. The light panel is L-shaped. The sample stage 7 is used for bonding the tested sample 6, which is a grinding and polishing tool with a polymer material binder as the matrix. The abrasive contained in the test sample 6 includes one or more combinations of diamond, cubic boron nitride, boron carbide, silicon carbide, aluminum oxide, silicon dioxide, zirconia, iron oxide, chromium oxide and cerium oxide, which The particle size is 0.1μm-0.1mm.

[0021] The first sliding table 8 is fixed on the bottom of the optical flat plate 1 , and its top is connected to drive the sample sta...

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Abstract

The invention discloses a measuring device for interface bonding strength of a superfine abrasive and a base material. The device comprises an optical flat plate, a sample table, a probe, a first sliding table, a second sliding table, a microscopic amplification system and a force measuring device. The first sliding table is connected with the sample table to drive the sample table to move in the XOY plane, so as to adjust the position of a to-be-detected sample; the to-be-detected sample is enlarged by the microscopic amplification system and the contact area between pulled abrasive grains and the base material is measured; the second sliding table drives a connection plate to lift up and down along the Z axis so as to enable the probe to be bonded with the single abrasive grains on the to-be-detected sample or the abrasive grains to be pulled out from the base material; the force measuring device comprises a force sensor, a charge amplifier, a data acquisition card and a host. Data of the interface bonding strength are calculated according to pull force and contact area. The device can perform relatively accurate quantitative measurement of the interface bonding strength between the ultrafine abrasive and the base material, and the device is simple in structure, high in measurement precision, convenient to main and low in measurement cost.

Description

technical field [0001] The invention relates to a device for measuring the interface bonding strength of ultrafine abrasives and matrix materials. Background technique [0002] The interfacial bonding strength is a characteristic reflecting the material interface, which refers to the ability to resist the interface being mechanically separated. In grinding and polishing tools, the bonding strength between the abrasive and the matrix is ​​expressed as the ability of the abrasive to still be embedded on the surface of the bonding agent matrix. It is the most critical indicator for evaluating the quality of the tool and the basis for ensuring that the tool meets its mechanical, physical and chemical performance. premise. At present, the detection of the interface bonding strength between abrasives and substrates is mostly focused on the interface between large-grain single crystal diamond and different matrices, and there is a serious lack of measuring devices for the interfac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 陆静姜峰徐西鹏俞能跃许永超沈剑云
Owner HUAQIAO UNIVERSITY
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