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Packing contained composite material, sheet and circuit board containing same

A composite material and sheet technology, applied in the direction of circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problems of small molecular weight, complex use, low solid content and so on

Active Publication Date: 2017-07-07
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at present, liquid crystal polyester resin is difficult to make into solution or dispersion liquid, its solid content is very low, and its molecular weight is small, so it is complicated to use, and because the liquid crystal polyester made into solution contains more active groups, the reactivity is very high , will deteriorate the dielectric properties and heat resistance of the laminate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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  • Packing contained composite material, sheet and circuit board containing same
  • Packing contained composite material, sheet and circuit board containing same
  • Packing contained composite material, sheet and circuit board containing same

Examples

Experimental program
Comparison scheme
Effect test

preparation example

[0103] The liquid crystal polymer fiber non-woven fabric was prepared by the melt-blown method. That is, liquid crystal polymer resin (Polyplastics Co., Ltd., LAPREOS) is melted with a single-screw extruder (caliber 30mm, L / D = 24), and then introduced into a special mold with a flow adjustment structure and a heated air introduction structure, and then from the mold The spinning nozzle on the top (has 10 circular molten resin discharge holes (inner diameter 400 μm) and slit-shaped gas discharge holes (width 1 mm), these molten resin discharge holes are arranged in a row with an effective width of 5 cm, and the gas The ejection holes can eject heated air in parallel with the arrangement direction, thereby applying tensile stress to the molten resin.) and stretched to form fibers. And the fibers are collected on the surface of the film substrate to form a non-woven fabric to be finished with a width of about 5 cm. Then, the nonwoven fabric to be finished is passed between a pa...

Embodiment 1

[0111] The sheet-like liquid crystal polymer fiber non-woven fabric (average fiber diameter is 2.6 μ m, unit weight is 22 g / m 2 , thickness 50 μm, porosity about 75%, pore diameter between fibers is about 15 μm), in spherical silica powder slurry (spherical silica powder particle size D90 is 3 μ m, D50 is about 1 μ m, slurry is 70% methyl ethyl ketone Suspension), then pass through a gap of 0.1mm, scrape off the surface slurry, dry off the solvent, then soak again, pass through the gap and dry off the solvent, repeat three times. Dry the non-woven fabric impregnated with slurry in a blast oven at 155°C for 5 minutes, beat the dried non-woven fabric to remove the filler on the surface. Then laminate 3 sheets of non-woven fabrics containing fillers, and cover both sides with polytetrafluoroethylene film as a release film. At 350 ° C, in a vacuum environment, heat press in an electric heating press for 1 hour at a pressure of 6 MPa to obtain a filler-containing Liquid crystal re...

Embodiment 2

[0117] The sheet-like liquid crystal polymer fiber non-woven fabric (average fiber diameter is 2.6 μ m, unit weight is 22 g / m 2 , thickness 50 μm, porosity about 75%, pore diameter between fibers is about 15 μm), in spherical silica powder slurry (spherical silica powder particle size D90 is 3 μ m, D50 is about 1 μ m, slurry is 70% methyl ethyl ketone Suspension), then pass through a gap of 0.1mm, scrape off the surface slurry, dry off the solvent, then soak again, pass through the gap and dry off the solvent, repeat three times. Dry the non-woven fabric impregnated with slurry in a blast oven at 155°C for 5 minutes, beat the dried non-woven fabric to remove the filler on the surface. Then laminate 3 sheets of non-woven fabric, cover both sides with 18 μm copper foil, and heat press in an electric heating press for 1 hour at 350° C. under a vacuum environment with a pressure of 6 MPa to obtain a liquid crystal polymer resin circuit substrate containing fillers.

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Abstract

The invention belongs to the technical field of copper-clad plates and relates to a packing contained thermoplastic liquid crystal polymer composite material, a prepreg and a circuit board. The packing contained composite material includes a three-dimensional net-structure material and packing spread in pores of the three-dimensional net-structure material, and the three-dimensional net-structure material is mainly formed by mutual lapping or adhering of thermoplastic liquid crystal polymer fibers. By the arrangement of the packing contained composite material, the prepreg and the circuit board which are obtained are isotropic in X and Y directions in dielectric constant, low in the dielectric constant and dielectric loss and good mechanical performance.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and relates to a composite material containing a filler, a sheet material and a circuit substrate containing the same. Background technique [0002] Liquid Crystalline Polymer (LCP) is a new type of polymer material developed in the early 1980s. Because of its small linear expansion coefficient, low molding shrinkage and water absorption, it has excellent heat resistance, Dimensional stability, chemical resistance, flame retardancy, electrical properties and molding processability; and high molecular structure symmetry, weak dipole polarization, low dielectric constant and dielectric loss (it is in the frequency range of 1 to 40GHz The internal dielectric constant is about 3, and the dielectric loss tangent is less than 0.003). Therefore, it is widely used in the fields of electronics, optical fiber communication, chemical industry, military machinery, aerospace, automobile manufac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/00C08L77/00C08L101/12C08K3/36C08K7/06C08K3/24B32B27/02B32B37/12B32B27/18H05K1/03
CPCB32B5/26B32B27/18B32B37/12B32B2262/02B32B2457/08C08J5/18C08J2300/12C08J2367/00C08J2377/00C08K3/24C08K3/36C08K7/06C08L2203/16C08L2203/20H05K1/0373C08L67/00C08L77/00C08L101/12
Inventor 孟运东陈广兵方克洪
Owner GUANGDONG SHENGYI SCI TECH
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