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Graphite copper foil composite heat radiating plate

A composite heat sink and copper foil technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of interlayer debonding, low heat dissipation efficiency of composite heat sink, short service life, etc., to reduce interface thermal resistance, excellent Mechanical properties, thermal conductivity and heat dissipation, and the effect of avoiding interlayer debonding

Pending Publication Date: 2017-06-13
DONGGUAN HONGYI THERMAL CONDUCTMTY MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a graphite-copper foil composite heat sink to solve the problems of low heat dissipation efficiency, narrow application range, easy occurrence of interlayer degumming and short service life of the existing composite heat sink.

Method used

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  • Graphite copper foil composite heat radiating plate
  • Graphite copper foil composite heat radiating plate
  • Graphite copper foil composite heat radiating plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] like figure 1 As shown, a graphite-copper foil composite heat sink includes a mesh-shaped copper foil 1, and a graphite film 2 compounded on the mesh-shaped copper foil 1 by calendering technology, wherein the thickness of the mesh-shaped copper foil 1 is 0.5mm, and the graphite The thickness of the film 2 is 0.05mm; the porosity of the mesh copper foil 1 is 60%, and the aperture size is 0.01mm; the thermal conductivity of the composite heat sink is 2000W / m·K in the horizontal direction, and 800W / m in the vertical direction ·K.

[0033] The preparation method of the composite heat sink comprises the following steps:

[0034] Step 1. Select polyimide as the raw material, place it in a carbonization furnace for carbonization, the carbonization temperature is 1000°C, and the carbonization time is 8 hours; then move the carbonized material to the graphitization furnace for graphitization, the graphitization temperature The temperature is 2500°C, the graphitization time is...

Embodiment 2

[0040] like figure 2 As shown, a graphite copper foil composite heat sink includes a mesh copper foil 1, and a graphite film 2 laminated on both sides of the mesh copper foil 1 through a calendering technology, wherein the mesh copper foil 1 has a thickness of 0.01 mm, the thickness of the single-layer graphite film 2 is 0.01mm; the porosity of the mesh copper foil 1 is 40%, and the pore size is 0.002mm; the thermal conductivity in the horizontal direction of the composite heat sink is 1500W / m·K, and the thermal conductivity in the vertical direction is 1500W / m·K. The coefficient is 500W / m·K.

[0041] The preparation method of the composite heat sink includes the following steps:

[0042] Step 1: Select polybenzoxazole as the raw material, place it in a carbonization furnace for carbonization, the carbonization temperature is 800°C, and the carbonization time is 5h; then the carbonized material is moved to a graphitization furnace for graphitization, graphitization The temper...

Embodiment 3

[0048] like figure 2 As shown, a graphite copper foil composite heat sink includes a mesh copper foil 1, and a graphite film 2 compounded on both sides of the mesh copper foil 1 by a rolling forming technology, wherein the thickness of the mesh copper foil 1 is 2mm , the thickness of the single-layer graphite film 2 is 1mm; the porosity of the mesh copper foil 1 is 80%, and the pore size is 2mm; the thermal conductivity of the composite heat sink is 2500W / m·K in the horizontal direction and 1000W in the vertical direction. / m·K.

[0049] The preparation method of the composite heat sink includes the following steps:

[0050] Step 1. Select polyimide as the raw material and place it in a carbonization furnace for carbonization. The carbonization temperature is 1400°C and the carbonization time is 10h; then the carbonized material is moved to a graphitization furnace for graphitization, and the graphitization temperature is is 2800°C, the graphitization time is 10h, and the g...

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Abstract

The invention belongs to the technical field of a heat radiating plate, and particularly to a graphite copper foil composite heat radiating plate. The graphite copper foil composite heat radiating plate comprises a net-shaped copper foil, and a graphite film which is formed on at least one surface of the net-shaped copper foil through calendaring molding technology. The porosity of the net-shaped copper foil is 40-80%. The hole diameter is 0.002-2 mm. Compared with the prior art, the graphite copper foil composite heat radiating plate is advantageous in that the graphite film is formed on the net-shaped copper foil through calendaring molding technology; because no adhesive is used, interface thermal resistance is greatly reduced, and furthermore interlayer adhesive failure generated on the composite heat radiating plate is effectively prevented, thereby realizing excellent mechanical performance, high heat guiding performance and high heat radiating performance of the composite heat radiating plate, and greatly prolonging service life of the composite heat radiating plate. Furthermore, if porosity of the graphite copper foil composite heat radiating plate is overhigh, mechanical strength of the copper foil is reduced; and if porosity is overlow, combining strength between the copper foil and the graphite film is reduced. If the size of a mesh hole is overlarge, the graphite film cannot be closely combined with the copper foil; and if the size of the mesh hole is oversmall, insufficient combining force between the graphite film and the copper foil is caused.

Description

technical field [0001] The invention belongs to the technical field of heat sinks, in particular to a graphite-copper foil composite heat sink. Background technique [0002] With the development of large-scale integrated circuits and packaging technology, electronic components and electronic equipment are developing in the direction of thin, light and small, the integration of electronic products is getting higher and higher, and the number of electronic components per unit area is increasing geometrically. , heat dissipation has become a very prominent problem. If the heat is not dissipated in time, it will cause the operating temperature of the components to rise, and in severe cases, the electronic components will fail, which will directly affect the life and reliability of various high-precision equipment using them. . Therefore, how to dissipate heat has become a bottleneck in the miniaturization and integration of electronic products. [0003] At present, some produc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L23/367H01L21/48
CPCH01L21/4882H01L23/3672H01L23/3735H01L23/3736H01L23/3738
Inventor 朱全红
Owner DONGGUAN HONGYI THERMAL CONDUCTMTY MATERIAL CO LTD
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