Adhesive tape for semiconductor wafer surface protection

Abstract

The object of the present invention is to provide an adhesive tape for protecting the surface of a semiconductor wafer, which does not cause floating phenomenon even if it is attached to a semiconductor wafer having gold bumps and placed, and is suitable for polishing the back surface of a semiconductor wafer. During this time, dust or water will not be immersed, and the semiconductor wafer can be ground into a film, and the semiconductor wafer can be peeled off without cracking or residual glue. The means for solving the problem is an adhesive tape for protecting the surface of a semiconductor wafer, which has at least an adhesive layer and a base film, and the adhesive layer is not cured by the irradiation of energy rays, and the peeling speed is reduced at 23°C. The ratio B / A of the adhesive force A of the SUS280 abrasive surface at 50mm / min to the adhesive force B of the SUS280 abrasive surface at a peeling speed of 500mm / min is lower than 4.0, and for the SUS280 abrasive surface at a peeling speed of 300mm / min The adhesive force is 1.2-4.5N / 25mm at 23°C, and the adhesive force at 50°C is less than 50% of the adhesive force at 23°C.

Description

technical field [0001] The invention relates to an adhesive tape for protecting the surface of a semiconductor wafer. More specifically, it relates to an adhesive tape for semiconductor wafer surface protection used when polishing a semiconductor wafer into a thin film. Background technique [0002] Semiconductor packaging is manufactured by cutting high-purity monocrystalline silicon into semiconductor wafers, and then forming integrated circuits on the surface of the wafers by ion implantation and etching. The back surface of the semiconductor wafer on which the integrated circuit is formed is ground, and the semiconductor wafer is made into a desired thickness by grinding or other methods. At this time, in order to protect the integrated circuits formed on the surface of the semiconductor wafer, an adhesive tape for protecting the surface of the semiconductor wafer can be used. After the back grinding, the semiconductor wafers will be stored in the wafer box after the b...

AI Technical Summary

Problems solved by technology

[0011] However, since the surface of the gold bump is very rough in many cases, after the adhesive tape for protecting the surface of the pressure-sensitive semiconductor wafer is peeled off, the residue of the adhesive layer adheres to the surface of the gold bump. question

Therefore, if the adhesive residue is not allowed to occur, after the adhesive tape for protecting the semiconductor wafer surface is bonded to the semiconductor wafer, the adhesive tape for protecting the semiconductor wafer surface will float from the semiconductor wafer over time, When the thickness accuracy after grinding deteriorates or dust enters during grinding

Adhesion to gold bumps during grinding and peelability after grinding have a mutual compensation relationship, and it is impossible to balance both

[0012] For this problem, develop a kind of by adjusting the contact angle value etc. to diiodomethane to improve the adhesive tape for ultraviolet curable semiconductor wafer surface protection of releasability (refer for example patent document 4), or similarly borrow Pressure-sensitive adhesive tapes for protecting the surface of semiconductor wafers whose releasability is improved by adjusting the value of the contact angle to diiodomethane (see, for example, Patent Document 5), as long as these adhesive tapes for protecting the surface of semiconductor wafers are used, can solve the problem of residual glue on the active surface, but the adhesion and peelability of the gold bumps still cannot be satisfied at the same time.

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