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Diamond grinding wheel and production method thereof

A technology of diamond grinding wheel and production method, applied in bonded grinding wheel, metal processing equipment, abrasives, etc., can solve the problems of thermal damage, limited service life of grinding wheel, graphitization of diamond abrasive grains, etc.

Inactive Publication Date: 2017-01-11
HUNAN CITY UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, due to the limitation of the characteristics of the brazing process, generally only a brazed diamond grinding wheel with a single layer of abrasive grains can be prepared, resulting in that the grinding wheel cannot be used after being worn, and the service life of the grinding wheel is extremely limited.
In addition, in order to realize the metallurgical combination of metal bond and diamond abrasive grains in the brazing process, it is often necessary to continuously place the grinding wheel in a high temperature environment, resulting in graphitization and thermal damage of diamond abrasive grains

Method used

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  • Diamond grinding wheel and production method thereof
  • Diamond grinding wheel and production method thereof
  • Diamond grinding wheel and production method thereof

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Experimental program
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Embodiment 1

[0043] Depend on Figure 1 to Figure 6 As can be seen, a kind of production method of diamond grinding wheel, it comprises the following steps:

[0044] ⑴Processing the grinding wheel base 1: the cylindrical grinding wheel base 1 is made of steel;

[0045] The steel material used in the grinding wheel base 1 of the present invention is No. 45 steel, and the diamond abrasive grains 4 are truncated octahedral single crystal diamonds with a particle size of 40 mesh (0.42mm-0.45mm) (diamond abrasive grains in this embodiment 4 with a particle size of 0.44mm).

[0046] (2) Cleaning: Place the grinding wheel substrate 1 and diamond abrasive grains 4 in an organic solvent for ultrasonic cleaning to remove impurities such as oil stains and oxide layers on the surface;

[0047] (3) Hole layout: use a laser galvanometer scanning device (two-dimensional galvanometer short pulse laser scanning device), select appropriate laser parameters such as pulse width, average power, and pulse fre...

Embodiment 2

[0066] In this embodiment, the particle diameter of the diamond abrasive grain 4 is 0.44mm; the sintering temperature described in step (7) is 765°C; the thickness of the annular metal sheet 7 is 35% of the abrasive grain diameter; the diameter of the positioning hole 71 is the abrasive grain diameter 75%; the diameter of the powder hole 72 is three times the diameter of the positioning hole 71; the Cu content in the copper base is 55%, the Sn content is 30%, and the Ti content is 5%; the diamond abrasive grains 4 on the working surface (the uppermost layer of the abrasive layer 22) The cutting edge height is 55% of the abrasive grain height; the abrasive layer 22 includes a 10-layer "sandwich" structure.

[0067] The rest are the same as embodiment 1.

Embodiment 3

[0069] In this embodiment, the particle diameter of the diamond abrasive grains 4 is 0.45mm; the sintering temperature described in step (7) is 785°C; the thickness of the annular metal sheet 7 is 40% of the abrasive grain diameter; the diameter of the positioning hole 71 is the abrasive grain diameter 80%; the diameter of the powder hole 72 is 5 times the diameter of the positioning hole 71; the Cu content in the copper base is 60%, the Sn content is 27%, and the Ti content is 13%; the diamond abrasive grains on the working surface (the uppermost layer of the abrasive layer 22) The cutting edge height is 60% of the abrasive grain height; the abrasive layer 22 includes a 15-layer "sandwich" structure.

[0070] The rest are the same as embodiment 1.

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Abstract

The invention discloses a diamond grinding wheel, which has multi-layer abrasive particle orderly arrangement, is high in bonding strength and is convenient to repair after being worn, and a production method thereof. The production method comprises steps of processing a grinding wheel basal body, cleaning and the like. According to the diamond grinding wheel and the production method thereof disclosed by the invention, a laser material increasing technology is adopted to accurately process, so that processing precision and processing quality are improved; a sandwich structure is adopted for sintering, so that the abrasive particles are prevented from moving, protruding height of the abrasive particles is guaranteed to be consistent, orderly arrangement of the diamond abrasive particles is realized, a chip space during grinding is great, grinding force is reduced, a grinding temperature is reduced, grinding efficiency is improved, and grinding surface quality is improved; power of a laser unit is controlled for controlling a sintering temperature, so that the diamond abrasive particles are prevented from graphitizing, and a metal bonder is combined with the diamond abrasive particles in a high-strength metallurgical mode; a manufacturing process further can be simplified; and the diamond grinding wheel is finished layer by layer after being worn, and then is continuously used, so that finishing is convenient, and the service life of the diamond grinding wheel is long.

Description

technical field [0001] The invention relates to an abrasive abrasive tool, in particular to a diamond grinding wheel and a production method thereof. Background technique [0002] Using diamond abrasives as raw materials, metal powder, resin powder, ceramics and electroplated metals are used as binders respectively, and the circular bonded abrasive with a through hole in the center is called a diamond grinding wheel. Due to the characteristics of diamond abrasives (high hardness, high compressive strength, and good wear resistance), diamond abrasives become an ideal tool for grinding hard and brittle materials and cemented carbide in grinding processing. High, good roughness, less consumption of abrasive tools, long service life, and improved working conditions at the same time. Therefore, it is widely used in metals with low iron content and non-metallic hard and brittle materials that are difficult to process with ordinary abrasive tools, such as cemented carbide, high al...

Claims

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Application Information

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IPC IPC(8): B24D7/06B24D18/00
CPCB24D7/066B24D18/0045B24D18/0072B24D18/009
Inventor 殷赳文明才阳同光范彬袁聪尹旭妮
Owner HUNAN CITY UNIV
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