A kind of method for preparing copper-based diamond composite material

A composite material and diamond technology, which is applied in the field of preparation of copper-based diamond composite materials, to achieve the effects of reduced post-processing, high density and simple process

Active Publication Date: 2016-08-24
BEIJING GANG YAN DIAMOND PROD CO +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The object of the present invention is to provide a kind of method for preparing copper-based diamond composite material, the method adopts isostatic pressing near net shape technology to prepare diamond / copper composite material, the diamond / copper composite material thermal conductivity and thermal expansion coefficient prepared by the method And other key indicators are high and ideal, and solve the problem of near-net shape of diamond / copper, the method is simple, and the consistency of material performance is very good

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] In the copper-based diamond composite material prepared in this embodiment, the mass percentage of diamond is 40%.

[0045] The preparation method is as follows:

[0046] (1) The method of magnetron sputtering is used to plate a Cr coating of 0.5 μm on the surface of diamond powder with a particle size of 200 μm to form a Cr-coated diamond single crystal;

[0047] (2) According to the final size recorded in the copper-based diamond composite material drawing prepared by the present embodiment, the commercially available No. 1 oxygen-free copper plate is processed into an oxygen-free copper mould;

[0048] (3) according to the diamond tap density measured in advance, calculate the diamond weight according to m=ρv to be 12g, then take by weighing 12g of Cr-plated diamond and pour it into an oxygen-free copper mold to vibrate;

[0049] (4) Add dropwise an aqueous aluminum phosphate solution with a mass percentage concentration of 30% to the vibrated Cr-coated diamond, the...

Embodiment 2

[0053] In the copper-based diamond composite material prepared in this example, CuB 2 The mass percentage content of the alloy is 38%, and the mass percentage content of the diamond is 62%.

[0054] (1) placing high-purity B powder and pure copper block in a vacuum intermediate frequency smelting furnace for smelting, and finally obtaining a copper-boron alloy ingot with a B content of 2wt%;

[0055] (2) Rolling the above-mentioned copper-boron alloy ingot to be thinned to a required thickness to obtain a copper-boron alloy plate;

[0056] (3) According to the final size recorded in the copper-based diamond composite material drawing prepared in this embodiment, the above-mentioned copper-boron alloy plate is processed into a mould;

[0057] (4) according to the diamond tap density measured in advance, calculate the diamond weight according to m=ρv is 10g, take by weighing 10g grain size and be the diamond single crystal of 100 μ m and pour it into the above-mentioned mold an...

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Abstract

The invention discloses a method for preparing a copper-based diamond composite material. The method comprises the following steps: processing a copper alloy / pure copper material into a final size of a diamond / copper product to serve as a mold, then pouring diamond single crystal / coated diamond granules into the mold, jolt ramming, and dripping an adhesive solution; vacuum treating at 200-600 DEG C to prepare a porous diamond skeleton blank; filling the porous diamond skeleton blank and the copper alloy / pure copper mold in a sheath, carrying out hot isostatic pressure treatment, and cooling to obtain the composite material. The method disclosed by the invention can be used for achieving near-net forming, the post processing capacity is small, the process is simple and reliable, the prepared diamond / copper composite material is good in performance uniformity, the material has good comprehensive performance with being used as an electronic package material and a radiating substrate material, the thermal conductivity of the material can reach 700w / mk, the thermal expansion coefficient can be freely adjusted and is not less than 6.5*10<-6> m / l at a room temperature condition, and the density is higher than 99.9%.

Description

technical field [0001] The invention belongs to a preparation technology of a copper-based diamond composite material, in particular to a method for preparing a high-thermal conductivity diamond / copper composite material by hot isostatic pressing near-net shape. Background technique [0002] With the continuous improvement of chip integration, electronic packaging is developing in the direction of miniaturization, light weight and high performance, which makes the operating temperature of the circuit continue to rise, and the heating rate per unit volume of the system continues to increase, resulting in unstable system operation. In order to obtain stable performance, heat dissipation conditions must be improved, so the importance of electronic packaging in the field of microelectronics continues to increase, and the demand for new electronic packaging materials is also increasing. High-quality diamond is the material with the highest thermal conductivity known in the world,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/05C22C9/00
Inventor 柳成渊徐燕军刘一波尹翔郑勇翔孙延龙黄霞葛科
Owner BEIJING GANG YAN DIAMOND PROD CO
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