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High-dispersity polyimide/nanoparticle composite thin film and preparation method thereof

A nanoparticle and polyimide technology, which is applied in the field of highly dispersive polyimide/nanoparticle composite films and their preparation, can solve problems such as field limitations, and achieve excellent mechanical properties, good high temperature resistance, and good chemical properties. The effect of stability

Inactive Publication Date: 2017-01-04
QILU UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The difficulty of this method is to choose a co-solvent with good solubility properties, and the field of its application is also limited

Method used

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  • High-dispersity polyimide/nanoparticle composite thin film and preparation method thereof
  • High-dispersity polyimide/nanoparticle composite thin film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Add 0.20g of nano-barium titanate to 5.62g of the first-generation PAMAM solution, and ultrasonically disperse for 30min, such as figure 1 shown. Under nitrogen protection, 2.2248g of pyromellitic dianhydride and 2.0023g of 4,4'-diaminodiphenyl ether were added to 28.18g of N-methylpyrrolidone to form a solid content of 15% (wt / wt ) solution, and reacted in an ice-water bath for 24h to obtain an anhydride-terminated polyamic acid solution. Add 2.91 g of the first-generation PAMAM solution dispersed with nanobarium titanate particles into the above polyamic acid solution, ultrasonically disperse for several minutes, and continue to react for 12 hours to obtain a polyamic acid viscous solution. Take an appropriate amount of polyamic acid viscous liquid and pour it on a clean glass plate mold. Put the mold into a vacuum drying oven, dry in vacuum at 80° C. for 2 hours, and dry in vacuum at 150° C. for 2 hours to obtain a polyamic acid gel film. Continue to heat up to 20...

Embodiment 2

[0038]Add 0.3g of nano-silver particles into 5.45g of the second-generation PAMAM solution, and ultrasonically disperse for 40min. Under nitrogen protection, 2.2466g of pyromellitic dianhydride and 2.0023g of 4,4'-diaminodiphenyl ether were added to 42.49g of N,N-dimethylacetamide to form a solid content of 10%. (wt / wt) solution, and reacted in an ice-water bath for 23h to obtain an anhydride-terminated polyamic acid solution. Add 2.46 g of the second-generation PAMAM solution dispersed with nano-silver particles into the above polyamic acid solution, ultrasonically disperse for several minutes, and continue to react for 11 hours to obtain a polyamic acid viscous liquid. Take an appropriate amount of polyamic acid viscous liquid and pour it on a clean glass plate mold. Put the mold into a vacuum drying oven, dry in vacuum at 80°C for 2 hours, and dry in vacuum at 150°C for 2 hours, and remove the solvent to obtain a polyamic acid gel film. After continuing to heat up to 200°...

Embodiment 3

[0040] 0.40 g of nano-silica particles were added to 3.31 g of the third-generation PAMAM solution, and ultrasonically dispersed for 30 min. Under the protection of nitrogen, 2.2903g of pyromellitic dianhydride and 2.0023g of 4,4'-diaminodiphenyl ether were added to 28.62g of N,N-dimethylformamide to form a solid content of 15%. (wt / wt) solution, and reacted in an ice-water bath for 22h to obtain an anhydride-terminated polyamic acid solution. Add 1.95 g of the third-generation polyamide-amine solution dispersed with nano-silica to the above polyamic acid solution, ultrasonically disperse for several minutes, and continue to react for 13 hours to obtain a polyamic acid viscous liquid. Take an appropriate amount of polyamic acid viscous liquid and pour it on a clean glass plate mold. Put the mold into a vacuum drying oven, dry in vacuum at 80°C for 2 hours, and dry in vacuum at 150°C for 2 hours, and remove the solvent to obtain a polyamic acid gel film. After continuing to h...

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Abstract

The invention discloses a high-dispersity polyimide / nanoparticle composite thin film and a preparation method thereof. The preparation method comprises: uniformly mixing quantitative nanoparticles with a PAMAM (Polyamidoamine) dendrimer to obtain a mixed solution I; uniformly mixing an anhydride terminated polyamide acid solution with the mixed solution I and reacting to obtain a mixed solution II; carrying out film formation on the mixed solution II to obtain a polyamide acid gel film; furthermore, carrying out heating treatment on the polyamide acid gel film to cyclize polyamide acid into polyimide, so as to obtain the polyimide / nanoparticle composite thin film. By utilizing the preparation method provided by the invention, the nanoparticles are uniformly dispersed in a polyimide matrix. Furthermore, a tail end of the PAMAM dendrimer is connected with the polyamide acid through a chemical bond; the prepared polyimide / nanoparticle composite material has relatively good high temperature resistance and low temperature resistance, excellent mechanical properties and good chemical stability.

Description

technical field [0001] The invention relates to a highly dispersed polyimide / nano particle composite film and a preparation method thereof, belonging to the field of functional polymer materials. Background technique [0002] The development of science and technology puts forward new requirements for the performance of materials. As a new type of material, nanocomposite materials are being paid attention to by people. Polyimide is a polymer material with excellent performance. It has excellent high temperature resistance, low temperature resistance, radiation resistance, excellent mechanical properties and good chemical stability in a wide temperature range. Therefore, it is used in aerospace, It has a wide range of uses in the fields of microelectronics and electrical insulation. Combining polyimide with nanoparticles can obtain composite materials with better performance. [0003] The most critical issue in the preparation of polyimide / nanoparticle composites is the unif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/02C08K3/08C08K3/36C08K3/24
CPCC08J5/18C08J2379/02C08K3/08C08K3/24C08K3/36C08K2003/0806C08K2201/011C08L2201/08C08L2203/16C08L79/02
Inventor 韩文松
Owner QILU UNIV OF TECH
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