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Novel heat sink material

A heat sink material, a new type of technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of insufficient bonding between the wrapping layer and the substrate, poor mechanical properties, poor insulation, affecting thermal conductivity, etc., to achieve good mechanical properties, Excellent insulation and low thermal conductivity

Inactive Publication Date: 2016-12-07
黄宇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a new type of heat sink material to solve the problems of existing heat sink materials such as poor mechanical properties, poor insulation, low thermal conductivity, large expansion coefficient, insufficient bonding of the wrapping layer and the substrate, and affecting thermal conductivity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0070] The preparation method of the novel heat sink material comprises the following steps:

[0071] S1: the preparation of the matrix, including the following steps:

[0072] S11: Dissolve calcium carbonate and zirconia sol in water that is 6-8 times the total mass fraction of the sol, then add cellulose, soak for 6-7 hours, and then dry at 68-72°C until the water content is ≤8%. To obtain mixture I, mix and grind mixture I and dimethyl itaconate for 3-6 hours to obtain mixture II;

[0073] S12: Add graphite, yttrium oxide, aluminum nitride, silicon carbide, carbon nanotubes, silicon dioxide, bentonite, zinc oxide, light calcium, binder, coupling agent, compatibilizer, antioxidant, stabilizer, Bridging agent, regulator, strengthening agent, coagulant, toughening agent, stabilizer, terminator, 300-500 parts of water, microwave power 100-300W, temperature 650-700°C, speed 100-400r / Stir for 3-6 hours at 1 min, and then dry the resultant until the water content is ≤ 8%, to ob...

Embodiment 1

[0088] A new type of heat sink material, in units of weight, made of the following raw materials: 220 parts of the base, 12 parts of the wrapping layer;

[0089] The matrix is ​​made of the following raw materials in units of weight: 65 parts of graphite, 8 parts of yttrium oxide, 10 parts of aluminum nitride, 12 parts of silicon carbide, 6 parts of carbon nanotubes, 8 parts of silicon dioxide, and 3 parts of bentonite , 1.5 parts of zinc oxide, 2.5 parts of calcium carbonate, 5 parts of zirconia sol, 4 parts of light calcium, 12 parts of cellulose, 4 parts of dimethyl itaconate, 9 parts of binder, 1.5 parts of coupling agent, 1.5 parts of compatibilizer, 1.2 parts of antioxidant, 1.2 parts of stabilizer, 0.9 parts of bridging agent, 0.7 parts of regulator, 0.5 parts of strengthening agent, 0.5 parts of coagulant, 0.3 parts of toughening agent, 0.3 parts of stabilizer, termination 0.2 part of dose;

[0090] The coupling agent is an epoxy silane coupling agent;

[0091] Descr...

Embodiment 2

[0126] A new type of heat sink material, in units of weight, made of the following raw materials: 155 parts of the base, 9 parts of the wrapping layer;

[0127] The matrix is ​​made of the following raw materials in units of weight: 52 parts of graphite, 6 parts of yttrium oxide, 8 parts of aluminum nitride, 10 parts of silicon carbide, 4 parts of carbon nanotubes, 5 parts of silicon dioxide, and 2 parts of bentonite , 1 part of zinc oxide, 2 parts of calcium carbonate, 4 parts of zirconia sol, 3 parts of light calcium, 9 parts of cellulose, 3 parts of dimethyl itaconate, 5 parts of binder, 1 part of coupling agent, 1 part of compatibilizer, 0.8 part of antioxidant, 0.8 part of stabilizer, 0.6 part of bridging agent, 0.5 part of regulator, 0.4 part of strengthening agent, 0.4 part of coagulant, 0.2 part of toughening agent, 0.2 part of stabilizer, termination 0.1 part of dose;

[0128] The coupling agent is an epoxy silane coupling agent;

[0129] Described compatibilizer is...

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Abstract

The invention discloses a novel heat sink material, which is prepared from the following raw materials: a matrix and a wrapping layer, wherein the matrix is prepared from the following raw materials: graphite, yttrium oxide, aluminum nitride, silicon carbide, a carbon nanotube, silicon dioxide, bentonite, zinc oxide, calcium carbonate, zirconium dioxide sol, lightweight calcium, cellulose, dimethyl itaconate, a binder, a coupling agent, a compatilizer, an antioxidant, a stabilizing agent, a bridging agent, a regulator, an enhancer, a flocculation agent, a flexibilizer, a stabilizer and a terminating agent; and the wrapping layer is prepared from the following raw materials: a silicon carbide fiber, graphene, silicon dioxide, silicon carbide, sodium metasilicate, carboxymethyl cellulose sodium, an initiator, a cross-linking agent, a softening agent, a tackifier, a catalyst and a fire retardant. The prepared novel heat sink material has good mechanical property, excellent insulativity and thermal conductivity and a relatively low expansion coefficient, and can be widely applied to LED heat conduction and heat dissipation in a semiconductor technology.

Description

【Technical field】 [0001] The invention belongs to the technical field of electronic components and the technical field of heat sink material preparation, and in particular relates to a novel heat sink material. 【Background technique】 [0002] With the continuous improvement of semiconductor technology and manufacturing process, the luminous flux and luminous efficiency of LED have been continuously improved, and power LEDs have been widely used in daily life and industrial production. However, for high-power LEDs, the power density of the chip is high, and the large heat generation undoubtedly puts forward higher requirements for its heat dissipation materials. [0003] For the heat dissipation of traditional LED chips, a substrate (ie, heat sink material) is provided under the LED chip, and the bottom of the substrate is connected to the heat sink. The heat of the LED chip is conducted to the heat sink through the substrate, and then dissipated by the heat sink. [0004] I...

Claims

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Application Information

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IPC IPC(8): H01L33/64C08L1/02C08K13/04C08K7/10C08K3/04C08K3/22C08K3/28C08K3/34C08K7/24C08K3/36C08K3/26
CPCC08K2201/011C08L1/02H01L33/641C08L51/00C08K13/04C08K7/10C08K3/04C08K2003/2296C08K2003/282C08K3/34C08K3/346C08K7/24C08K3/36C08K2003/265
Inventor 黄宇
Owner 黄宇
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