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Processing method of large-sized sapphire ultrathin double-side-polished diaphragm

A technology of double-sided polishing and processing method, applied in stone processing equipment, surface-polished machine tools, metal processing equipment, etc., can solve the problems of easily broken pieces and low qualified rate of finished products, and achieve the effect of high qualified rate and convenient operation.

Active Publication Date: 2016-12-07
TUNGHSU GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Sapphire crystal has excellent optical properties, physical properties and stable chemical properties, and is widely used in high-brightness LED substrate materials, various optical components, and window materials. Because of its good radiation resistance, it is often used Optical component materials exposed to radiation in aerospace and consumer electronics such as smartphone displays, Home buttons, and camera protection covers; however, the double-sided grinding and double-sided polishing in the prior art can only process 2 inches~ 6-inch and thickness ≥ 0.30mm sapphire double-sided polished window, for low-thickness and large-sized sapphire double-sided polished window, there are defects such as low pass rate of finished products after polishing, and easy to break during the grinding process.

Method used

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  • Processing method of large-sized sapphire ultrathin double-side-polished diaphragm
  • Processing method of large-sized sapphire ultrathin double-side-polished diaphragm

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Experimental program
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Effect test

Embodiment 1

[0025] A large-size sapphire ultra-thin double-sided polishing window processing method, the method is as follows:

[0026] (1) Cut the sapphire ingot into a sapphire window with a thickness of 0.42mm with a diamond wire multi-wire slicer;

[0027] (2) The cut sapphire window is rounded to protect the edge, and the size of the rounded corner is R=0.20mm;

[0028] (3) Anneal the rounded sapphire window, press figure 1 The annealing curve is first heated to an annealing temperature of 1450°C and then kept for 6 hours. First, the temperature is lowered to 1130°C at a cooling rate of 80°C / h, then to 630°C at a cooling rate of 100°C / h, and then at a cooling rate of 120°C / h Cool down to 270°C, and finally cool down to room temperature naturally;

[0029] (4) The annealed sapphire window is subjected to double-sided rough grinding, the particle size of the ground boron carbide is W40, and the grinding removal amount is 0.12mm;

[0030] (5) Perform secondary annealing on the roughl...

Embodiment 2

[0036] A large-size sapphire ultra-thin double-sided polishing window processing method, the method is as follows:

[0037] (1) Cut the sapphire ingot into a sapphire window with a thickness of 0.45mm with a diamond wire multi-wire slicer;

[0038] (2) The cut sapphire window is rounded to protect the edge, and the size of the rounded corner is R=0.23mm;

[0039] (3) Anneal the rounded sapphire window, press figure 1 The annealing curve is first heated to an annealing temperature of 1450°C and then kept for 6 hours. First, the temperature is lowered to 1130°C at a cooling rate of 80°C / h, then to 630°C at a cooling rate of 100°C / h, and then at a cooling rate of 120°C / h Cool down to 270°C, and finally cool down to room temperature naturally;

[0040] (4) The annealed sapphire window is subjected to double-sided rough grinding, the particle size of the ground boron carbide is W40, and the grinding removal amount is 0.14mm;

[0041] (5) Perform secondary annealing on the roughl...

Embodiment 3

[0047] A large-size sapphire ultra-thin double-sided polishing window processing method, the method is as follows:

[0048] (1) Cut the sapphire ingot into a sapphire window with a thickness of 0.40mm with a diamond wire multi-wire slicer;

[0049] (2) The cut sapphire window is rounded to protect the edge, and the size of the rounded corner is R=0.18mm;

[0050] (3) Anneal the rounded sapphire window, press figure 1 The annealing curve is first heated to an annealing temperature of 1450°C and then kept for 6 hours. First, the temperature is lowered to 1130°C at a cooling rate of 80°C / h, then to 630°C at a cooling rate of 100°C / h, and then at a cooling rate of 120°C / h Cool down to 270°C, and finally cool down to room temperature naturally;

[0051](4) The annealed sapphire window is subjected to double-sided rough grinding, the particle size of the ground boron carbide is W40, and the grinding removal (thickness) is 0.13mm;

[0052] (5) Perform secondary annealing on the ro...

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Abstract

The invention relates to a processing method of a large-sized sapphire ultrathin double-side-polished diaphragm. The method comprises steps as follows: (1) a sapphire crystal bar is cut into a sapphire diaphragm; (2) smoothing treatment is performed to protect edges; (3) annealing processing is performed at the annealing temperature of 1,450 DEG C; (4) coarse grinding processing of double-side grinding is performed; (5) secondary annealing processing is performed at the annealing temperature of 1,600 DEG C; (6) fine grinding processing of double-side grinding is performed; (7) ultrasonic cleaning is performed; (8) polishing is performed by the aid of a silica sapphire polishing liquid in a double-side polishing machine; (9) the sapphire double-side-polished diaphragm is obtained through ultrasonic cleaning. The method has the characteristics that the method is convenient to operate, the first pass yield is high, no diaphragm breakage occurs in the grinding process and the like, and is applicable to processing of sapphire double-side-polished diaphragms which have diameters being 4 inches and 6 inches and thicknesses ranging from 0.20 mm to 0.25 mm.

Description

technical field [0001] The invention relates to a method for processing a large-size sapphire ultra-thin double-sided polishing window, and belongs to the technical field of double-sided grinding and double-sided polishing of sapphire window. Background technique [0002] Sapphire crystal has excellent optical properties, physical properties and stable chemical properties, and is widely used in high-brightness LED substrate materials, various optical components, and window materials. Because of its good radiation resistance, it is often used Optical component materials exposed to radiation in aerospace and consumer electronics such as smartphone displays, Home buttons, and camera protection covers; however, the double-sided grinding and double-sided polishing in the prior art can only process 2 inches~ 6-inch and thickness ≥ 0.30mm sapphire double-sided polished window, for low-thickness and large-sized sapphire double-sided polished window, there are defects such as low pas...

Claims

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Application Information

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IPC IPC(8): B24B37/08B24B29/02C30B33/02B08B3/12B28D5/04
CPCB08B3/12B24B29/02B24B37/08B28D5/04C30B33/02
Inventor 秦光临王禄宝孙敦陆
Owner TUNGHSU GRP
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