Novel heat sink material for semiconductors
A heat sink material, semiconductor technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of insufficient bonding between the wrapping layer and the substrate, poor mechanical properties, poor insulation, affecting thermal conductivity, etc., to achieve good mechanical properties, Excellent insulation and low thermal conductivity
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[0071] The preparation method of the novel semiconductor heat sink material comprises the following steps:
[0072] S1: the preparation of the matrix, including the following steps:
[0073] S11: Sodium carbonate and zirconium dioxide sol are dissolved in water 6-8 times the total mass fraction, then put into cellulose, soaked for 6-7 hours, and then dried at 68-72°C until the water content is ≤8%. To obtain mixture I, mix and grind mixture I and dimethyl itaconate for 3-6 hours to obtain mixture II;
[0074] S12: Graphite, alumina, aluminum nitride, silicon carbide, carbon nanotubes, silica, montmorillonite, zinc oxide, light calcium, binder, coupling agent, compatibilizer, antioxidant, stabilizer agent, bridging agent, regulator, strengthening agent, coagulant, toughening agent, stabilizer, terminator, 300-500 parts of water at a microwave power of 100-300W, a temperature of 650-700°C, and a speed of 100- Stir at 400r / min for 3-6h, then dry the resultant until the water co...
Embodiment 1
[0089] A new heat sink material for semiconductors, made of the following raw materials in units of weight: 220 parts of the substrate, 12 parts of the wrapping layer;
[0090] The matrix, in units of weight, is made of the following raw materials: 65 parts of graphite, 8 parts of aluminum oxide, 10 parts of aluminum nitride, 12 parts of silicon carbide, 6 parts of carbon nanotubes, 8 parts of silicon dioxide, montmorillonite 3 parts, 1.5 parts of zinc oxide, 2.5 parts of sodium carbonate, 5 parts of zirconia sol, 4 parts of light calcium, 12 parts of cellulose, 4 parts of dimethyl itaconate, 9 parts of binder, 1.5 parts of coupling agent 1.5 parts, compatibilizer, 1.2 parts of antioxidant, 1.2 parts of stabilizer, 0.9 parts of bridging agent, 0.7 parts of regulator, 0.5 parts of strengthening agent, 0.5 parts of coagulant, 0.3 parts of toughening agent, 0.3 parts of stabilizer , 0.2 parts of terminator;
[0091] The coupling agent is an epoxy silane coupling agent;
[0092]...
Embodiment 2
[0127] A new type of heat sink material for semiconductors, which is made of the following raw materials in units of weight: 152 parts of substrate, 9 parts of wrapping layer;
[0128] The matrix, in units of weight, is made of the following raw materials: 52 parts of graphite, 6 parts of aluminum oxide, 8 parts of aluminum nitride, 10 parts of silicon carbide, 4 parts of carbon nanotubes, 5 parts of silicon dioxide, montmorillonite 2 parts, 1 part of zinc oxide, 2 parts of sodium carbonate, 4 parts of zirconia sol, 3 parts of light calcium, 9 parts of cellulose, 3 parts of dimethyl itaconate, 5 parts of binder, 1 part of coupling agent 1 part, 1 part of compatibilizer, 0.8 part of antioxidant, 0.8 part of stabilizer, 0.6 part of bridging agent, 0.5 part of regulator, 0.4 part of strengthening agent, 0.4 part of coagulant, 0.2 part of toughening agent, 0.2 part of stabilizer , 0.1 part of terminator;
[0129] The coupling agent is an epoxy silane coupling agent;
[0130] Des...
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