Finish-ground super-hard sand wheel for micro drilling and manufacturing method thereof
A fine grinding and micro-drilling technology, used in bonded grinding wheels, grinding/polishing equipment, abrasives, etc., can solve the problems of low bonding force between the abrasive layer and the substrate, inability to fine-grinding micro-drilling tips, and low grinding wheel toughness. , to achieve the effect of reducing the trimming frequency, improving the yield and improving the quality
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Embodiment 1
[0034] Such as figure 1 As shown, the fine grinding superhard grinding wheel for micro-drilling in this embodiment includes a base 2 and an abrasive layer 1. The base is aluminum, and the abrasive layer is composed of the following components by weight: 30.15g polyamide PA1012, 30.15g polyimide, The polyimide uses the thermosetting polyimide resin powder shown in Table 1, 44g diamond with a particle size of M4 / 8, 80g silicon carbide with a particle size of M1 / 2, and 6g polytetrafluoroethylene with a particle size of ≤10μm (PTFE), 56g of cerium oxide with particle size ≤10μm.
[0035] The preparation method of the fine grinding super-hard grinding wheel for micro-drilling includes the following steps:
[0036] 1) Weigh the binder thermoplastic polyamide resin powder PA1012 and thermosetting polyimide resin powder, abrasive diamond powder, silicon carbide powder, and cerium oxide powder according to the above weight; mix the weighed raw materials, stir and grind and mix for 30 minute...
Embodiment 2
[0042] Such as figure 2 As shown, the fine grinding superhard grinding wheel for micro-drilling in this embodiment includes a base 4 and an abrasive layer 3. The base is aluminum, and the abrasive layer is composed of the following components by weight: 29.3g polyamide PA1012, 58.6g polyimide, The polyimide uses the thermosetting polyimide resin powder shown in Table 1, 88g diamond with a particle size of M2 / 4, 51.2g silicon carbide with a particle size of M0 / 1, 4.8g with a particle size of ≤10μm Polytetrafluoroethylene (PTFE), 44.8g of cerium oxide with a particle size ≤ 10μm.
[0043] The preparation method of the fine grinding super-hard grinding wheel for micro-drilling includes the following steps:
[0044] 1) Weigh the binder thermoplastic polyamide resin powder PA1012 and thermosetting polyimide resin powder, abrasive diamond powder, silicon carbide powder, and cerium oxide powder according to the above weight; mix the weighed raw materials, stir and grind and mix for 40 m...
Embodiment 3
[0050] The fine grinding super-hard grinding wheel for micro-drilling in this embodiment includes a substrate and an abrasive layer, the substrate is aluminum, and the abrasive layer is composed of the following components by weight: 15.2g polyamide PA1012, 45.6g polyimide, the polyimide Using the thermosetting polyimide resin powder shown in Table 1, 66g diamond with a particle size of M1 / 2, 67.2g silicon carbide with a particle size of M0 / 1, 4.8g polytetrafluoroethylene (PTFE) with a particle size ≤10μm, 33.6g of cerium oxide with particle size ≤10μm.
[0051] The preparation method of the fine grinding super-hard grinding wheel for micro-drilling includes the following steps:
[0052] 1) Weigh the binder thermoplastic polyamide resin powder PA1012 and thermosetting polyimide resin powder, abrasive diamond powder, silicon carbide powder, and cerium oxide powder according to the above weight; mix the weighed raw materials, stir evenly, and grind and mix for 35 minutes. Then sieve...
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