Flexible transparent film having novel electrode structure and preparation method flexible transparent film

Abstract

The present invention discloses a flexible transparent film having a novel electrode structure and a preparation method of the flexible transparent film. The flexible transparent film comprises a film body. A surface of the film body is provided with a groove etched by using a picosecond laser. The groove is filled with conductive ink. After being solidified, the conductive ink forms an electrode. During preparation, a film body is placed on a two-dimensionally movable platform first; then, a groove is etched on the film body by using an ultraviolet fiber laser; and then, conductive ink is input into the groove, so that after being solidified, the conductive ink forms an electrode. The flexible transparent film of the present invention is high in product yield; the shape, the width, and the depth of the electrode can be conveniently adjusted to meet use requirements of different film products; and the flexible transparent film is widely applicable. The process of the preparation method of the flexible transparent film is simplified; the preparation costs and the preparation time of the product are greatly reduced; the control during preparation is easy; and parameters of the products are easy to adjust, ensuring that the products can meet different use requirements.

Description

technical field [0001] The invention relates to a photoelectric functional device and a preparation method thereof, in particular to a flexible transparent film with a novel electrode structure and a preparation method thereof. Background technique [0002] Transparent conductive film means that the transmittance to visible light with a wavelength of 380-780nm is greater than 80%, and the resistivity is less than 10 -3 Ω·cm films have been widely used in the field of photoelectric functional devices. With the development of semiconductor technology, lightweight, foldable and flexible electronic devices, such as flexible solar cells, flexible displays, flexible touch screens and other new electronic devices have been developed and prepared. Among them, the preparation of electrodes on a flexible transparent substrate to form a flexible transparent conductive film layer is very important for the preparation of flexible devices. [0003] The traditional methods for preparing ...

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Problems solved by technology

In the process of preparing transparent conductive films, due to the poor high temperature resistance of the organic flexible substrate and the low glass transition temperature, it is easy to be damaged by ion bombardment and high temperature.

The crystallinity of the film obtained by the vacuum evaporation method is not good enough, and the adhesion to the substrate is small; when the transparent conductive electrode is prepared by the magnetron sputtering method, it is not easy to obtain a surface with high flatness; , etching and cleaning and other processes to pattern the transparent conductive film before it can be applied

At present, there are also products that add a transparent embossing adhesive layer on the substrate of the transparent film and then make an electrode structure, but it uses a combination of photolithography and micro-electroforming technology or diamond cutting and micro-electroforming technology, and the preparation process is relatively complicated. ; and this method introduces a layer of transparent embossing adhesive layer on the transparent film substrate, which reduces the light transmittance of the transparent conductive film to a certain extent

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