Preparation method of underwater LED lamp pouring sealant

A technology of LED lamps and potting glue, applied in the direction of adhesives, etc., can solve the problems of poor solvent resistance, achieve the effects of low cost, not easy to be poisoned, and improve adhesion and high temperature resistance stability

Active Publication Date: 2015-12-09
GOLOHO TECH CHANGZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silicone potting materials also have certain defects, such as poor mechanical properties, wear resistance, and solvent resistance

Method used

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  • Preparation method of underwater LED lamp pouring sealant
  • Preparation method of underwater LED lamp pouring sealant
  • Preparation method of underwater LED lamp pouring sealant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A preparation method for underwater LED lamp potting glue, said preparation method comprising:

[0029] S1: 20 parts by weight of 60% epoxyalkyl alkoxysilane, 10 parts of allyl triethoxysilane, 280 parts of methyliso Acetone, 5 parts of triethylamine, 60 parts of deionized water were added dropwise within 40 minutes under stirring at room temperature, hydrolysis and polycondensation reaction was carried out at reflux temperature of 60°C for 6 hours, the organic layer was separated, and 0.2wt% ammonium salt solution and deionized water were used to Wash and distill under reduced pressure at 80°C to obtain component A, a colorless, transparent viscous liquid;

[0030] S2: 20 parts by weight of phenyltrimethyloxysilane and 1 part of trifluoromethanesulfonic acid were added dropwise to 10 parts of deionized water within 20 minutes while stirring at room temperature, heated to reflux for 1 hour, and cooled to room temperature. Add toluene and water to wash, and distill unde...

Embodiment 2

[0034] A preparation method for underwater LED lamp potting glue, said preparation method comprising:

[0035] S1: 40 parts by weight of 3-functional chain segment fraction of 80% epoxyalkyl alkoxysilane, 15 parts of allyltriethoxysilane, 320 parts of methyliso Acetone, 10 parts of triethylamine, 80 parts of deionized water were added dropwise within 40 minutes under stirring at room temperature, hydrolyzed and polycondensed for 10 hours at reflux temperature of 80°C, the organic layer was separated, and 0.2wt% ammonium salt solution and deionized water were used to Wash and distill under reduced pressure at 120°C to obtain component A, a colorless, transparent viscous liquid;

[0036] S2: 40 parts by weight of phenyltrimethyloxysilane and 2 parts of trifluoromethanesulfonic acid were added dropwise to 20 parts of deionized water within 30 minutes while stirring at room temperature, heated to reflux for 2 hours, and cooled to room temperature. Add toluene and water to wash, a...

Embodiment 3

[0040]A preparation method for underwater LED lamp potting glue, said preparation method comprising:

[0041] S1: 30 parts by weight of 30 parts of epoxy alkyl alkoxysilane, 12 parts of allyl triethoxysilane, 300 parts of methyl iso Acetone, 8 parts of triethylamine, 70 parts of deionized water were added dropwise within 40 minutes under stirring at room temperature, and the hydrolysis and polycondensation reaction was carried out at reflux temperature of 70°C for 8 hours. Wash and distill under reduced pressure at 100°C to obtain component A, a colorless, transparent viscous liquid;

[0042] S2: 30 parts by weight of phenyltrimethyloxysilane and 1.5 parts of trifluoromethanesulfonic acid were added dropwise to 15 parts of deionized water within 25 minutes while stirring at room temperature, heated to reflux for 1.5 hours, and cooled to room temperature , add toluene and water to wash, and distill under reduced pressure at 70°C to obtain a Si-OH group-containing methylphenyls...

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Abstract

The invention discloses a preparation method of an underwater LED lamp pouring sealant. The method includes: firstly carrying out stiring hydrolysis condensation polymerization on multifunctional epoxy alkyl alkoxy silane, alkoxy silane, methyl isopropyl ketone and triethylamine, then performing pressure reduced distillation to obtain a component A; stirring phenyl trimethyloxysilane and trifluoromethanesulfonic acid at room temperature to obtain a methyl phenyl siloxane oligomer containing an Si-OH group, and mixing the oligomer with an Al catalyst and an azo compound to obtain a component B; and finally mixing the component A with the component B according to a weight ratio of 3:1-5:1 and stirring them evenly, carrying out decompression and bubble removal, and performing curing, thus obtaining the underwater LED lamp pouring sealant. The sealant for LED lamp packaging obtained by the method provided by the invention has good water proofness and high light transmittance, good adhesive power, toughness and plasticity, and can effectively improve the service life of LED lamps.

Description

technical field [0001] The invention relates to a preparation method of underwater potting glue. More specifically, the present invention relates to a preparation method for underwater LED lamp potting glue. Background technique [0002] Potting glue, also known as electronic glue, is a broad term. Used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. Only when the potting glue is completely cured can its use value be realized. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance, and shock resistance. With the expansion of the application range, higher requirements are put forward for the comprehensive performance of potting materials. [0003] At present...

Claims

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Application Information

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IPC IPC(8): C09J183/06C08G77/20C08G77/18C08G77/16C08G77/08
Inventor 董佳瑜董春保
Owner GOLOHO TECH CHANGZHOU CO LTD
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