Automatic solder mask exposure frame module and exposure machine

Abstract

The invention discloses an automatic solder-mask exposure table frame module and an exposure machine. The table frame module comprises an upper frame, upper glass, an upper negative plate, a circuit board, a lower negative plate (existing during double-sided exposure), a film medium, lower glass (double-sided exposure), a movable frame and a lower frame, wherein the movable frame is built on the lower frame; the lower glass is embedded into the movable frame; the film medium sleeves the lower glass and is embedded into the movable frame; the lower negative plate is put on the film medium; the upper negative plate is arranged on the circuit board; the upper glass is located above the upper negative plate; the upper frame is arranged above the upper glass; and various components have vacuum absorption structures. The automatic solder-mask exposure table frame module can be applied to automatic single-sided exposure and automatic double-sided exposure; positioning is carried out through the movable frame by supporting the circuit board; and the film medium is added between the circuit board (or the lower negative plate) and the lower glass, so that the capacity can be improved by 60%-80%. Due to the film medium, imprints of the negative plates can be prevented from being pressed on the circuit board during vacuum supply; the exposure accuracy can be improved when a glass plate is uneven or the circuit board warps; and the reject ratio is reduced.

Description

technical field [0001] The invention relates to the technical field of processing and manufacturing of electronic circuit boards, in particular to a module mechanism, an exposure machine and an alignment method in the circuit board solder mask exposure technology. Background technique [0002] With the development of electronic technology, the application of circuit boards (PCB / FPC, etc.) is becoming more and more extensive, and the technical requirements for its processing and manufacturing are getting higher and higher. Usually, circuit board exposure is an important process in the circuit board manufacturing process, which is divided into three cases: inner layer exposure, outer layer exposure and solder mask exposure. [0003] In the traditional technology, the direct contact between the upper and lower glass will lead to insufficient adsorption of each part, and when the vacuum is pumped, due to the direct contact between the circuit board and the film, it may press out...

AI Technical Summary

Problems solved by technology

[0003] In the traditional technology, the direct contact between the upper and lower glass will lead to insufficient adsorption of each part, and when the vacuum is pumped, due to the direct contact between the circuit board and the film, it may press out the imprint of the film, affecting the quality of the product and increasing the defect rate.

[0004] In addition, the fully automatic double-sided exposure machines currently on the market, in essence, add automatic flipping and alignment devices inside the single-sided exposure machine, which is not true double-sided simultaneous exposure, resulting in high cost and low efficiency. Shortcomings

At present, the main reason why double-sided simultaneous exposure cannot be implemented is that automatic alignment is not possible, because in the solder mask exposure process, the surface of the circuit board is coated with ink. Viscosity, after placing the circuit board between the upper and lower glass plates, it is basically impossible to move and align

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