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High-light-transmittance UV-moisture dual-curing adhesive

A UV-, dual-curing technology, applied in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of many by-products, increased cost, complicated operation, etc., to achieve good corrosion resistance, excellent adhesion. The effect of bonding and mechanical strength, good temperature resistance

Active Publication Date: 2015-11-25
深圳沃尔提莫电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the field of optical materials, or when a bonding structure with a transparent structure is required, the adhesive needs to have a higher refractive index and yellowing resistance. In the prior art, the introduction of halogen elements, heavy metal ions or sulfur atoms is often used. Functional groups increase the refractive index of organic polymers, but the introduction process of these functional groups is not only complicated to operate, but also increases the cost, and often has many by-products, which is not conducive to environmental friendliness

Method used

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  • High-light-transmittance UV-moisture dual-curing adhesive

Examples

Experimental program
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Embodiment 1

[0033] Mix hydroquinone monomethyl ether and diglycidyl phthalate evenly, heat to dissolve, raise the temperature to 85°C, add acrylic acid containing tetraethylammonium bromide dropwise, keep warm, and react until the acid value is less than 3mgKOH / g stops, and the epoxy acrylate monoester containing hydroxyl is obtained after the reaction is completed. N 2 Under a protective atmosphere, after dehydrating hexanediol, add isophorone diisocyanate containing dibutyltin dilaurate dropwise to it while stirring, heat to 60°C for 4 hours after the dropwise addition, and cool to room temperature after the reaction is completed. Obtain an isocyanate-terminated oligomer; then continue to add dropwise the prepared hydroxyl-containing epoxy acrylate monoester, after the dropwise addition, heat to 85°C for 3 hours, stop heating and lower the temperature; then carry out low-pressure distillation on the obtained product, After removing low-molecular substances, the required polyurethane p...

Embodiment 2

[0036] Mix hydroquinone monomethyl ether and diglycidyl phthalate evenly, heat to dissolve, raise the temperature to 90°C, add acrylic acid containing tetraethylammonium bromide dropwise, keep warm, and react until the acid value is less than 3mgKOH / g stops, and the epoxy acrylate monoester containing hydroxyl is obtained after the reaction is completed. N 2 Under a protective atmosphere, after dehydrating polyethylene glycol PEG-400, add isophorone diisocyanate containing dimethyltin diacetate dropwise to it while stirring, heat to 65°C for 4 hours after the dropwise addition, and the reaction is complete After cooling to room temperature, an isocyanate-terminated oligomer was obtained; then, the prepared hydroxyl-containing epoxy acrylate monoester was continued dropwise, and after the dropwise addition was completed, it was heated to 90°C for 3 hours, and the heating was stopped and the temperature was lowered; then the obtained The product is subjected to low-pressure di...

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Abstract

The invention provides a high-light-transmittance UV-moisture dual-curing adhesive. The high-light-transmittance UV-moisture dual-curing adhesive is prepared from, by weight, 30-70 parts of polyurethane prepolymer, 1-20 parts of reactive diluent, 1-10 parts of photoinitiator, 0.01-0.5 part of flatting agent, 0.1-1 part of polymerization inhibitor and 0.1-10 parts of silane coupling agent. The polyurethane prepolymer is synthesized by aliphatic series diisocyanate, dihydric alcohol or polyhydric alcohol and hydroxy containing epoxy monoacrylate, and the molar ratio of aliphatic series diisocyanate to dihydric alcohol or polyhydric alcohol to hydroxy epoxy monoacrylate is (1-1.2):1(0.5-0.8). According to the adhesive, fast curing after UV initiation can be achieved, a stable state of moisture curing non-initiation before UV initiation can be achieved, and good comprehensive performance is achieved.

Description

technical field [0001] The invention relates to the field of synthesis and preparation of polyurethane system adhesives, in particular to a UV-moisture dual-curing adhesive with high light transmittance. Background technique [0002] Ultraviolet (UV) curing technology is a high-tech curing technology with high efficiency, energy saving and environmental protection. Because of its advantages of fast curing, low energy consumption, high efficiency and no pollution, it has been widely used in adhesives. However, due to the existence of deep and The limitations of hard curing in the shadow area of ​​the object have led to the development of dual curing technology that combines UV curing and other curing methods, expanding the application field of UV curing systems. UV-moisture dual curing technology is one of them. Although most of this dual curing adhesive system is a crosslinking reaction initiated by UV, the curing reaction is compensated by moisture curing in the UV shadow a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J11/06C08G18/75C08G18/67C08G18/32
Inventor 何千舟
Owner 深圳沃尔提莫电子材料有限公司
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