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Brownification fluid for processing printed circuit board on basis of functionalized ionic liquid

A technology for printed circuit boards and ionic liquids, applied in the direction of metal material coating process, etc., can solve the problems of ecological environment and people's health hazards, destruction of blood circulation and respiratory function, eutrophication, etc., to achieve copper loading , good cycle performance, excellent heat resistance effect

Active Publication Date: 2015-09-23
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current conventional browning solution usually contains a large amount of substances such as triazole, copper ions, and pyrrole. Therefore, it is necessary to comprehensively treat the used browning solution. If the treatment fails to meet the discharge requirements, it will harm the ecological environment. cause great harm to people's health
In particular, organic sources such as azoles can easily lead to hypoxia and eutrophication in water bodies, and can cause cancer after being absorbed by the human body, and damage blood circulation and respiratory functions

Method used

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  • Brownification fluid for processing printed circuit board on basis of functionalized ionic liquid
  • Brownification fluid for processing printed circuit board on basis of functionalized ionic liquid
  • Brownification fluid for processing printed circuit board on basis of functionalized ionic liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The browning treatment process is to carry out copper surface treatment on the production board after the inner layer cutting, inner layer D / F, and inner layer etching board, and generate an oxide layer on the surface of the inner layer copper foil to improve the lamination of multilayer circuit boards. When the bonding force between copper foil and epoxy resin (common black oxidation and brown oxidation, etc.) process.

[0028] The technical route of browning process is as follows:

[0029] Picklingwater washing→alkaline degreasingwater washing→presoaking→browning→pure water washingdrying→pressing

[0030] The specific operation of the above technical route is as follows:

[0031] (1) Pickling: use 3%-5% dilute sulfuric acid as the cleaning agent, and wash away other metal impurities loaded on the copper surface at 30°C;

[0032] (2) Washing: Repeated washing with deionized water at room temperature until the lotion is basically neutral;

[0033] (3) Alkaline deg...

Embodiment 2

[0049]The difference of this embodiment, such as embodiment 1, is:

[0050] (1) Browning solution for printed circuit board processing based on functionalized ionic liquid, the raw material is composed of:

[0051] The concentration of concentrated sulfuric acid in the browning agent composition is 100g / L;

[0052] The hydrogen peroxide concentration is 15g / L;

[0053] The ionic liquid corrosion inhibitor is 1-methyl-4-hexylbenzimidazolium bromide, and its concentration is 10g / L;

[0054] The ionic liquid binding force accelerator is 1-methyl-4-butylpyridinium chloride salt, and its concentration is 1.0g / L.

[0055] (2) The browning temperature is 40°C, and the browning time is 50s.

[0056] After testing, the copper loading capacity of the obtained browning solution is 50g / L, and the copper surface after browning treatment can obtain a uniform and rough surface, and has stable bonding force and excellent heat resistance with the prepreg. Under the condition of 10s impact ...

Embodiment 3

[0058] The difference of this embodiment, such as embodiment 1, is:

[0059] (1) Browning solution for printed circuit board processing based on functionalized ionic liquid, the raw material is composed of:

[0060] The concentrated sulfuric acid concentration in the browning agent composition is 120g / L;

[0061] The hydrogen peroxide concentration is 20g / L;

[0062] The ionic liquid corrosion inhibitor is 1‐methyl‐4‐mercapto substituted ethylbenzimidazolium bromide, and its concentration is 12g / L;

[0063] The ionic liquid binding force accelerator is 1-methyl-4-butyl quaternary ammonium chloride salt, and its concentration is 1.5g / L.

[0064] (2) The browning temperature is 38°C, and the browning time is 50s.

[0065] According to the test, the copper loading capacity of the obtained browning solution can reach 58g / L, and the copper surface can obtain a uniform and rough surface after browning treatment, and has stable bonding force and excellent heat resistance with the ...

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Abstract

The invention discloses a brownification fluid for processing a printed circuit board on the basis of a functionalized ionic liquid. The brownification fluid is characterized by comprising raw materials by mass concentration as follows: sulfuric acid with the concentration of 80-120 g / L, hydrogen peroxide with the concentration of 5-25 g / L, an ionic liquid corrosion inhibitor with the concentration of 5-25 g / L and an ionic liquid binding force accelerant with the concentration of 0.5-5.0 g / L, wherein the ionic liquid corrosion inhibitor is an ionic liquid with alkyl or amino substituted benzimidazole as cations and halogen as anions. The copper loading capacity of the brownification fluid can reach 60 g / L, a uniform and coarse surface can be obtained after the copper surface is subjected to brownification processing, and the binding force between the copper surface and a prepreg is stable. The defects that haloid has to be added in a conventional brownification fluid and the like can be avoided by regulating the anions of the ionic liquid, and the brownificaiton fluid has remarkable environmental friendliness and excellence due to environment friendliness and non-volatility of the ionic liquid.

Description

technical field [0001] The invention relates to a browning treatment liquid, in particular to a browning treatment liquid for improving the bonding force between the copper surface of the inner layer and the prepreg during the production process of a printed circuit board (PCB) multilayer board; it belongs to the new Material development technology development and utilization field. Background technique [0002] With the continuous improvement of thinner and lighter requirements for electronic products, the HDI era of printed circuit boards has arrived, especially the use of Any-layer HDI technology to manufacture electronic products has been recognized by the market and welcomed by consumers. A typical case is that in recent years, the Apple series products manufactured by Any-layer HDI process have triggered an upsurge in the consumer electronics industry. At present, the application of Any‐Layer HDI technology in smart high-end mobile phones has been recognized by peers....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/52
Inventor 李雪辉龙金星刘彬云叶绍明王芙蓉于英豪王乐夫
Owner SOUTH CHINA UNIV OF TECH
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