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A special silicone adhesive for emi interface with high adhesion and high resilience

A high resilience and silicone technology, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problems of low rebound rate of glue, low bonding strength, heat resistance, etc. , to achieve good bonding effect, strong adhesion, excellent heat resistance

Active Publication Date: 2017-09-22
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies of the prior art and solve the defects of conventional glues such as low rebound rate, low bonding strength and heat resistance, the present invention provides a glue with higher rebound rate, higher strength and bonding performance, more Silicone adhesive with high heat resistance can meet the requirements of EMI electromagnetic shielding interface with high power, high frequency, high voltage and high current

Method used

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  • A special silicone adhesive for emi interface with high adhesion and high resilience
  • A special silicone adhesive for emi interface with high adhesion and high resilience
  • A special silicone adhesive for emi interface with high adhesion and high resilience

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] (1) Preparation of base paste:

[0049] At room temperature, weigh methyl vinyl polysiloxane resin, such as structural formula (1), where a=1.0, b=0.2, a+b=1.2, 20 parts, vinyl-terminated silicone oil, viscosity 10000mPa.S, 70 parts, fumed white carbon black TS530, 30 parts, 10 parts of dimethyldichlorosilane, kneaded at 120°C for 5h and took out, cooled to room temperature.

[0050] (2) Preparation of silicone adhesive:

[0051] At room temperature, add 91.8 parts of base paste, crosslinking agent, structural formula such as (3), wherein x is 0, y is 30, 5 parts, rebound rate control agent, such as structural formula (4), 1 part, adhesion promotion agent, such as structural formula (5), wherein x is 4, y is 4, 1 part, heat stabilizer, such as structural formula (6), wherein m is 2, n is 2, 1 part, 3-methyl-1-butyl Add 0.1 part of alkyne-3-ol into the double planetary high-speed disperser one by one, stir well for 1 hour, pay attention to temperature control (the temp...

Embodiment 2

[0053] (1) Preparation of base paste:

[0054] At room temperature, weigh methyl vinyl polysiloxane resin, such as structural formula (2), wherein a=0.2, b=0.2, c=0.2, d=0.2, a+b+c+d=0.8, 10 parts, vinyl-terminated silicone oil, viscosity 100000mPa.S, 60 parts, fumed silica R974, 20 parts, 5 parts of octamethylcyclotetrasiloxane, knead at 120°C for 5h and take it out, cool to room temperature .

[0055](2) Preparation of silicone adhesive:

[0056] At room temperature, add 64 parts of base paste, crosslinking agent, structural formula such as (3), wherein x is 10, y is 10, 20 parts, rebound rate control agent, such as structural formula (4), 5 parts, adhesion promotion Agent, such as structural formula (5), wherein x is 10, y is 10, 5 parts, heat stabilizer, such as structural formula (6), wherein m is 6, n is 6, 5 parts, ethynyl cyclohexanol, 0.5 parts , in turn into the double planetary high-speed disperser, fully stirred for 1 hour, pay attention to temperature control (...

Embodiment 3

[0058] (1) Preparation of base paste:

[0059] At room temperature, weigh methyl vinyl polysiloxane resin, such as structural formula (1), wherein a=0.4, b=0.3, a+b=0.7, 7 parts, methyl vinyl polysiloxane resin , such as structural formula (2), where a=0.4, b=0.3, c=0.4, d=0.1, a+b+c+d=1.2, 7 parts, vinyl-terminated silicone oil, viscosity 50000mPa.S, 65 parts , Fumed silica R972, 25 parts, 7 parts of dimethyldichlorosilane, kneaded at 120°C for 5h and taken out, cooled to room temperature.

[0060] (2) Preparation of silicone adhesive:

[0061] At room temperature, add 74.4 parts of base paste, crosslinking agent, the structural formula is as (3), where x is 6, y is 20,, 8 parts, the hydrogen content of hydrogen-containing silicone resin is 0.8wt%, 8 parts, the rebound rate Control agent, such as structural formula (4), 3 parts, adhesion promoter, such as structural formula (5), wherein x is 6, y is 6, 3 parts, thermal stabilizer, such as structural formula (6), wherein m i...

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Abstract

A special silicone adhesive for EMI interface with high adhesion and high resilience, which is a one-component heat-curing adhesive, including: 64-91.8 parts of base paste, 5-20 parts of cross-linking agent, rebound rate 1-5 parts of control agent, 1-5 parts of adhesion promoter, 1-5 parts of heat stabilizer, 0.1-0.5 parts of catalyst, and 0.1-0.5 parts of inhibitor. The organosilicon adhesive prepared by the present invention has a high rate of resilience retention, and can maintain a relatively good rate of resilience after double 85, 1000h, high strength, and strong adhesion. It is suitable for aluminum substrates, ceramic substrates, galvanized The substrate has good bonding strength, high temperature bonding and bonding after aging maintain a relatively good bonding effect, and the heat resistance is very excellent.

Description

technical field [0001] The invention relates to the technical field of new materials for EMI interfaces, in particular to a special organic silicon adhesive for EMI interfaces with high adhesion and high resilience. Background technique [0002] EMI (Electromagnetic Interference) is the English abbreviation of electromagnetic shielding, which refers to the interference of electronic components to the outside world. Large electrical equipment workstations will radiate a large number of electromagnetic waves of different wavelengths and frequencies, which will cause electromagnetic interference to existing small and sophisticated electronic components, affect the normal use of electronic products, and even cause leaks. [0003] At present, the substrates of electromagnetic shielding materials are mostly natural rubber, styrene-butadiene rubber, EPDM, etc., but their weather resistance and aging resistance are relatively poor, and there are basically no such materials on alumin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J11/08C09J11/06C09J11/04
Inventor 陈维张丽娅张京科王建斌陈田安
Owner YANTAI DARBOND TECH
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