Buried and embedded copper block PCB manufacturing method

Abstract

The invention discloses a buried and embedded copper block PCB manufacturing method, which comprises steps of laminating treatment of a buried copper block, groove milling, gold immersion, laminating treatment of an embedded copper block and the like. The step of lamination of the buried copper block comprises a buried copper block lamination pre-treatment process. The buried copper block lamination pre-treatment process comprises groove treatment on the edge of the bottom part of the copper block, round corner treatment on the edge of the copper block, and chamfer treatment on the edge corner of the copper block. The step of lamination of the embedded copper block comprises an embedded copper block lamination pre-treatment process, which comprises groove treatment on the edge of the bottom part of a groove hole into which the copper block needs to be embedded, round corner treatment on the edge of the groove hole into which the copper block needs to be embedded and chamfer treatment on the edge corner of the groove hole into which the copper block needs to be embedded. The buried and embedded copper block PCB manufacturing method has the advantages of high product yield, high production efficiency, good quality consistency and simple operation.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing and processing, in particular to a method for manufacturing a PCB board embedded with copper blocks. Background technique [0002] In the current manufacturing method of embedding copper block PCB boards, there are the following problems: [0003] In the lamination of buried copper blocks, due to the limitation of design accuracy, there is a certain difference in thickness between the buried copper block and the PCB board (such as height deviation or tolerance required by the customer), so that the edge of the buried copper block and the PCB board form a step. With the existence of such a step, there is glue overflow at the step position during pressing. At present, the abrasive belt is generally used to remove the resin glue, but due to the unevenness of the step position, the resin at the step position cannot be effectively removed. If more abrasive belt grinding times are u...

AI Technical Summary

Problems solved by technology

At present, the abrasive belt is generally used to remove the resin glue, but due to the unevenness of the step position, the resin at the step position cannot be effectively removed. If more abrasive belt grinding times are used to effectively remove the resin glue, the PCB board will face exposed substrates. Bad question

[0004] In terms of the pressing of the embedded copper block, in order to ensure the tightness of the pressing, the size of the copper block is generally slightly larger than the position of the PCB notch during the design process of the embedded copper block, and accordingly the copper block is punched in by using the stamping equipment. Because the size of the copper block in the PCB board slot is larger than that of the PCB board slot, the copper block cannot be effectively positioned and is easy to shift; and the stamping equipment cannot apply pressure evenly, which is likely to cause damage to the PCB board, and only prototypes can be produced, and batch production cannot be done.

In addition, if the copper block is shifted and oversized during the embedding process, the size of the gap between the copper block and the PCB slot will be different, and it will not be possible to plug the fine and small holes in the subsequent solder mask, and it is easy to hide air bubbles , affect the quality of the product, and also increase the production risk of the enterprise