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Silicon-containing polyimide copper-clad plate and preparation method thereof

The technology of silicon polyimide and silicon polyimide resin is applied in the field of silicon-containing polyimide copper clad laminate and its preparation, which can solve the problems of less than aromatic heterocyclic polymer systems, low heat resistance, It can not meet the problems of high temperature application and other problems, and achieve the effects of excellent electrical and mechanical properties, high temperature resistance and low cost.

Inactive Publication Date: 2015-08-19
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, epoxy resin systems also have some problems, such as low heat resistance, far inferior to aromatic heterocyclic polymer systems (such as polyimide, polybenzimidazole, polybenzoxazole, polyphenylquinone, etc.) Oxaline, polybenzothiazole, etc.), cannot meet the application under high temperature conditions

Method used

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  • Silicon-containing polyimide copper-clad plate and preparation method thereof
  • Silicon-containing polyimide copper-clad plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] 988 grams (1 mole) of silicone diamine (average molecular weight is 988), 3500 grams of N-methyl-2- Pyril Rolidone and 600 grams of tetrahydrofuran were put into the reaction kettle, after stirring and dissolving at room temperature, 1041 grams (2 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride were added , stirred and reacted at room temperature for 2 hours, added 800 grams of toluene, heated to reflux and separated water for 3 hours to obtain 6929 grams of component A, which was designated as A-1.

Embodiment 2

[0041] 1284 grams (1 mole) of silicone diamine (average molecular weight is 1284), 3700 grams of N-methyl-2- Pyril Rolidone and 4000 grams of methyl tetrahydrofuran were put into the reaction kettle, and after stirring and dissolving at room temperature, 558.4 grams (1.8 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride and 104.1 grams (0.2 moles ) 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, stirred and reacted at room temperature for 1 hour, added 770 grams of toluene, heated and refluxed for 5 hours to separate water, and obtained 10416.5 grams A component, denoted as A-2.

Embodiment 3

[0043] 584 grams (2 moles) of 1,3-bis(3-aminophenoxy)benzene, 4000 grams of N,N-dimethylacetamide and 1850 grams of N-methyl-2- Pyril Put rolidone into the reaction kettle, stir and dissolve at room temperature, cool to below 1°C, add 558.4 grams (1.8 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride and 29.4 grams (0.3 mol) maleic anhydride, stirred and reacted at 1° C. for 2 hours to obtain 7021.8 grams of component B, denoted as B-1.

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Abstract

The invention relates to a silicon-containing polyimide copper-clad plate and a preparation method thereof. The silicon-containing polyimide copper-clad plate is composed of a copper foil, an alkali-free glass cloth and silicon-containing polyimide resin. The preparation method comprises the steps of: putting organosilicon diamine and an organic solvent into a reaction kettle, conducting stirring dissolving, then adding aromatic dianhydride, adding an azeotropic dehydrating agent, carrying out heating reflux water diversion reaction to obtain a component A; putting aromatic diamine and a strong polar aprotic organic solvent into the reaction kettle, conducting stirring dissolving, adding aromatic dianhydride and maleic anhydride, and carrying out stirring reaction to obtain a component B; subjecting the component A and component B to stirring reaction at room temperature so as to obtain silicon-containing polyimide resin; using a gluing machine to dip silicon-containing polyimide resin, removing the solvent to obtain a prepreg, conducting cutting and lamination, laying copper foil, and carrying out heating pressurization curing, thus obtaining the silicon-containing polyimide copper-clad plate. The silicon-containing polyimide copper-clad plate has good electrical properties, mechanical properties, and high temperature resistance, etc. The operation process is simple, and the product has excellent comprehensive performance and has broad market prospects.

Description

technical field [0001] The invention belongs to the field of matrix resin composite materials, and in particular relates to a silicon-containing polyimide copper clad board and a preparation method thereof. Background technique [0002] Copper clad laminate technology and production have experienced more than half a century of development history. Now it has become an important part of basic materials in electronic information products. Copper-clad laminate manufacturing is a sunrise industry, and it has broad prospects along with the development of electronic information and communication industries. Copper clad laminate manufacturing technology is a multidisciplinary technology with high technology. The development of electronics industry technology in the past century shows that copper clad laminate technology is often one of the key aspects to promote the development of the electronics industry. Its progress and development are constantly driven by the innovation and ...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C08K7/14B32B15/08B32B15/20B32B27/04B32B27/28B32B37/06B32B37/10
Inventor 虞鑫海陈戚周志伟
Owner DONGHUA UNIV
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