Electrolytic copper foil surface treatment method
A technology of surface treatment and electrolytic copper foil, which is applied in the direction of metal material coating process, etc.
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Embodiment example 1
[0022] The traditional post-processing machine processes 9 micron double-sided photoelectrolytic copper foil, and the passivation solution component is Zn 2+ 50 g / L, Ni 2+ 5.0g / L; sodium dihydrogen phosphate 1.0g / L; 1-phenyl-5-mercaptotetrazolium (PMTA) 3.0g / L; sodium citrate 60 g / L; pH value: 3.5~5.5, current density 0.5A / dm 2 ; Processing copper foil line speed 30m / min.
Embodiment example 2
[0024] The one-piece machine processes 9 micron double-sided photoelectrolytic copper foil, and the passivation solution component is Zn 2+ 30 g / L, Ni 2+ 3.0g / L; sodium dihydrogen phosphate 1.0g / L; 1-phenyl-5-mercaptotetrazolium (PMTA) 2.0g / L; sodium citrate 60 g / L; pH value: 3.5~5.5, current density 0.3 A / dm 2 ; Processing copper foil line speed 6.0m / min.
Embodiment example 3
[0026] One-piece machine processing ultra-thin 7 micron double-sided photoelectrolytic copper foil, the passivation solution component is Zn 2+ 30 g / L, Ni 2+ 3.0g / L; sodium dihydrogen phosphate 1.0g / L; 1-phenyl-5-mercaptotetrazolium (PMTA) 2.0g / L; sodium citrate 60 g / L; pH value: 3.5~5.5, current density 0.3 A / dm 2 ; Processing copper foil line speed 6.8m / min.
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