Photosensitizer-free photoresist composition used in glass passivated rectifier chip (GPRC) technology
A photoresist and photosensitizer technology, which is applied in the direction of photosensitive materials used in opto-mechanical equipment, etc., can solve the problems of affecting the subsequent glass printing process, prone to bending and collapse, and unable to reduce the resistance to hydrofluoric acid and nitric acid etching solution.
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[0024] In the photoresist that does not add photosensitizer in the present invention, the xylene solution of cyclization rubber, its preferred mass percentage is within 25~35%, preferred mass percentage content can obtain preferably viscosity and Film thickness conditions, mass percent lower than 25% or higher than 35%, are not suitable as photoresist compositions. Wherein, when the molecular weight of the cyclized rubber is 55±0.5 million and the cyclization rate is controlled at 62±1%, the photoresist has good corrosion resistance in the corrosive solution of hydrofluoric acid and nitric acid system.
[0025] Nano-scale 1,1,1-tris(4-hydroxyphenyl)ethane, as an additive of photoresist composition, its mass percentage is within 1~5%, and the compatibility with cyclized rubber is better, at the same time It is helpful to improve the flexibility of the photoresist layer. If the mass fraction is lower than 1%, the effect of improving flexibility cannot be achieved, and if it is ...
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