A liquid photosensitive dark solder resist material and its preparation method
A liquid, dark-colored technology, applied in the field of circuit board materials, can solve the problems that the heat resistance is difficult to meet the user's requirements, the solder mask layer is easy to become brittle, and the scrap rate increases, so as to solve the problems of poor bridge protection performance, excellent performance, Reasonable formula effect
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Embodiment 1
[0020] The production method of the photosensitive resin described in this example is: dissolve 200 parts of silicone-modified novolac epoxy resin in 199.5-220 parts of solvent in a reaction vessel, heat to 80°C to dissolve, and add unsaturated mono 90 parts of carboxylic acid methacrylic acid, 1.5 parts of N,N-dimethylbenzylamine, 80 parts of toluene, and 1 part of concentrated sulfuric acid, heated to 100°C-120°C for about 12 hours, refluxed for dehydration, distilled to remove toluene, then added 70.5-135 parts of acid anhydride, heated to 110°C to 130°C, and reacted for 10 hours to obtain a photosensitive resin with an acid value of 60mgKOH / g to 75mgKOH / g and a solid content of 70%.
Embodiment 2
[0022] For the liquid photosensitive dark solder resist material described in this embodiment, take the following components according to the weight ratio, take 55 parts of photosensitive resin made by the method in Example 1, and 40 parts of trisphenol methane triglycidyl ether epoxy resin , 20 parts of barium sulfate, 1 part of phthalocyanine green, 0.5 parts of dicyandiamide, 10 parts of polydipentaerythritol hexaacrylate, 0.5 parts of additives, 6.5 parts of ethylene glycol monoethyl ether acetate, put the above substances under the high-speed disperser Disperse evenly, then grind on a three-roller machine to a fineness of ≤ 20 μm, and finally adjust the viscosity to 65 ps with 6 parts of ethylene glycol monoethyl ether acetate to obtain the new photosensitive resin liquid photosensitive solder resist material of the present invention. The performance test results are as follows:
[0023] Pre-baking (75°C): 40 minutes
[0024] Exposure: 330mJ / cm2
[0025] Exposure Level:...
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