High-efficiency street lamp flip-chip cob light source and its production process

Abstract

The invention discloses a crystal-coated COB (chip on board) light source with high luminous efficiency for a streetlamp and a production process for the crystal-coated COB light source. The COB light source comprises a red copper heat dissipation base plate, a lens, an aluminum oxide ceramic bracket and an inverted chip, wherein the inverted chip coats a solid crystal region of the aluminum oxide ceramic bracket through a eutectic furnace under the protection of a hydrogen gas atmosphere; the aluminum oxide ceramic bracket is fixed on a sunken table of the read copper heat dissipation base plate by adopting a reflux welding mode; the lens comprises an extending side part which is upwards turned over and an upwards bumped lens part in the shape of an oval hemispheric peanut; the lens is fixed on the red copper heat dissipation base plate through glue with high light transmittance, and the lens and the red copper heat dissipation base plate are enclosed to form a cavity; the aluminum oxide ceramic bracket which is coated with the inverted chip is fixed in the cavity, and a groove is positioned above a fluorescent powder region of the aluminum oxide ceramic bracket; and a gold-tin alloy with high heat conduction coats the bottom of the inverted chip. The production process for the crystal-coated COB light source with high luminous efficiency for the streetlamp is advanced and high in production efficiency; the obtained product has the advantages of high luminous efficiency, high light transmittance, good light gathering property, excellent heat dissipation, and the like.

Description

technical field [0001] The invention relates to the field of lighting technology, in particular to a flip-chip COB light source for street lamps with high light efficiency and a production process thereof. Background technique [0002] At present, most of the street lighting light source products used in the market are high-pressure sodium lamps, and a small part are solid-state LED lighting light source products produced by the traditional process of directly bonding crystals and welding wires on aluminum substrate brackets, copper substrate brackets or ceramic substrate brackets. . Because most ordinary LED light sources need to use insulating glue or silver glue to bond the die, their thermal resistance is generally 12°C / W, which is relatively high, and there is a big problem in the heat dissipation of the light source. In addition, the LED light source made by the traditional wire welding process cannot withstand a large pulse current, let alone work stably for a long t...

AI Technical Summary

Problems solved by technology

[0004] 1. The waterproof and anti-vibration stability of the light source;

[0005] 2. The use of the light source terminal should choose the secondary light distribution lens and waterproof sealant;

[0006] 3. The luminous efficiency of the light source is low and the problem of yellow circles is generated;

[0007] 4. Poor overall heat dissipation of the light source;

[0008] 5. The problem of thermoelectric separation between the chip and the bracket;

[0009] 6. Poor air tightness of the product;

[0010] 7. The thermal expansion coefficient of the chip, silver glue and bracket is inconsistent;

[0012] 9. The problem that the light source cannot withstand long-term high current and stable work

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